Laser diode system for cutting off the environment from the laser diode
First Claim
Patent Images
1. A laser diode system comprising:
- a substrate;
a sub-mount disposed on a portion of said substrate;
a laser diode chip bonded on said sub-mount; and
a monitor element formed on said sub-mount so as to monitor laser light emitted from a rear cleavage face of said laser diode chip, said laser diode chip being covered by a transparent resin layer having resistance against humidity to form solid state waveguide means connecting said rear cleavage face and said monitor element and a protective layer covering said solid state waveguide means for directing laser light emitted from said rear cleavage face to said monitor element.
0 Assignments
0 Petitions
Accused Products
Abstract
A laser diode, which includes a substrate, a laser diode chip bonded on the substrate through a sub-mount, and a monitor element formed on the substrate, monitors laser light emitted from a rear cleavage face of the laser diode chip. The laser diode chip has its front cleavage face covered by a transparent resin. As a result, variations of the surface state of the front cleavage face are prevented.
-
Citations
4 Claims
-
1. A laser diode system comprising:
-
a substrate; a sub-mount disposed on a portion of said substrate; a laser diode chip bonded on said sub-mount; and a monitor element formed on said sub-mount so as to monitor laser light emitted from a rear cleavage face of said laser diode chip, said laser diode chip being covered by a transparent resin layer having resistance against humidity to form solid state waveguide means connecting said rear cleavage face and said monitor element and a protective layer covering said solid state waveguide means for directing laser light emitted from said rear cleavage face to said monitor element. - View Dependent Claims (2)
-
-
3. A laser diode system comprising:
-
a substrate; a sub-mount disposed on a portion of said substrate; a laser diode chip bonded on said sub-mount; a monitor element formed on said sub-mount so as to monitor laser light emitted from a rear cleavage face of said laser diode chip; a transparent member disposed before a front cleavage face of said laser diode chip; a transparent resin layer having resistance against humidity being filed in a space between said front cleavage face and said transparent member and covering said laser diode chip to form solid state waveguide means connecting said rear cleavage face and said monitor element; and a protective layer covering said solid state waveguide means for directing laser light emitted from said rear cleavage fact to said monitor element. - View Dependent Claims (4)
-
Specification