Tube-shaped package for a semiconductor device and method therefor
First Claim
1. A method for packaging a plurality of semiconductor devices, each consisting of a semiconductor portion with multiple straight leads, in a tube-shaped tray and concurrently pre-forming the leads to a desired specification, comprising the following steps:
- (a) providing a tube-shaped tray consisting of multiple adjacent compartments, each having a die-shaped base portion conforming to the bottom of a semiconductor device and containing protrusions corresponding to the shape specified for the leads of the device;
(b) placing a semiconductor device in each of said multiple adjacent compartments of the tube-shaped tray, so that the semiconductor portion of the device is supported by said die-shaped base portion of the compartment; and
(c) bending the multiple straight leads of each semiconductor device by using a punch unit to shape the leads into the configuration of said protrusions in the compartment.
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Accused Products
Abstract
A tube-shaped tray that comprises adjacent compartments for semiconductor devices disposed linearly along the length of the tray. Each compartment consists of a die-shaped bottom container having a supporting structure conforming to the specified geometry of the leads in the formed semiconductor device. A film of protective and lubricating material is provided for placement on top of the device in each compartment, so that a forming tool can freely and safely cooperate with the supporting structure of the die-shaped bottom container to form the leads of the semiconductor device according to the desired specifications. The tray also includes a slidable retaining cover to prevent spillage and damage of the packaged devices. The invention also describes a process of packaging whereby the tube-shaped tray is positioned longitudinally under an off-loading machine, a semiconductor device with formable leads is off-loaded and placed in each die-shaped compartment under a forming tool, a film of protective and lubricating material is placed over each semiconductor device and under the forming tool, and the forming tool is actuated thereby forming the leads of each semiconductor device in the tray, so that the tray simultaneously provides a support and package of the semiconductor devices with bent leads according to specification. Because of the uni-directional operation of the packaging sequence, the various tools used in the process are required to function only in one direction, which results in a simpler, less expensive, and more reliable operation.
26 Citations
14 Claims
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1. A method for packaging a plurality of semiconductor devices, each consisting of a semiconductor portion with multiple straight leads, in a tube-shaped tray and concurrently pre-forming the leads to a desired specification, comprising the following steps:
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(a) providing a tube-shaped tray consisting of multiple adjacent compartments, each having a die-shaped base portion conforming to the bottom of a semiconductor device and containing protrusions corresponding to the shape specified for the leads of the device; (b) placing a semiconductor device in each of said multiple adjacent compartments of the tube-shaped tray, so that the semiconductor portion of the device is supported by said die-shaped base portion of the compartment; and (c) bending the multiple straight leads of each semiconductor device by using a punch unit to shape the leads into the configuration of said protrusions in the compartment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor package including multiple semiconductor devices with pre-formed leads, comprising:
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(a) a tube-shaped tray consisting of longitudinally-positioned multiple adjacent compartments, each having a die-shaped base portion conforming to the bottom of a semiconductor device and containing protrusions corresponding to the shape specified for the leads of the device; and (b) a semiconductor device, consisting of a semiconductor portion with multiple straight leads, placed in each of said multiple adjacent compartments of the tube-shaped tray, so that the semiconductor portion of the device is supported by said die-shaped base portion of the compartment and wherein said multiple straight leads have been pre-formed by using a punch unit to shape the leads into the configuration of said protrusions in the compartments. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification