Smart indexing head for universal lead frame work station

• US 5,238,174 A
• Filed: 11/15/1991
• Issued: 08/24/1993
• Est. Priority Date: 11/15/1991
• Status: Expired due to Term

• Current Assignee: Kulicke and Soffa Industries Incorporated
• Original Assignee: Kulicke & Soffa Investments, Inc.
• Inventors: Ricketson, Tommy H., Bram, Bruce M., Shah, Gautam N., Tehrani, Mohmod M.
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US07/792,801
• Time in Patent Office: 648 Days
• Field of Search: 228/6.2, 228/4.5, 228/180.2, 228/179, 228/102, 228/105, 266/162
• US Class Current: 228/180.21
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/78703 Mechanical holding means
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]

Abstract

Apparatus and a method for orienting individual bonding sites of a lead frame having a plurality of bonding sites includes a universal work station in a work holder. The work holder comprises a gripper mechanism which is mounted on a transverse rail or bar for grasping a lead frame at an edge portion thereof while exposed in a supply magazine. The jaws of the gripper mechanism are pivoted in a horizontal direction which permits the exposed edge of the lead frame to be aligned parallel to a reference plane in a theta orientation direction. While oriented in the theta orientation direction, the lead frame is moved precisely to the window of the work station of the work holder where it is clamped by the top plate and lower plate of the work station before being subsequently bonded. A modified feature of the invention permits the mechanically theta oriented bonding site to be viewed by a PRS system and reoriented in an X and Y position prior to being clamped in the work station to provide a very high degree of theta, X and Y location of individual bonding sites in the window of a work station prior to bonding.

Claims

1. A method for pre-positioning each individual bonding site of a lead frame of the type having a plurality of bonding sites in a bonding window of a work station of an automatic bonding machine prior to performing an automatic bonding operation, comprising the steps of:

sensing the edge portions of a lead frame exposed in a supply magazine,

grasping a portion of the lead frame exactly opposite the bonding site to be pre-positioned in a gripping mechanism,

mechanically orienting said lead frame in a theta direction to align the edge of said lead frame exactly opposite said bonding site parallel to a reference plane,

holding the rotated lead frame in said gripping mechanism, and

transporting said mechanically rotated lead frame to the bonding window of the work station of said automatic wire bonder in a pre-position theta orientation.

2. A method as set forth in claim 1 which further includes the step of determining the precise X and Y position of said bonding site in said window of said bonding station, and

post-positioning said bonding site in said bonding window prior to clamping said bonding site in said work station before performing a bonding operation.

3. A method as set forth in claim 2 wherein the step of determining the precise X and Y position of said bonding site is performed by a pattern recognition system incorporated into said automatic wire bonding machine.

4. A method as set forth in claim 3 which further includes the step of clamping said bonding site in said work station of said automatic wire bonding machine and releasing said gripping mechanism,

moving said gripping mechanism to a next portion of said lead frame exactly opposite the next bonding site to be pre-positioned, and

grasping said next portion of said lead frame before releasing the lead frame clamped in said work station.

5. A method as set forth in claim 4 which further includes the step of releasing said lead frame clamped in said work station and then repeating the steps of mechanically rotating said lead frame in a theta direction to align the edges of said next bonding site of said lead frame parallel to a reference plane.