Tube-shaped package for a semiconductor device and method therefor

• US 5,226,226 A
• Filed: 05/15/1992
• Issued: 07/13/1993
• Est. Priority Date: 07/29/1991
• Status: Expired due to Fees

• Current Assignee: Fitel Innovations
• Original Assignee: Richard H.J. Fierkens
• Inventors: Fierkens, Richard H. J.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US07/883,481
• Time in Patent Office: 424 Days
• Field of Search: 29/827, 140/105, 174/52.4, 206/328, 206/331, 206/332, 357/70, 437/217, 437/220
• US Class Current: 29/827
• CPC Class Codes: H01L 21/4842 Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device

Abstract

A tube-shaped tray that comprises adjacent compartments for semiconductor devices disposed linearly along the length of the tray. Each compartment consists of a die-shaped bottom container having a supporting structure conforming to the specified geometry of the leads in the formed semiconductor device. A film of protective and lubricating material is provided for placement on top of the device in each compartment, so that a forming tool can freely and safely cooperate with the supporting structure of the die-shaped bottom container to form the leads of the semiconductor device according to the desired specifications. The tray also includes a slidable retaining cover to prevent spillage and damage of the packaged devices. The invention also describes a process of packaging whereby the tube-shaped tray is positioned longitudinally under an off-loading machine, a semiconductor device with formable leads is off-loaded and placed in each die-shaped compartment under a forming tool, a film of protective and lubricating material is placed over each semiconductor device and under the forming tool, and the forming tool is actuated thereby forming the leads of each semiconductor device in the tray, so that the tray simultaneously provides a support and package of the semiconductor devices with bent leads according to specification. Because of the uni-directional operation of the packaging sequence, the various tools used in the process are required to function only in one direction, which results in a simpler, less expensive, and more reliable operation.

Claims

1. A method for packaging a plurality of semiconductor devices, each consisting of a semiconductor portion with multiple straight leads, in a tube-shaped tray and concurrently pre-forming the leads to a desired specification, comprising the following steps:

(a) providing a tube-shaped tray consisting of multiple adjacent compartments, each having a die-shaped base portion conforming to the bottom of a semiconductor device and containing protrusions corresponding to the shape specified for the leads of the device;

(b) placing a semiconductor device in each of said multiple adjacent compartments of the tube-shaped tray, so that the semiconductor portion of the device is supported by said die-shaped base portion of the compartment; and

(c) bending the multiple straight leads of each semiconductor device by using a punch unit to shape the leads into the configuration of said protrusions in the compartment.

2. The method described in claim 1, further comprising the step of placing a protective anti-friction film sheet above each semiconductor device in said multiple adjacent compartments an under the punch unit prior to the lead bending step.

3. The method described in claim 2, wherein said protective anti-friction film sheet consists of an anti-friction plastic material.

4. The method described in claim 2, including the step of removing the anti-friction film sheet after the step of bending said leads.

5. The method described in claim 1, including the step of leaving the semiconductor devices in contact with said tube-shaped tray as a package for the devices.

6. The method described in claim 5, including the step of off-loading said tube-shaped tray containing the semiconductor devices after the punch operation.

7. The method described in claim 1, including the step of covering said tube-shaped tray with a retaining cover to prevent spillage and damage of the packaged devices.

8. The method described in claim 1, wherein each step is performed sequentially on each compartment of said tube-shaped tray as it moves longitudinally along an assembly line.

9. A semiconductor package including multiple semiconductor devices with pre-formed leads, comprising:

(a) a tube-shaped tray consisting of longitudinally-positioned multiple adjacent compartments, each having a die-shaped base portion conforming to the bottom of a semiconductor device and containing protrusions corresponding to the shape specified for the leads of the device; and

(b) a semiconductor device, consisting of a semiconductor portion with multiple straight leads, placed in each of said multiple adjacent compartments of the tube-shaped tray, so that the semiconductor portion of the device is supported by said die-shaped base portion of the compartment and wherein said multiple straight leads have been pre-formed by using a punch unit to shape the leads into the configuration of said protrusions in the compartments.

10. The package of claim 9, further comprising a protective anti-friction film sheet placed above each semiconductor device in said multiple adjacent compartments.

11. The package of claim 10, wherein said protective anti-friction film sheet consists of an anti-friction plastic material.

12. The package of claim 9, further comprising a cover placed over said tube-shaped tray to prevent spillage and damage of the packaged devices.

13. The package of claim 12, wherein said tube-shaped tray comprises longitudinal grooves capable of slidably receiving said cover.

14. The package of claim 13, wherein said cover is transparent.