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Surface acoustic wave device package

  • US 5,237,235 A
  • Filed: 09/30/1991
  • Issued: 08/17/1993
  • Est. Priority Date: 09/30/1991
  • Status: Expired due to Fees
First Claim
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1. A surface acoustic wave (SAW) device package for reducing insertion loss and direct RF feedthrough of a SAW device, the SAW device package comprising:

  • substrate means including at least first and second surfaces;

    input means for connection to external circuitry, said input means disposed on said substrate means;

    output means for connection to external circuitry, said output means disposed on said substrate;

    shield means for preventing electrical coupling to said input means and said output means, said shield means disposed on said substrate means;

    SAW means including;

    SAW input means connected to said input means for transmitting an input signal to said SAW device;

    SAW output means connected to said output means for transmitting at least one output signal from said SAW device; and

    a SAW substrate, said SAW device disposed on said SAW substrate and positioned substantially over said shield means to inhibit parasitic electrical connection to said SAW device;

    said SAW device package further comprising bonding means disposed on said shield means and said substrate means, said bonding means for bonding said SAW substrate to said substrate means;

    lid means for physically covering said SAW means, said lid means positioned over said SAW means and in contact with said substrate means;

    means for sealing said lid means to said substrate means;

    said shield means including;

    input shield means corresponding to said input means and substantially surrounding said input means; and

    output shield means corresponding to said output means and surrounding said output means on at least two sides;

    said output means and said corresponding output shield means disposed on said first surface of said substrate means for connection to external circuitry; and

    said input means and said corresponding input shield means disposed on said first surface of said substrate means and wrapped around said substrate means to said second surface for connection to external circuitry.

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