Reduced diameter camera head for solid-state image pickup device and method of producing same

• US 5,233,426 A
• Filed: 12/12/1991
• Issued: 08/03/1993
• Est. Priority Date: 12/28/1990
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Suzuki, Takahisa, Hatada, Kenzo, Tsukada, Tatsuki
• Primary Examiner(s): Razavi, Michael T.
• Assistant Examiner(s): Ho, Tuan V.
• Application Number:
  US07/805,938
• Time in Patent Office: 600 Days
• Field of Search: 358/209, 358/225, 358/229, 358/226, 358/98, 257/229, 257/231
• US Class Current: 348/207.99
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Abstract

The present invention provides a compact camera head for a solid-state image pickup device, a dimension of which is not so limited by a package for a solid-state image pickup element. Outer-leads are connected via inner-leads respectively to electrodes of a solid-state image pickup chip to constitute the solid-state image pickup element. An optical glass plate is attached to a light-receiving surface of the solid-state image pickup chip. The outer-leads are connected to side electrodes of a circuit module constituted by a chip-connecting board, a circuit board and a connector board, to thereby provide an image pickup unit. The image pickup unit is inserted into a chassis, and the opposite open ends of the chassis are sealed by an optical filter and a seal plate.

Claims

1. A camera head for a solid-state image pickup device comprising:

a chassis which has opposite open ends; and

an image pickup unit housed in said chassis, said image pickup unit including;

a solid state image pickup chip constituted by a solid-state image pickup semiconductor device,

chip-connecting board disposed adjacent to said solid-state image pickup chip and having an electric circuit mounted thereon,

a connector board having external lead pins,

leads connecting electrodes provided at an outer peripheral edge of at least one of said chip-connecting board and said connector board to electrodes of said solid-state image pickup chip, said leads being integrated with said electrodes of at least one of said chip-connecting board and said connector board, and,

a protective member sealing a light-receiving surface of said solid-state image pickup chip, said protective member being one of an optical glass plate and an optical filter.

2. A camera head for a solid state image pickup device comprising:

an image pickup unit including;

a solid-state image pickup chip constituted by a solid-state image pickup semiconductor device,

chip-connecting board disposed adjacent to said solid-state image pickup chip and having an electric circuit mounted thereon,

a connector board having external lead pins,

leads connecting electrodes provided at an outer peripheral edge of at least one of said chip-connecting board and connector board to electrodes of said solid-state image pickup chip, said leads being integrated with said electrodes of at least one of said chip-connecting board and connector board, and

a protective member sealing a light-receiving surface of said solid-state image pickup chip, said protective member being one of an optical glass plate and an optical filter,

a chassis which has opposite open ends and houses therein said image pickup unit;

a first seal member for sealing one end of said chassis, which is one of an optical glass plate and an optical filter; and

a second seal member for sealing the other end of said chassis.

3. A camera head according to claim 2, wherein said second seal member is in the form of a plate.

4. A camera head according to claim 2, wherein said second seal member is an adhesive.

5. A method of producing a camera head for a solid-state image pickup device, comprising the steps of:

connecting outer-leads respectively to electrodes of a solid-state image pickup chip via inner-leads, which chip is constituted by a solid-state image pickup semiconductor device;

bonding a protective member to a light-receiving surface of said solid-state image pickup chip, said protective member being one of an optical glass plate and an optical filter;

arranging a chip-connecting board and a connector board in an aligned manner at a side of said solid-state image pickup chip opposite to said light-receiving surface thereof, and connecting said chip-connecting board and said connector board together, said chip-connecting board having electric circuit parts mounted thereon, and said connector board having external lead pins;

bending said outer-leads to be brought into contact with electrodes provided respectively at outer peripheral edges of said chip-connecting board and said connector board, and connecting said outer-leads to said electrodes of said two boards to form an image pickup unit;

inserting said image pickup unit into a chassis having opposite open ends; and

sealing one open end of said chassis adjacent to said light-receiving surface of said solid-state image pickup chip by a first seal member, said first seal member being one of an optical glass plate and an optical filter, and sealing the other open end of said chassis by a second seal member.