Stepped mold inserts, a process for the manufacture of stepped mold inserts, and stepped microstructural bodies with the mold inserts
First Claim
1. A process for the manufacture of stepped mold inserts utilized to mold stepped microstructural bodies, comprising the steps of:
- applying an electrically non-conductive layer on a base plate made of an electrically conductive material such that the thickness of the non-conductive layer substantially corresponds to the height of the step;
applying an electrically conductive layer on the non-conductive layer such that the thickness of the conductive layer is less than the thickness of the non-conductive layer;
prestructuring the layers applied on the base plate by precision mechanical machining to remove regions of the layers such that the removed regions reach down to the conductive base plate;
filling the removed regions and covering the base plate with a resist material, whose thickness corresponds to the entire height of the microstructural body to be molded;
irradiating the resist layer through at least one structured mask;
dissolving regions of the resist material that have remained soluble or have become soluble;
electrodepositing a metal in those regions from which the resist material was dissolved out and covering all regions with a layer of metal that is one to several millimeters thick; and
removing the base plate and dissolving out the remaining parts of the conductive and non-conductive layers for obtaining the stepped mold insert.
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Accused Products
Abstract
A process to manufacture stepped mold inserts and stepped microstructural bodies molded with the mold inserts. Stepped mold inserts are manufactured using structured irradiation masks with regionally different absorption for x-radiation; to this end, extensive calculations are necessary. Furthermore, several masks can be used in succession and for each irradiation step the penetration depth of the x-radiation can be changed. These masks must be positioned with high precision. With the present process stepped mold inserts are manufactured by a simple procedure. Several layers of varying thickness are applied on a metal plate alternating with non-conductive and conductive material. The layered stack is prestructured by precision mechanical machining at depths that vary from region to region, filled with a resist material and irradiated preferably through a single structured mask. Following the "development" of the resist layer, metal is electrodeposited in the microstructure and the metallic mold insert is separated from the resist structure.
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Citations
10 Claims
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1. A process for the manufacture of stepped mold inserts utilized to mold stepped microstructural bodies, comprising the steps of:
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applying an electrically non-conductive layer on a base plate made of an electrically conductive material such that the thickness of the non-conductive layer substantially corresponds to the height of the step; applying an electrically conductive layer on the non-conductive layer such that the thickness of the conductive layer is less than the thickness of the non-conductive layer; prestructuring the layers applied on the base plate by precision mechanical machining to remove regions of the layers such that the removed regions reach down to the conductive base plate; filling the removed regions and covering the base plate with a resist material, whose thickness corresponds to the entire height of the microstructural body to be molded; irradiating the resist layer through at least one structured mask; dissolving regions of the resist material that have remained soluble or have become soluble; electrodepositing a metal in those regions from which the resist material was dissolved out and covering all regions with a layer of metal that is one to several millimeters thick; and removing the base plate and dissolving out the remaining parts of the conductive and non-conductive layers for obtaining the stepped mold insert. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification