Chip device bonding machine

• US 5,232,532 A
• Filed: 05/26/1992
• Issued: 08/03/1993
• Est. Priority Date: 05/27/1991
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Hori, Takeshi
• Primary Examiner(s): Simmons, David A.
• Assistant Examiner(s): Rivard, Paul M.
• Application Number:
  US07/887,844
• Time in Patent Office: 434 Days
• Field of Search: 156/87, 156/160, 156/163, 156/295, 156/556, 156/323, 156/350, 156/358, 156/632, 29/740, 29/741, 29/742, 29/832, 29/840, 29/853, 437/209, 361/400
• US Class Current: 156/163
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/7565 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: Y10T 156/1744 : Means bringing discrete articles into assembled relationship
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49167 : with deforming of conductive path
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53183 : Multilead component

Abstract

The present invention is to provide a chip device bonding machine in which bubbles can be effectively prevented from remaining with the adhesive. A flexible board is moved on a base at every unit by the rotation of reels. In accordance with the movement of the flexible board, a new portion of a tape made of a film, a paper or the like is moved above the base. The tape is located between the flexible board and the base. A thermosetting adhesive is deposited on the flexible board on the base by an adhesive nozzle. An IC chip is placed on the flexible board on the base by an IC chip supply arm. A pressing arm including a heater presses and heats the IC chip toward the base side to interconnect the IC chip to the flexible hoard. When the IC chip is heated and pressed by the pressing arm, the tape is concaved at its portions corresponding to bumps and consequently the flexible board is deformed, whereby bubbles produced within the adhesive are pushed out to the outside. Thus, the bubbles can be removed from the adhesive.

Claims

1. A chip device bonding machine for bonding a chip device on a flexible board comprising:

(a) board supplying means for supplying said flexible board having first and second surfaces on a base, said first surface having a wiring pattern and a bump interconnected with said wiring pattern;

(b) adhesive depositing means for depositing a thermosetting adhesive on said first surface of said flexible board;

(c) chip device mounting means for mounting a chip device on said first surface of said flexible board on which said thermosetting adhesive is deposited;

(d) sheet putting means for putting a sheet on said second surface of said flexible board; and

(e) pressing means for pressing said chip device on said flexible board and heating said chip device on said flexible board, said flexible board and said sheet are deformed by the press of said pressing means so as to push out bubbles produced within said adhesive to the outside; and

(f) control means for controlling operation of said board supplying means, said adhesive depositing means, said chip device mounting means, said sheet putting means and said pressing means.

4. The chip device bonding machine according to claim 1, wherein said board supplying means comprises:

(a) a board supply reel for supplying said flexible board and

(b) a board take-up reel for taking up said flexible board;

said control means controlling rotation of said board feed supply reel and said board take-up reel.

5. The chip device bonding machine according to claim 1, wherein said sheet putting means comprises:

(a) a sheet supply reel for supplying said sheet and

(b) a sheet take-up reel for taking up said sheet;

said control means controlling rotation of said sheet supply reel and said sheet take-up reel.

6. A chip device bonding machine according to claim 1, wherein said pressing means comprises:

(a) a heater for heating said chip device on said flexible board, and

(b) heater shift means for shifting said heater between first and second positions, said heater shift means contacting said heater at said first position, said control means controlling operation of said heater and said heater shift means.

2. A chip device bonding machine for bonding a chip device on a flexible board comprising:

(a) board supplying means for supplying said flexible board having first and second surfaces on a base, said first surface having a wiring pattern and a bump interconnected with said wiring pattern;

(b) adhesive depositing means for depositing a thermosetting adhesive on said first surface of said flexible board;

(c) chip device mounting means for mounting a chip device on said first surface of said flexible board on which said thermosetting adhesive is deposited so that an electrode of said chip device is opposed to said bump interconnected on said wiring pattern;

(d) sheet putting means for putting a sheet on said second surface of said flexible board;

(e) pressing means for pressing said chip device on said flexible board so as to bring said electrode of said chip device into contact with said bump and for heating said chip device on said flexible board, said sheet is concaved at portions corresponding to said bumps so that said flexible board is deformed so as to project a central portion thereof corresponding to a portion between said bumps; and

(f) control means for controlling operation of said board supplying means, said adhesive depositing means, said chip device mounting means, said sheet putting means and said pressing means.

3. A method for bonding a chip device on a flexible board, comprising the steps of:

(a) supplying a flexible board having first and second surfaces to a base, said first surface having a wiring pattern and a bump interconnected with said wiring pattern;

(b) depositing a thermosetting adhesive on said first surface of said flexible board;

(c) mounting a chip device on said first surface of said flexible board on which said thermosetting adhesive is deposited so that an electrode of said chip device is opposed to said bump interconnected with said wiring pattern;

(d) putting a sheet on said second surface of said flexible board;

(e) pressing said chip device on said flexible board so as to bring said electrode of said chip device into contact with said bump and heating said chip device on said flexible board, said sheet is concaved at portions corresponding to said bumps so that said flexible board is deformed so as to project a central portion thereof corresponding to a portion between said bumps.

7. A chip device bonding machine for bonding a chip device on a flexible board comprising:

(a) board supplying reel for supplying said flexible board having first and second surfaces on a base, said first surface having a wiring pattern and a bump interconnected with said wiring pattern;

(b) a board take-up reel for taking up said flexible board;

(c) an adhesive depositing nozzle for depositing a thermosetting adhesive on said first surface of said flexible board;

(d) a chip device mounting arm for mounting a chip device on said first surface of said flexible board on which said thermosetting adhesive is deposited so that an electrode of said chip device is opposed to said bump interconnected with said wiring pattern;

(e) a sheet supplying reel for supplying sheet between said second surface of said flexible board to said base;

(f) a sheet take-up reel for taking up said sheet;

(g) a pressing for pressing said chip device on said flexible board so as to bring said electrode of said chip device into contact with said bump and for heating said chip device on said flexible board, said sheet is concaved at portions corresponding to said bumps so that said flexible board is deformed so as to project a central portion thereof corresponding to a portion between said bumps; and

(h) control means for controlling operation of said board supplying means, said adhesive depositing means, said chip device mounting means, said sheet putting means and said pressing means.