Projection exposure apparatus and projection exposure method

• US 5,227,862 A
• Filed: 12/14/1990
• Issued: 07/13/1993
• Est. Priority Date: 04/21/1989
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Tanaka, Minoru, Oshida, Yoshitada, Tanimoto, Tetsuzo
• Primary Examiner(s): Turner, Samuel A.
• Application Number:
  US07/623,438
• Time in Patent Office: 942 Days
• Field of Search: 356/345, 356/349, 356/351, 356/358, 356/363
• US Class Current: 356/490
• CPC Class Codes: G01B 11/0608 Height gauges
• CPC Class Codes: G01B 11/26 for measuring angles or tapers; for testing the alignment of axes
• CPC Class Codes: G01B 9/02022 contacting one object by grazing incidence
• CPC Class Codes: G01B 9/02084 Processing in the Fourier or frequency domain when not imaged in the frequency domain
• CPC Class Codes: G03F 9/7026 Focusing
• CPC Class Codes: G03F 9/7049 Technique, e.g. interferometric

Abstract

A projection exposure apparatus (1) comprises an incident light optical system for causing the light emitted from a light source 1 to enter an object of exposure (4) in diagonal direction, a detection apparatus (3) for causing an interference between the light reflected from the object of exposure (4) and a reference light and detecting the resultant interference fringe, a processing circuit for determining the inclination and height of the surface of the object of exposure (4) from the optical information on the interference fringe, and a stage (7) for supporting the object of exposure (4). The object of exposure (4) is subjected to projection exposure by driving the stage (7) according to the calculated inclination and height of the object of exposure (4).

Claims

1. A projection exposure apparatus comprising a stage for holding an exposure illumination system, selected one of a mask and a reticle, a projection optical system and an object of exposure, an alignment system for detecting relative positions of selected one of the mask and the reticle and the object of exposure thereby to control the positioning thereof, at least one irradiation means for converting the light emitted from a coherent light source into a parallel irradiation light beam and irradiating the same light diagonally on the exposure area of the projection optical system on the surface of the object of exposure at an incident angle of θ

, at least a detection optical system for introducing the objective light reflected on the object of exposure to pattern detection means, means for separating the light emitted from the coherent light source and generating a reference light, at least one reference light means for introducing the reference light to the pattern detection means and superposing and causing an interference thereof with the optical axis of the objective light at a desired angle on the pattern detection means, a processing circuit for producing at least information on an inclination of the object of exposure from the information on the interference pattern obtained from the pattern detection means, and a stage control system for controlling at least a unidirectional inclination of the object of exposure on the basis of the same information.

2. A projection exposure apparatus according to claim 1, wherein the irradiation light, the objective light and the reference light proceed in substantially the same direction and pass through substantially the same area.

3. A projection exposure apparatus according to claim 1, wherein the incident angle θ

is 85 degree or higher.

4. A projection exposure apparatus according to claim 1, wherein the irradiation light is an S-polarized light.

5. A projection exposure apparatus according to claim 1, further comprising a return detection optical system with a return plane mirror arranged appropriately for causing the objective light reflected on the object of exposure to be reflected substantially at the right angle to the return plane mirror, proceed in reverse way along the same light path, be reflected again on the object of exposure, and be introduced to the pattern detection means, thus causing an interference on the pattern detection means with the reference light.

6. A projection exposure apparatus according to claim 5, further comprising means configured in such a manner as to pass the reference light effectively in the same direction through the same area as the objective light.

7. A projection exposure apparatus according to claim 1 wherein the pattern detection means is an array sensor, a sinusoidal wave signal having a pitch P and a phase φ

corresponding to the inclination Δ

θ and

height Δ

h of an object of exposure is transmitted to the processing circuit, the fast Fourier transformation is executed in the processing circuit and the values Δ

θ and

Δ

h are determined from the information proximate to a spectrum corresponding to the pitch P.

