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High-frequency circuit package

  • US 5,239,126 A
  • Filed: 01/16/1991
  • Issued: 08/24/1993
  • Est. Priority Date: 01/17/1990
  • Status: Expired due to Fees
First Claim
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1. A high-frequency circuit package comprising:

  • a conductive substrate;

    a first shielding case associated with a first surface of the conductive substrate to define therein a first shielding chamber;

    a second shielding case associated with a surface opposite the first surface of the conductive substrate to define therein a second shielding chamber;

    a pair of high-frequency circuits, one of which is mounted on the first surface of the conductive substrate within the first shielding case, and the other of which is mounted on the opposite surface of the conductive substrate within the second shielding case, said conductive substrate having a through-opening for receiving therein a dielectric, a feed-through terminal extending through a through-opening formed in the dielectric tool aisle one of said high-frequency circuits to be electrically connected to the other high-frequency circuit, said through opening of the conductive substrate having two steps, one of which supports thereon the dielectric.

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