Conductive adhesive film techniques

• US 5,221,417 A
• Filed: 02/20/1992
• Issued: 06/22/1993
• Est. Priority Date: 02/20/1992
• Status: Expired due to Term

• Current Assignee: American Telephone & Telegraph Company (AT&T, Inc.)
• Original Assignee: AT&T, Inc.
• Inventors: Basavanhally, Nagesh R.
• Primary Examiner(s): DANG, THI D
• Application Number:
  US07/838,650
• Time in Patent Office: 488 Days
• Field of Search: 156/629, 156/659.1, 156/901, 156/625, 156/52, 156/300, 156/306.6, 174/117 A, 264/24, 264/272.11, 264/272.15, 264/272.13, 264/279.1
• US Class Current: 216/22
• CPC Class Codes: C09J 7/10 without carriers
• CPC Class Codes: H01R 4/04 using electrically conductive adhesives
• CPC Class Codes: H05K 2201/083 Magnetic materials
• CPC Class Codes: H05K 2203/104 Using magnetic force, e.g. to align particles or for a temporary connection during processing
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: Y10T 156/1093 with covering of discrete laminae with additional lamina

Abstract

In one embodiment of the invention, photolithographic masking and etching is used to form a matrix array of mutually isolated ferromagnetic elements (25'"'"'). The elements are magnetized and a single layer of conductive ferromagnetic particles (33) is adhered to an upper surface of each of the ferromagnetic elements. The layer of particles is contacted with a layer of soft adhesive polymer (36) to cause penetration of the particles into the polymer. The adhesive polymer is then hardened to assure containment of the particles in the polymer. The hardened adhesive polymer is removed and located between the first and second conductor arrays (40-43) that is to be interconnected; for example, it is located between the bonding pads (43) of a chip (42) and the bonding pads (40) of a substrate (39) to which the chip is to be connected. The adhesive polymer is then softened by heating and compressed between the first and second conductor arrays to cause it to adhere to the conductor arrays and to interconnect them and is thereafter hardened to form a unified structure.

Claims

1. A method for interconnecting a first conductor array of an electronic device to a second conductor array of a first substrate comprising the steps of:

using photolithographic masking and etching to form a matrix array of mutually isolated ferromagnetic elements;

magnetizing the ferromagnetic elements;

causing a layer of ferromagnetic conductive particles to adhere to an upper surface of each of the ferromagnetic elements;

contacting the layer of particles with a layer of softened adhesive to cause penetration of the particles into the adhesive;

hardening the adhesive to cause containment of the particles therein;

removing the hardened adhesive containing the particles and locating it between the first and second conductor arrays;

softening the adhesive and compressing the adhesive between the first and second conductor arrays, thereby to cause it to adhere to the conductor arrays and causing individual particles to make simultaneous contact with conductors of the first and second conductor arrays to interconnect the electronic device to the first substrate.

2. The method of claim 1 wherein:

the step of causing the layer of ferromagnetic conductive particles to adhere to upper surfaces of the ferromagnetic elements comprises the step of assuring that only a single layer of the ferromagnetic particles is formed on the surfaces.

3. The method of claim 1 wherein:

the first and second conductor arrays respectively comprise first and second arrays of bonding pads that are interconnected by the adhesive;

and each bonding pad of the first and second arrays has length and width dimensions of less than one hundred fifth microns.

4. The method of claim 3 wherein:

each of the ferromagnetic elements has length and width dimensions of less than seventy microns.

5. The method of claim 4 wherein:

each of the ferromagnetic particles has a diameter of less than about twenty-five microns.

6. The method of claim 5 wherein:

the adhesive that adheres to the first and second arrays of bonding pads is a polymer having a thickness of less than about twenty-five microns.

7. The method of claim 1 wherein the means for forming a matrix array of mutually isolated ferromagnetic elements comprises the steps of:

forming a ferromagnetic layer on a second substrate;

forming over the ferromagnetic layer a photosensitive layer;

selectively exposing the photosensitive layer to light;

selectively etching the photosensitive layer to form a mask;

and using the mask to selectively etch the ferromagnetic layer, thereby to form the ferromagnetic elements.

8. The method of claim 1 wherein the method of forming the matrix array of mutually isolated ferromagnetic elements comprises the steps of:

forming on a second substrate a photosensitive layer;

selectively exposing the photosensitive layer to light;

selectively etching the photosensitive layer to form a mask;

and using the mask to selectively plate ferromagnetic material on the second substrate, thereby to form the ferromagnetic elements.

9. The method of claim 1 further comprising the step of:

during the adherence of the ferromagnetic conductive particles to an upper surface of each of the ferromagnetic elements, forcing a planar member downwardly onto the upper surface of the conductive particles, thereby to force the conductive particles to distribute as a single layer on the upper surface of each of the ferromagnetic elements.

10. A method for interconnecting a first bonding pad array of an electronic device to a second bonding pad array of a first substrate comprising the steps of:

distributing on an upper surface of a first body an array of mutually isolated groups of conductive particles, each group containing a plurality of conductive particles arranged as a single layer;

contacting the layer of particles with a layer of softened adhesive to cause penetration of the particles into the adhesive;

hardening the adhesive, thereby to cause containment of the particles in the adhesive;

removing the hardened adhesive containing the particles and locating it between the first and second bonding pad arrays;

softening the adhesive and compressing the adhesive between the first and second bonding pad arrays, thereby causing it to bond together matching bonding pads and causing individual particles to make simultaneous contact with matching bonding pads on the first and second arrays to interconnect the electronic device to the first substrate.

11. The method of claim 10 wherein:

each of the bonding pads of the first array has an area A;

and each of the groups of conductive particles constitutes an area which is less than 0.5 A.

12. The method of claim 11 wherein:

the step of forming the groups of particles comprises the step of forming a matrix array of ferromagnetic elements and wherein the conductive particles are ferromagnetic conductive particles caused to adhere to the upper surface of each of the ferromagnetic elements.

13. The method of claim 11 wherein:

each bonding pad of the first and second array has length and width dimensions of less than one hundred fifty microns.

16. The method of claim 13 further comprising the step of:

during the adherence of the ferromagnetic conductive particles to an upper surface of each of the magnetized elements, forcing a planar member downwardly onto the upper surface of the conductive particles, thereby to force the conductive particles to distribute as a single layer on the upper surface of each of the magnetized elements.

14. A method for making anisotropic conductive material comprising the steps of:

using photolithographic masking and etching to form a matrix array of mutually isolated magnetized elements;

causing a layer of ferromagnetic particles to adhere to an upper surface of each of the magnetized elements;

contacting the layer of particles with a layer of softened insulative material to cause penetration of the particles into the insulative material;

hardening the insulative material to cause containment of the particles therein;

and removing the hardened insulative material containing the particles.

15. The method of claim 14 wherein:

the insulative material is a material that is adhesive when it is softened.

17. The method of claim 14 wherein the method of forming the matrix array of mutually isolated magnetized elements comprises the steps of:

forming on a second substrate a photosensitive layer;

selectively exposing the photosensitive layer to light;

selectively etching the photosensitive layer to form a mask;

using the mask to selectively plate photomagnetic material on the second substrate, thereby to form ferromagnetic elements;

and magnetizing the ferromagnetic elements.