8. A projection exposure apparatus according to claim 1, wherein the position of irradiation on the object of exposure is in substantially conjugate (image-forming) relationship with the pattern detection means due to selected one of the detection optical system and a return detection optical system.

9. A projection exposure apparatus according to claim 1, wherein the objective light and the reference light entering the pattern detection means make up a plane wave effectively.

10. A projection exposure apparatus according to claim 1, wherein said pattern detection means is an array sensor, the irradiation position on the object of exposure is in substantially conjugate relationship with the pattern detection means due to selected one of the detection optical system and a return detection optical system, said apparatus further comprising a processing circuit for selecting only the desired area of the information obtained by the array sensor, and determining at least the inclination of the desired exposure area of the object of exposure from the spectrum information obtained by a fast Fourier transformation.

11. A projection exposure apparatus according to claim 1, wherein a minute opening is provided in a light-convergence portion of the light paths for the reference light and selected one of the detection optical system and a return reflection optical system, and a noise light component reflected from the front and back surfaces of optical parts in the light paths is masked.

12. A projection exposure apparatus according to claim 1, wherein the processing circuit produces information on height of the object of exposure, and further comprising a second coherent light source having a wavelength different from the above-mentioned coherent light source, wherein the light emitted from the second coherent light source is introduced to the irradiation means thereby to form an objective light and a reference light in substantially the same light path as the first coherent light source, selected one of said detection optical system and a return detection optical system having arranged therein means for separating the light of the second wavelength from the light of the first wavelength, the objective light and the reference light of the second wavelength thus separated are detected by a second pattern detection means, the indefinite factors along the height are removed from the information the interference fringe obtained by the first and second pattern detection means, and accurate height information is thus capable of being detected over a wide range.

13. A projection exposure apparatus according to claim 1, wherein the number of reflections of the reference light and the objective light before a single beam reaches the pattern detection means through a beam splitter is set to selected one of an even and odd number.

14. A projection exposure apparatus according to claim 1, wherein the processing circuit produces information on height of the object of exposure and indefinite factors along the height due to a single wavelength detection are removed by using other wafer height detection means such as air micrometer at the same time, thereby making it possible to detect accurate height information over a wide range.

15. A projection exposure apparatus according to claim 1, wherein a laser beam is irradiated substantially along the diagonal direction of the exposure area.

16. A projection exposure apparatus according to claim 1, further comprising a pinhole plate disposed in the illumination light path for selecting part of the laser beam (central part of the Gauss distribution).

17. A projection exposure apparatus according to claim 16, wherein a pinhole plate for selecting part of a laser beam (central part of the Gauss distribution) is disposed in substantially conjugate relationship with the exposure area.

18. A projection exposure apparatus according to claim 1, wherein the processing circuit produces information on height of the object of exposure, and further comprising means for correcting the error caused at the time of determining the inclination and height in a process of Fourier transformation by the processing circuit, in accordance with the magnitude of amplitude generated in the interference pattern (interference fringe) attributable to the roughness of the surface of an object of exposure and detected by the pattern detection means.

19. A projection exposure apparatus according to claim 1, wherein said processing circuit produces information on height of the object of exposure and detects the maximum height of a spectrum other than those representing the DC components and the heights of spectra adjacent thereto from among the discrete frequency spectra obtained by subjecting the sampling value of a sinusoidal wave signal to discrete Fourier transformation, and the period and phase of the sinusoidal wave signal are determined from the read and imaginary number sections of the vectors representing the heights of said three spectra thereby to determine the inclination Δ

θ and

the height Δ

h of the object of exposure.

20. A projection exposure apparatus according to claim 1, wherein said processing circuit produces information on height of the object of exposure and includes means for taking out a sinusoidal wave signal as a discrete digital value, means for determining the real number section and the imaginary number section of the vector components of spectra by subjecting the digital value taken out to discrete Fourier transformation, means for calculating the height of each spectrum from a vector thereof having a component thus determined, means for detecting a spectrum having a maximum height other than those having a DC component and spectra adjacent thereto and extracting the vector components of said three vector spectra, means for calculating the period and phrase of the sinusoidal wave signal from the three vector components extracted, and means for determining the inclination Δ

θ and

the height of Δ

h of the object of exposure from the period and the phase determined by calculation.

