Insulated power cable

• US 5,231,249 A
• Filed: 10/17/1991
• Issued: 07/27/1993
• Est. Priority Date: 02/23/1990
• Status: Expired due to Fees

• Current Assignee: Furukawa Electric Company Limited
• Original Assignee: Furukawa Electric Company Limited
• Inventors: Kimura, Hitoshi, Matsumoto, Tetsuo, Shimada, Michihiro
• Primary Examiner(s): NIMMO, MORRIS
• Application Number:
  US07/773,667
• Time in Patent Office: 649 Days
• Field of Search: 174/120 SC, 174/102 SC, 174/105 SC, 174/84 R, 174/75 C, 174/75 R
• US Class Current: 174/105.0SC
• CPC Class Codes: H01B 3/44 vinyl resins; acrylic resins silicones H01B3/46
• CPC Class Codes: H01B 3/441 from alkenes
• CPC Class Codes: H01B 7/292 using material resistant to heat
• CPC Class Codes: H01B 9/027 composed of semi-conducting layers
• CPC Class Codes: H02G 15/003 Filling materials, e.g. solid or fluid insulation
• CPC Class Codes: H02G 15/103 with devices for relieving electrical stress
• CPC Class Codes: H02G 15/105 connected to the cable shield only H02G15/107 takes precedence
• CPC Class Codes: H02G 15/184 with devices for relieving electrical stress
• CPC Class Codes: H02G 15/196 having lapped insulation

Abstract

There is provided an olefin resin composition for power cables which contains an olefin resin and m-(tert-butylperoxyisopropyl)-isopropylbenzene and/or p-(tert-butylperoxyisopropyl)-isopropylbenzene. A crosslinking agent of this resin composition is suitably used for at least one of layers including semiconductor layers and an insulation layer in the power cables or around conductors at a joint between the power cables, whereby the high-temperature properties of the power cables can be improved.

Claims

1. In a rubber or plastic insulated power cable comprising a conductor and having formed thereon in the following order:

at least an inner semiconductor layer and an insulation layer wherein at least one layer selected from the group consisting of said inner semiconductor layer and said insulation layer, is formed of a crosslinked structure of an olefin resin composition comprising an olefin resin and at least one crosslinking agent selected from the group consisting of m-(tert-butylperoxyisopropyl)-isopropylbenzene and p-(tert-butylperoxyisopropyl)-isopropylbenzene.

3. The power cable according to claim 1 or 2, wherein said olefin resin composition contains 0.5 to 5 parts by weight of m-(tert-butylperoxyisopropyl)-isopropylbenzene and/or p-(tert-butylperoxyisopropyl)-isopropylbenzene, based on 100 parts by weight of the olefin resin.

4. The power cable according to claim 3, wherein said olefin resin composition further contains at least one antioxidant selected from the group consisting of 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol) and bis[2-methyl-4-(3-n-alkylthiopropionyloxy)-5-tert-butylphenyl] sulfide.

5. The power cable according to claim 1 to 5, wherein said olefin resin composition further contains 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol) and/or bis[2-methyl-4-(3-n-alkylthiopropionyloxy)-5-tert-butylphenyl] sulfide as an antioxidant or antioxidants.

6. The power cable according to claim 1, wherein said olefin resin composition contains 1.5 to 3 parts by weight of m-(tert-butylperoxyisopropyl)-isopropylbenzene and/or p-(tert-butylperoxyisopropyl)-isopropylbenzene, based on 100 parts by weight of the olefin resin.

7. The power cable according to claim 6, wherein said olefin resin composition further contains at least one antioxidant selected from the group consisting of 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol), bis[2-methyl-4-(3-n-alkylthiopropionyloxy)-5-tert-butylphenyl] sulfide, 2,5-di-tert-butyl hydroquinone, 2,6-di-tert-butyl-p-cresol, 2,2'"'"'-thiodiethylenebis-[3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], dilauryl thiodipropionate and distearyl thiodipropionate, said antioxidant being in an amount of 0.05 to 1.0 part by weight based on 100 parts by weight of said olefin resin.

8. The joint system according to claim 7, wherein said olefin resin composition further contains at least one antioxidant selected from the group consisting of 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol), bis[2-methyl-4-(3-n-alkylthiopropionyloxy)-5-tert-butylphenyl] sulfide, 2,5-di-tert-butyl hydroquinone,2,6-di-tert-butyl-p-cresol, 2,2'"'"'-thiodiethylenebis-[3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], dilauryl thiodipropionate and distearyl thiodipropionate, said antioxidant being in an amount of 0.05 to 1.0 part by weight based on 100 parts by weight of said olefin resin.

9. The power cable according to claim 1, wherein the olefin resin is selected from the group consisting of polyethylene, ethylene propylene rubber, ethylene-ethyl acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer and ethylene-styrene copolymer.

2. In a rubber or plastic insulated power cable comprising a conductor and having formed thereon in the following order:

at least an inner semiconductor layer, an insulation layer, and an outer semiconductor layer formed thereon wherein at least one layer selected from the group consisting of said inner semiconductor layer, said insulation layer, and said outer semiconductor layer, is formed of a crosslinked structure of an olefin resin composition comprising an olefin resin and at least one crosslinking agent selected from the group consisting of m-(tert-butylperoxyisopropyl)-isopropylbenzene and p-(tert-butylperoxyisopropyl)-isopropylbenzene.

10. The power cable according to claim 2, wherein said olefin resin composition further contains at least one antioxidant selected from the group consisting of 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol) and bis[2-methyl-4-(3-n-alkylthiopropionyloxy)-5-tert-butylphenyl] sulfide.

11. The power cable according to claim 10, wherein the insulation layer contains 100 parts by weight of low-density polyethylene with a M.I. of 0.5 to 5.0 g/10 minutes and a density of 0.920 to 0.940 g/cm³ compounded with 1.5 to 3 parts by weight of m-(tert-butylperoxyisopropyl)-isopropylbenzene and/or p-(tert-butylperoxyisopropyl)-isopropylbenzene and 0.05 to 1.0 part per weight of 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol);

and the inner semiconductor layer and the outer semiconductor layer both contain 100 parts by weight of an ethylene-ethyl acrylate copolymer or an ethylene-vinyl acetate copolymer with a M.I. of 10 to 20 g/10 minutes and a density of 0.93 to 0.96 g/cm³ compounded with 1.5 to 3 parts by weight of m-(tert-butylperoxyisopropyl)-isopropylbenzene and 0.05 to 1.0 part per weight of 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol) and further compounded with 20 to 100 parts by weight of acetylene black.

12. The power cable according to claim 2, wherein said olefin resin composition contains 1.5 to 3 parts by weight of m-(tert-butylperoxyisopropyl)-isopropylbenzene and/or p-(tert-butylperoxyisopropyl)-isopropylbenzene, based on 100 parts by weight of the olefin resin.

13. The power cable according to claim 12, wherein said olefin resin composition further contains at least one antioxidant selected from the group consisting of 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol), bis[2-methyl-4-(3-n-alkylthiopropionyloxy)-5-tert-butylphenyl] sulfide, 2,5-di-tert-butyl hydroquinone,2,6-di-tert-butyl-p-cresol,2,2'"'"'-thiodiethylenebis-[3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], dilauryl thiodipropionate and distearyl thiodipropionate, said antioxidant being in an amount of 0.05 to 1.0 part by weight based on 100 parts by weight of said olefin resin.

14. The power cable according to claim 2, wherein the olefin resin is selected from the group consisting of polyethylene, ethylene propylene rubber, ethylene-ethyl acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer and ethylene-styrene copolymer.

15. In a joint system for power cables, which comprises a conductor joint between two rubber or plastic insulated power cables, said power cables having a conductor core, an inner semiconductor layer, an insulation layer and an outer semiconductor layer, said conductor joint having an inner semiconductor layer, an insulation layer, and an outer semiconductor layer, successively formed thereon or around the vicinities thereof, wherein at least one layer selected from the group consisting of said inner semiconductor layer, said insulation layer, and said outer semiconductor layer, is formed of a crosslinked structure of an olefin resin composition comprising an olefin resin and at least one crosslinking agent selected from the group consisting of m-(tert-butylperoxyisopropyl)-isopropylbenzene and p-(tert-butylperoxyisopropyl)-isopropylbenzene.

16. The joint system for power cables according to claim 15, wherein said olefin resin composition contains 0.5 to 5 parts by weight of m-(tert-butylperoxyisopropyl)-isopropylbenzene and/or p-(tert-butylperoxyisopropyl)-isopropylbenzene, based on 100 parts by weight of the olefin resin.

17. The joint system for power cables according to claim 15 or 16, wherein said olefin resin composition further contains 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol) and/or bis[2-methyl-4-(3-n-alkylthiopropionyloxy)-5-tert-butylphenyl]sulfide as an antioxidant or antioxidants.

18. The joint system according to claim 15, wherein said olefin resin composition contains 1.5 to 3 parts by weight of m-(tert-butylperoxyisopropyl)-isopropylbenzene and/or p-(tert-butylperoxyisopropyl)-isopropylbenzene, based on 100 parts by weight of the olefin resin.

19. The joint system according to claim 15, wherein the olefin resin is selected from the group consisting of polyethylene, ethylene propylene rubber, ethylene-ethyl acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene-ethylene-acrylic acid copolymer and ethylene-styrene copolymer.

20. The joint according to claim 15, wherein the insulation layer contains 100 parts by weight of low-density polyethylene with a M.I. of 0.5 to 5.0 g/10 minutes and a density of 0.920 to 0.940 g/cm³ compounded with 1.5 to 3 parts by weight of m-(tert-butylperoxyisopropyl)-isopropylbenzene and/or p-(tert-butylperoxyisopropyl)-isopropylbenzene and 0.05 to 1.0 part per weight of 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol);

and the inner semiconductor layer and the outer semiconductor layer both contain 100 parts by weight of an ethylene-ethyl acrylate copolymer or an ethylene-vinyl acetate copolymer with a M.I. of 10 to 20 g/10 minutes and a density of 0.93 to 0.96 g/cm³ compounded with 1.5 to 3 parts by weight of m-(tert-butylperoxyisopropyl)-isopropylbenzene and 0.05 to 1.0 part per weight of 4,4'"'"'-thiobis(3-methyl-6-tert-butylphenol) and further compounded with 20 to 100 parts by weight of acetylene black.