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Aligned wafer bonding

  • US 5,236,118 A
  • Filed: 05/12/1992
  • Issued: 08/17/1993
  • Est. Priority Date: 05/12/1992
  • Status: Expired due to Term
First Claim
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1. A process for bonding a surface feature of a semiconductor structure to a surface feature of a semiconductor, optical, or micromechanical structure, comprising the steps of:

  • (a) aligning at least two complementary surface features of a plurality of structures having surface features to be bonded;

    (b) bringing said surface features into physical contact at room temperature whereby atomic bonds are formed between said surface features; and

    (c) annealing said structures to strengthen said atomic bonds.

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