45. An apparatus for detecting selected at least one of inclination and height according to claim 4, wherein said correction means is configured to effect the correction by the following equation:

##EQU66## where Ixc is the corrected information on interference fringe, Ix is the detected information on interference fringe, Ox is the information derived only from the light reflected from the object of measurement, and Rx is the information derived only from the reference light.

21. A method of detecting at least an inclination of an optically multi-layered object, wherein regularly reflected light is caused to interfere with a fixed reference light coherent with said regularly reflected light and obtaining at least a pitch of interference information, and detecting at least the inclination of the multilayered object from the pitch of the interference information.

22. A method according to claim 21, wherein the reference light is configured to pass through substantially the same light path as the irradiated light and the regularly reflected light caused to interfere with the reference light.

23. A method according to claim 21, further comprising the steps of obtaining a phase of the interference information, and further detecting the height of the multilayered object from the pitch and phase of the interference information.

24. A method according to claim 21, further comprising the steps of irradiating coherent light on the optically multilayered object with an incident angle of not less than 85°

so as to enable the obtaining of at least the pitch of the interference information from the interference of the regularly reflected light and the fixed reference light coherent with said regularly reflected light, detecting a phase of the interference information and detecting a height of the multilayered object from the pitch and phase of the interference information.

25. An apparatus for detecting selected at least one of the inclination and height of an optically multilayered object comprising a light source, irradiation means for irradiating the light emitted from the light source on the surface of an object of measurement having an optically multilayered structure in such a manner that the main beam of the light enters the surface at an incident angle of at least 85 degrees, means for detecting the information on the light reflected regularly from the object of measurement, and a processing circuit for introducing inclination of the object of measurement from the signal obtained at the detection means, and further comprising reference light generation means for generating a fixed reference light coherent with said regularly reflected light, said regularly reflected light and the reference light being detected in the form of interference fringe by the detection means, the processing circuit introducing the inclination from a pitch of an interference signal thus obtained.

26. An apparatus for detecting selected at least one of the inclination and height of an optically multilayered object according to claim 25, wherein the reference light generated in the reference light generation means is configured in such a manner as to pass through substantially the same light path as the irradiated light and the regularly reflected light interfered with the reference light except in that the reference light is not reflected on the surface of the object of measurement.

27. An apparatus for detecting selected at least one of inclination and height by interference, comprising at least one monochromatic light source for emitting a beam having a plurality of different wavelengths, collimating means for converting the beam emitted from the monochromatic light source into a substantially parallel beam, a beam splitter for separating the beam into a plurality of beams, irradiation optical means for irradiating on an optically multilayered object one of the parallel beams into which the original beam is splitted, a detection optical system for introducing the objective light irradiated by the irradiation optical means and reflected on the optically multilayered object to a detector, a reference light optical system for introducing to the detector the other of the parallel beams into which the original beam is splitted by the beam splitter, said other parallel beam being superposed at the detector on the objective light obtained from the detection optical means, and selective detection means for selecting any of a plurality of information signals on the interference fringes detected by the detector in accordance with the wavelengths thereby to detect the inclination of the optically multilayered object.

28. An apparatus for detecting selected at least one of inclination and height according to claim 27, wherein the selective detection means enables selecting any of the plurality of interference signals on the interference fringes detected by the detector in accordance with the wavelengths thereby to detect the height of the optically multilayered object.

29. An apparatus for detecting selected at least one of inclination, and height by interference according to claim 28, wherein the selection by the selective detection means is effected from the information on the optical characteristics and the film structure of the optically multilayered object.

30. An apparatus for detecting selected at least one of inclination and height by interference according to claim 28, wherein the selective detection means includes comparator means for comparing the objective light beams having a plurality of wavelengths with each other.

31. An apparatus for detecting selected at least one of inclination and height by interference according to claim 34, wherein said selective detection means is configured in such a manner as to correct the result of measurement with a selected wavelength by use of the information on the optical characteristics and film structure of the optically multilayered object.

32. An apparatus for detecting selected at least one of inclination and height by interference according to claim 28, wherein said selective detection means includes comparator means for subjecting the information on interference fringe to Fourier transformation, and comparing the ratio I(ω

'"'"''"'"')/I(ω

₀) for various wavelengths with each other, where I(ω

₀) is the bias component of the frequency ω

₀ (=0) of the Fourier transformation spectrum, and I(ω

'"'"') the spectrum component corresponding to the frequency of the interference fringe.

33. An apparatus for detecting selected at least one of inclination and height by interference according to claim 32, wherein said selective detection means is configured in such a manner as to correct the result of measurement with a selected wavelength by use of the information on the optical characteristics and film structure of the optically multilayered object.

34. An apparatus for detecting selected at least one of inclination and height by interference according to claim 28, wherein the incident angle is set by the irradiation optical means to 85 degrees or more.

35. An apparatus for detecting selected at least one of inclination and height by interference according to claim 28, wherein the monochromatic light source emits the S-polarized light.

36. An exposure apparatus of reduction projection (compression projection) type for subjecting a substrate to a step-and-repeat process so that a circuit pattern formed on a mask through a reduction projection lens is exposed by reduction projection on the substrate, the apparatus comprising at least one light source for emitting a beam having a plurality of different wavelengths, collimating means for converting the beam emitted from the light source into a substantially parallel light beam, a beam splitters for separating the light beam into a plurality of beams, irradiation optical means for irradiating on the substrate one of the parallel beams into which the original beam is splitted by the beam splitter, through the gap between the reduction projection lens and the substrate, a detection optical system for introducing to a detector the objective light reflected by the irradiation reflection means on the substrate, through the gap between the reduction projection lens and the substrate, a reference light optical system for introducing to the detector the other of the parallel beams into which the original beam is splitted by the beam splitter, and superposing the other parallel beam at the detector on the objective light obtained by the detection optical system, and selective detection means for selecting any of a plurality of information signals on the interference fringe detected by the detector and detecting the partial inclination of the substrate, in accordance with the light beams having a plurality of wavelengths.

37. A method of exposure by reduction projection for subjecting a substrate to a step-and-repeat process so that a circuit pattern formed on a mask through a reduction projection lens is exposed on the substrate by reduction projection, wherein a beam having a plurality of different wavelengths emitted from a light source is separated into a plurality of substantially parallel beams, one of the parallel beams thus obtained is irradiated on the substrate through the gap between the reduction projection lens and the substrate, an objective light beam reflected on the substrate is introduced to a detector through the gap between the reduction projection lens and the substrate, the other of the parallel beams obtained by separation is introduced to the detector and superposed on the objective light at the detector, and any of a plurality of information signals on the interference fringe detected by the detector is selected, thereby detecting selected at least one of the partial inclination and height of the substrate.

38. A method of detecting selected at least one of inclination and height, wherein a coherent light is irradiated on an object of measurement, the information on an interference fringe generated by the light reflected from the object of measurement and a reference light interfering with the coherent light is detected, the information derived at least one of only from the light reflected from the object of measurement and only from the reference light is collected, the information thus collected is corrected with reference to the detected information on the interference fringe, the information on selected one of the pitch of the interference fringe and the pitch and phase thereof is calculated from the corrected information on the interference fringe, and selected one of the inclination and height of the object of measurement is detected on the basis of the calculated information on selected one of the pitch of the interference fringe and the pitch and phase thereof.

39. A method of detecting selected at least one of inclination and height according to claim 38, wherein the information derived only from the reference light is collected, and the above-mentioned correction is effected by using the information thus collected.

40. A method of detecting selected at least one of inclination and height according to claim 39, wherein said correction is effected by the following equation:

##EQU64## where Ixc is the corrected information on interference fringe, Ix is the detected information on interference fringe, Ox is the information derived only from the light reflected from the object of measurement, and Rx is the information derived only from the reference light.

41. A method of detecting selected at least one of inclination and height according to claim 38, wherein said correction is effected by the following equation:

##EQU65## where Ixc is the corrected information on interference fringe, Ix is the detected information on interference fringe, Ox is one of the information derived only from the light reflected from the object of measurement and the information derived only from the reference light, and Rc is a predetermined value.

42. A method of detecting selected at least one of inclination and height according to claim 38, wherein the information on the pitch and phase of the interference fringe is calculated on the basis of the spectrum information obtained by subjecting the corrected information on the interference fringe to Fourier transformation.

43. An apparatus for detecting selected at least one of inclination and height comprising first irradiation means for irradiating a coherent light on an object of measurement, second irradiation means for irradiating a reference light interfering with the coherent light, interference fringe information detection means for detecting the information on an interference fringe generated from the reflected light obtained from the object of measurement by the light irradiated from the first irradiation means on the one hand and the reference light irradiated from the second irradiation means on the other hand, collecting means for collecting the information derived at least one of only from the light reflected from the object of measurement and only from the reference light, correction means for correcting the interference fringe information detected by the interference fringe information detection means by use of the information collected by the collecting means, and detection means for calculating the information on selected one of the pitch of the interference fringe and the pitch and phase thereof from the interference fringe information corrected by the correction means, thereby detecting selected at least one of the inclination and height of the object of measurement on the basis of the calculated information on selected one of the pitch of the interference fringe and the pitch and phase thereof.

44. An apparatus for detecting selected at least one of inclination and height according to claim 43, wherein said collecting means includes means for collecting the information derived only from the reference light, and said correction means includes means for effecting the above-mentioned correction by using the information derived only from the reference light collected by said additional collecting means.

46. An apparatus for detecting selected at least one of inclination and height according to claim 43, wherein said first irradiation means is configured in such a manner that the incident angle of the coherent light to the object of measurement is at least 85 degrees.

47. An apparatus for detecting selected at least one of inclination and height according to claim 43, wherein said correction means is configured to effect the correction by the following equation:

##EQU67## where Ixc is the corrected information on interference fringe, Ix is the detected information on interference fringe, Ox is one of the information derived only from the light reflected from the object of measurement and the information derived only from the reference light, and Rc a predetermined value.

48. An apparatus for detecting selected at least one of inclination and height according to claim 43, wherein the calculation of the information on selected one of the pitch of the interference fringe and the pitch and phase thereof in said means for detecting selected at least one of inclination and height is based on the spectrum information obtained by Fourier transformation of the corrected information on the interference fringe.

49. A method of projection exposure in which a circuit pattern formed on a mask is exposed by projection on a substrate through a projection optical system, the method being such that a coherent light is irradiated on the substrate, the information on the interference fringe generated by the light reflected from the substrate and the reference light interfering with the coherent light is detected, the information derived at least one of only from the light reflected from the substrate and only from the reference light is collected, the detected information on the interference fringe is corrected by use of the collected information, the information on selected one of the pitch of the interference fringe and the pitch and phase thereof is calculated from the corrected information on the interference fringe, selected at least one of inclination and height of the substrate is detected on the basis of the calculated information on selected one of the pitch of the interference fringe and the pitch and phase thereof, and at least selected one of the mask and the substrate is inched along the optical axis of the projection optical system and also around the two axes crossing said optical axis in the direction perpendicular thereto, thereby controlling the leveling in such a manner that the image-forming plane of the circuit pattern registers with the substrate surface.

50. A method of projection exposure according to claim 49, wherein the information derived only from the reference light is collected, and the correction is effected by use of the collected information.

