Formulation of multichip modules
First Claim
1. A subsystem, packaged on a flexible carrier, for providing function in a computer system, comprising:
- a flexible dielectric carrier having circuitized lines with plural I/O interconnection points formed on at least one side thereof;
at least one layer of dielectric material, adjacent said circuitized lines, having at least one via formed therein to electrically expose said I/O interconnection points of said flexible carrier; and
at least one IC device, disposed on a top one of said at least one dielectric layer, such that I/O interconnection points of said IC are vertically aligned and electrically interconnected with corresponding ones of said flexible carrier I/O interconnection points.
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Accused Products
Abstract
A method of reducing the area of MCMs that are integral to a flexible carrier is provided. A locally complex area, i.e. multilayer MCM carrier is constructed on a flex carrier, along with other components to form a subsystem. The flex carrier provides the interface between the MCM and the system that is utilizing the function. Also, the flex carrier will receive non-complex portions of the function, e.g. low I/O devices, not required to be mounted on the complex area (MCM) of the subsystem. The locally complex functional area will contain the high performance DCA mounted components, such as custom ASICs, processors, high frequency analog parts and other high I/O chips. The MCM on flex is constructed by obtaining an appropriate flexible carrier, such as a dielectric material having electrically conductive signal lines circuitized on both sides. A photoimageable dielectric layer is then placed over the appropriate portion of the circuitized carrier and vias are formed therein and filled with electrically conductive material. The top side of the dielectric layer is then circuitized and electrically connected to the flex carrier wiring layers as required. Additional layers are then built as needed by an identical process. Electrically conductive pads are formed on the top circuitized dielectric layer in order to provide an interconnection point for the chip I/Os that will be directly attached thereto.
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Citations
11 Claims
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1. A subsystem, packaged on a flexible carrier, for providing function in a computer system, comprising:
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a flexible dielectric carrier having circuitized lines with plural I/O interconnection points formed on at least one side thereof; at least one layer of dielectric material, adjacent said circuitized lines, having at least one via formed therein to electrically expose said I/O interconnection points of said flexible carrier; and at least one IC device, disposed on a top one of said at least one dielectric layer, such that I/O interconnection points of said IC are vertically aligned and electrically interconnected with corresponding ones of said flexible carrier I/O interconnection points. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification