Solid image pickup device having microlenses

• US 5,239,412 A
• Filed: 02/04/1991
• Issued: 08/24/1993
• Est. Priority Date: 02/05/1990
• Status: Expired due to Term

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Misawa, Kiyotoshi, Nakai, Jun-ichi, Naka, Shun-ichi
• Primary Examiner(s): Hannaher, Constantine
• Assistant Examiner(s): Glick, Edward J.
• Application Number:
  US07/650,238
• Time in Patent Office: 932 Days
• Field of Search: 359/619, 359/620, 359/621, 359/622, 359/623, 359/741, 359/642, 359/900
• US Class Current: 359/619
• CPC Class Codes: B29D 11/00278 Lenticular sheets B29D11/00269 takes precedence
• CPC Class Codes: G02B 3/0018 Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: G02B 3/0068 arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements G02B5/1885, G02B17/002, G02B30/27 take precedence
• CPC Class Codes: G02B 5/201 in the form of arrays
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14868 CCD or CID colour imagers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/02162 for filtering or shielding light, e.g. multicolour filters for photodetectors
• CPC Class Codes: H01L 31/02164 for shielding light, e.g. light blocking layers, cold shields for infrared detectors
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216

Abstract

In a solid image pickup device, a plurality of microlenses are provided on a substrate having light receiving portions in opposition to the light receiving portions so that incident light can converge onto the light receiving portions. The microlenses are covered with a transparent resin layer having a refractive index smaller than that of the microlenses. Therefore, the solid image pickup device, even when packaged in a molded body made of a resin having a refractive index similar to that of the microlenses, can realize good sensitivity because the microlenses can effectively operate as condenser lenses due to the resin layer between the molded body and the microlenses.

Claims

1. A solid image pickup device comprising:

a substrate having light receiving portions;

a plurality of first spherical microlenses provided on said substrate having said light receiving portions, said plurality of first spherical microlenses forming a single layer such that each light receiving portion of said substrate is positioned under one of said plurality of first spherical microlenses, said microlenses being opposite said light receiving portions so that incident light can converge onto said light receiving portions; and

a first transparent resin layer having a refractive index smaller than that of said microlenses and being positioned directly on said microlenses so as to receive the incident light prior to the light being converged by said microlenses.

2. The solid image pickup device as claimed in claim 1, further comprising:

a plurality of second spherical microlenses formed on said first transparent resin layer such that said microlenses are double-layered, the second microlenses forming an upper layer, the second microlenses being larger in shape than the first microlenses, the first microlenses forming a lower layer; and

a second transparent resin layer formed to cover the upper layer of second microlenses.

3. The solid image pickup device as claimed in claim 1, further comprising:

a molded-body for housing said microlenses, said transparent resin layer, and said substrate.

4. The solid image pickup device as claimed in claim 1, wherein said first microlenses are increased in optical density by adding a metal oxide to a base material of said first microlenses.

5. The solid image pickup device as claimed in claim 1, wherein said first microlenses are increased in optical density by introducing an aromatic ring into a base material of said first microlenses.

6. The solid image pickup device as claimed in claim 1, wherein said first microlenses are increased in optical density by introducing a halogenated alkyl group into a base material of said first microlenses.

7. The solid image pickup device as claimed in claim 1, wherein a base material of said first microlenses is selected from a group of polymide resin, polyether amide resin, polystyrene resin, acrylic resin, novolak resin, polyethylene, and ethyl methacrylate.

10. The solid image pickup device as claimed in claim 1, wherein said microlenses are increased in optical density by introducing an aromatic ring into a base material of said microlenses.

11. The solid image pickup device as claimed in claim 1, wherein said microlenses are increased in optical density by introducing a halogenated alkyl group into a base material of said microlenses.

8. The solid image pickup device comprising:

a substrate having light receiving portions;

a plurality of spherical microlenses provided on said substrate having said light receiving portions, said plurality of spherical microlenses forming a single layer such that each light receiving portion of said substrate is positioned under one of said plurality of spherical microlenses, said microlenses being opposite said light receiving portions so that incident light can converge onto said light receiving portions; and

a molded body made of a transparent resin formed directly on said microlenses and around said substrate;

said microlenses have a refractive index larger than that of said molded body such that the incident light travels from said molded body having a first refractive index to said microlenses having larger refractive index than said first refractive index.

9. The solid image pickup device as claimed in claim 8, wherein said microlenses are increased in optical density by adding a metal oxide to a base material of said microlenses.

12. The solid image pickup device as claimed in claim 8, wherein a base material of said microlenses is selected from a group of polymide resin, polyether amide resin, polystyrene resin, acrylic resin, novolak resin, polyethylene, and ethyl methacrylate.

13. A method for forming microlenses on a substrate provided with color filters which cover light receiving portions in a solid image pickup device, comprising the steps of:

(a) forming a layer of a photosensitive resin which has permeability to light and a refractive index of 1.65 or more on a substrate which has a plurality of light receiving portions arrayed in one or more rows;

(b) selectively photo-etching the photosensitive resin layer in a square or stripe pattern to leave the photosensitive resin layer in a sectionally rectangular shape on the substrate in positions corresponding to respective ones of the light receiving portions or positions corresponding to respective rows of the light receiving portions;

(c) applying a heat treatment to the substrate provided with the photosensitive resin layer at a temperature not affecting properties of the color filters; and

(d) irradiating the photosensitive resin layer with ultraviolet light during execution of said step (c) so that photo active groups contained int eh photosensitive resin decompose, the photosensitive resin being softened at said step (c) so as to be semi-spherically or semi-cylindrically shaped by surface tension of the photosensitive resin;

said step (c) heating the photosensitive resin layer at a temperature below 160°

C.

14. The method as claimed in claim 13, wherein said step (d) irradiates near ultraviolet light onto the photosensitive resin layer.