51. A method of projection exposure according to claim 50, wherein the calculation of the information on the pitch and phase of the interference fringe is effected on the basis of the spectrum information obtained by Fourier transformation of the corrected information on the interference fringe.

52. A method of projection exposure according to claim 50, wherein said correction is effected by the following equation:

##EQU68## where Ixc represents the corrected information on interference fringe, Ix is the detected information on interference fringe, Ox is the information derived only from the light reflected from the substrate and Rx is the information derived only from the reference light.

53. A method of projection exposure according to claim 52, wherein the calculation of the information on the pitch and phase of the interference fringe is effected on the basis of the spectrum information obtained by Fourier transformation of the corrected information on the interference fringe.

54. A method of projection exposure according to claim 49, wherein said correction is effected by the following equation:

##EQU69## where Ixc represents the corrected information on interference fringe, Ix is the detected information on interference fringe, Ox is one of the information derived only from the light reflected from the substrate and the information derived only from the reference light, and Rc a predetermined value.

55. A method of projection exposure according to claim 54, wherein the calculation of the information on the pitch and phase of the interference fringe is effected on the basis of the spectrum information obtained by Fourier transformation of the corrected information on the interference fringe.

56. A method of projection exposure according to claim 49, wherein the calculation of the information on the pitch and phase of the interference fringe is effected on the basis of the spectrum information obtained by Fourier transformation of the corrected information on the interference fringe.

57. A projection exposure apparatus in which a circuit pattern formed on a mask is exposed by projection on a substrate through a projection optical system, said apparatus comprising driving means for tilting at least selected one of a mask and a substrate both along the optical axis and around two axes crossing the optical axis of the projection optical system in the direction perpendicular thereto, first irradiation means for irradiating coherent light on the substrate, second irradiation means for irradiating the reference light adapted to interfere with the coherent light, interference fringe information detection means for detecting the interference fringe information generated from the reflected light obtained from the substrate by the light irradiated from the first irradiation means and the reference light irradiated from the second irradiation means, collecting means for collecting the information derived only at least one of from the light reflected from the substrate and from the reference light, correction means for correcting the interference fringe information detected by the interference fringe detection means, by use of the information collected by the collecting means, means for detecting selected one of the inclination and height of the substrate by calculating the information on selected one of the pitch of the interference fringe and the pitch and phase thereof from the information corrected by the correction means, said detection means detecting selected one of the inclination and height of the substrate on the basis of the calculated information on selected one of the pitch of the interference fringe and the pitch and phase thereof, and leveling control means for controlling the driving means in such a manner that the image-forming surface of the circuit pattern registers with the substrate surface, on the basis of the information on selected one of inclination and height detected by the detection means.

58. A projection exposure apparatus according to claim 57, comprising masking means as said collecting means.

59. A projection exposure apparatus according to claim 57, wherein said collecting means includes means for collecting the information derived only from the reference light, and said correction means includes means for effecting the correction by use of the information derived only from the reference light collected by the additional collecting means.

60. A projection exposure apparatus according to claim 59, wherein the correction by said correction means is effected by the following equations:

##EQU70## where Ix is the corrected information on interference fringe, Ix is the detected information on interference fringe, Ox is the information derived only from the light reflected from the object of measurement, and Rx is the information derived only from the reference light.

61. A projection exposure apparatus according to claim 57, wherein said first irradiation means is configured in such a manner that the incident angle of the coherent light to the object of measurement is at least 85 degrees.

62. A projection exposure apparatus according to claim 57, wherein the correction by the correction means is effected by the following equation:

##EQU71## wherein Ixc is the corrected information on interference fringe, Ix is the detected information on interference fringe, Ox is one of the information derived only from the light reflected from the substrate and the information derived only from the reference light, and Rc a predetermined value.

63. A projection exposure apparatus according to claim 57, wherein the calculation of the information on selected one of the pitch of the interference fringe and the pitch and phase thereof in the means for detecting selected one of inclination and height is effected on the basis of the spectrum information obtained by Fourier transformation of the corrected information on the interference fringe.