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Ceramic package and method for making same

  • US 5,227,583 A
  • Filed: 08/20/1991
  • Issued: 07/13/1993
  • Est. Priority Date: 08/20/1991
  • Status: Expired due to Fees
First Claim
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1. A ceramic package suitable for a semiconductor device comprisinga) a ceramic base component having a first portion for receiving a semiconductor chip and a second portion outward from said first portion,b) a plurality of bonding pads of an electrically conductive metallic material covering a first area of said second portion of said base component and suitable for being electrically connected to said chip,c) a first bus of an electrically conductive metallic material covering a second area of said second portion of said base component and suitable for being electrically connecting to said chip,d) a second bus of an electrically conductive metallic material covering a third area of said second portion of said base component and suitable for being electrically connecting to said chip, said bonding pad, said first and second buses being electrically insulated from each other,e) a signal shielding component bonded to said base component outward of and electrically insulated from said bonding pad and said first and second buses, said shielding component comprising first and second electrically conductive metallic layers electrically insulated from each other by a first layer of a dielectric material, all of said layers being substantially in alignment, and said first electrically conductive metallic layer being electrically connected to said first bus and said second electrically conductive metallic layer being electrically connected to said second bus,f) a second layer of a dielectric material covering the surface of said shielding component opposing the surface bonded to said base component, andg) a glass frit bonded to said second layer of dielectric material having the metallic leads that extend from a metallic lead frame embedded therein, wherein said leads and said signal shielding component ar in substantial alignment an said leads are electrically insulated from said shielding component and are connected to said bonding pads.

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