Vacuum processing apparatus

• US 5,223,001 A
• Filed: 11/19/1992
• Issued: 06/29/1993
• Est. Priority Date: 11/21/1991
• Status: Expired due to Fees

• Current Assignee: Tokyo Electron Kabushiki Kaisha
• Original Assignee: Tokyo Electron Kabushiki Kaisha
• Inventors: Saeki, Hiroaki
• Primary Examiner(s): BUEKER, RICHARD R
• Application Number:
  US07/978,750
• Time in Patent Office: 222 Days
• Field of Search: 29/25.01, 204/298.25, 156/345, 118/719, 414/217
• US Class Current: 29/25.01
• CPC Class Codes: C23C 14/566 using a load-lock chamber
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: H01L 21/67751 vertical transfer of a single workpiece

Abstract

The present invention is a vacuum processing apparatus provided with a vacuum processing chamber which implements a required processing to an object of processing, and a pre-vacuum chamber (load-lock chamber) configured so that it can be internally vacuum exhausted, with an object of processing being carried-in and -out of the vacuum processing chamber via the pre-vacuum chamber, in which a small space which can be airtightly sealed is provided inside the pre-vacuum chamber, so that the object of processing can be temporarily withdrawn into and housed in the small space when there is vacuum exhaust from the pre-vacuum chamber and when there is the introduction of air to the pre-vacuum chamber. Thus, it is possible to prevent the adhesion to the processing object of particles which rise when air is introduced to the load-lock chamber and when air is exhausted from the load-lock chamber, and without having to perform slow exhaust and slow venting, while increases the throughput and the yield at the same time.

Claims

1. A vacuum processing apparatus provided with a vacuum processing chamber which implements a required processing to an object of processing, and a pre-vacuum chamber configured so that it can be internally vacuum exhausted, with an object of processing being carried-in and -out of the vacuum processing chamber via the pre-vacuum chamber,

said vacuum processing apparatus comprising a small space which can be airtightly sealed is provided inside said pre-vacuum chamber, so that the object of processing can be temporarily housed into said small space when there is vacuum exhaust from said pre-vacuum chamber and when there is the introduction of air to said pre-vacuum chamber.

2. The vacuum processing apparatus of claim 1, wherein said small space is provided to an upper portion of said pre-vacuum chamber.

3. The vacuum processing apparatus of claim 1, wherein an exhaust pipe and a gas introduction pipe are connected to said small space.

4. The vacuum processing apparatus of claim 1, wherein a carrying-in and a carrying-out opening of said vacuum processing chamber are respectively provided with said pre-vacuum chambers.

5. The vacuum processing apparatus of claim 1, wherein a gas flow passage connects said small space and said pre-vacuum chamber, and said gas flow passage having a dust removal filter inserted into it.

6. The vacuum processing apparatus of claim 1, wherein said small space is connected to a gas flow passage and is connected to an exhaust pipe of said pre-vacuum chamber via an externally provided dust removal filter.

7. The vacuum processing apparatus of claim 1, wherein said object of processing is a semiconductor wafer or a glass substrate for a liquid crystal display (LCD).