High-frequency circuit package
First Claim
Patent Images
1. A high-frequency circuit package comprising:
- a conductive substrate;
a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber;
a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber;
a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case, said conductive substrate having a through-opening for receiving therein a dielectric, a feed-through terminal extending through a through-opening formed in the dielectric tool aisle one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports thereon the dielectric.
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Accused Products
Abstract
A high-frequency circuit package including a conductive substrate, and upper and lower shielding cases which come tightly into contact with opposite surfaces of the conductive substrate to define therein upper and lower shielding chambers. High-frequency circuits are mounted on the surfaces of the conductive substrate within the upper and lower chambers, respectively.
37 Citations
13 Claims
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1. A high-frequency circuit package comprising:
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a conductive substrate; a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber; a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber; a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case, said conductive substrate having a through-opening for receiving therein a dielectric, a feed-through terminal extending through a through-opening formed in the dielectric tool aisle one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports thereon the dielectric. - View Dependent Claims (2, 3, 4, 5)
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6. A high-frequency circuit package comprising:
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a conductive substrate; a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber; a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber; a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case; a feed through terminal which extends through the conductive substrate to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit; and a through opening in said conductive substrate for receiving therein a dielectric, said dielectric having a feed-through terminal extending through a through-opening formed in the dielectric to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports thereon the dielectric. - View Dependent Claims (7, 8, 9)
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10. A high-frequency circuit package comprising:
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a conductive substrate; a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber; a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber; a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case; a feed through terminal which extends through the conductive substrate to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit; a through opening in said conductive substrate for receiving therein a dielectric, said dielectric having a feed-through terminal extending through a through opening formed in the dielectric to allow one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports therein the dielectric; and a plurality of through openings and said shielding case through said leads extend, said leads connecting said high-frequency circuits to an outside circuit. - View Dependent Claims (11, 12, 13)
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Specification