Method for making piezoelectric composites

• US 5,239,736 A
• Filed: 11/12/1991
• Issued: 08/31/1993
• Est. Priority Date: 11/12/1991
• Status: Expired due to Term

• Current Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Original Assignee: Acuson Corporation (Siemens AG)
• Inventors: Mohr, John P. III, Sliwa, John W. Jr., Ayter, Sevig
• Primary Examiner(s): ECHOLS, PERCY W
• Application Number:
  US07/790,815
• Time in Patent Office: 658 Days
• Field of Search: 29/25.32, 29/412, 29/416, 29/418, 310/334
• US Class Current: 29/25.35
• CPC Class Codes: B06B 1/06 operating with piezoelectric effect or with electrostriction piezoelectric or electrostrictive devices per se H10N30/00
• CPC Class Codes: H04R 17/08 signals being recorded or played back by vibration of a stylus in two orthogonal directions simultaneously
• CPC Class Codes: H10N 30/092 Forming composite materials
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49789 Obtaining plural product pieces from unitary workpiece
• CPC Class Codes: Y10T 29/49799 Providing transitory integral holding or handling portion

Abstract

A method is described for making a piezoelectric composite for building an acoustic transducer from two or more pieces of piezoelectric material. Each piece of material is cut to form slots or trenches having a uniform pitch spacing and material portions of uniform width such that the material portions of one piece may be received within the slots or trenches of the other. The pieces are then interdigitated and joined to make the piezoelectric composite.

Claims

1. A method for making a piezoelectric composite from two or more pieces of piezoelectric or electrostrictive material comprising the steps of:

forming two structures each comprised of piezoelectric elements of width W separated by a gap distance K on a pitch spacing P;

interdigitating the two structures, the elements of one structure being interdigitated with the elements of the other structure;

joining the interdigitated elements to form a composite suitable for use in an acoustic transducer;

removing those portions of piezoelectric material of each structure that interconnect the ends of elements;

then coating the opposite surfaces of the composite to interconnect the elements with an electrically conductive layer.

2. The method of claim 1 wherein the elements of piezoelectric material are joined such that P>

K>

W.

3. The method of claim 1 and further comprising the step of prewetting the elements of each structure with a settable polymer prior to interdigitation, said polymer joining the elements of the two structures upon subsequent interdigitation and solidification.

4. The method of claim 1 wherein the gaps or kerfs between elements of at least one structure is coated or filled with microspheres prior to interdigitation, said microspheres providing a uniformity of spacing between interdigitated elements.

5. A method for making a composite piezoelectric device from two or more pieces of piezoelectric and/or electrostrictive material comprising the steps of:

cutting each of two pieces of material to form slots, trenches or through-cuts therein, said slots, trenches or cuts separating two or more portions of each piece by a gap distance K, said slots, trenches or cuts being formed on a pitch-spacing P and forming material portions or elements of width W such that the two pieces of material may be interdigitated;

interdigitating the two pieces of material, the material portion of one piece being received in the slots, trenches or cuts of the second piece and vice versa;

joining the two interdigitated pieces to form a composite device;

removing those portions of piezoelectric material of each structure that interconnect the end of elements;

then coating the opposite surfaces of the composite to interconnect the elements with an electrically conductive layer.

6. The method of claim 5 wherein the elements of piezoelectric material are joined such that P>

K>

W.

7. The method of claim 5 and further comprising the step of prefilling or prewetting the slots of each piece of material to be interdigitated with a settable polymer prior to interdigitation, said polymer joining the two pieces upon interdigitation and subsequent solidification.

8. The method of claim 5 wherein said material is a piezoelectric or electrostrictive material and is cut to form portions of width W less than seven-tenths of the thickness D.

9. The method of claim 5 further utilizing the steps of cutting, interdigitation and joining two pieces of material to produce a final composite having a two-dimensional wave transmission or reception capability utilizing starting materials which consist of two structures formed by the method of claim 5.

10. The method of claim 5 or 9, and vertically stacking and laminating the structures to form a piezoelectric composite having a three-dimensional wave transmission or reception capability.

11. The method of claims 5 or 9 wherein said composite structure is subsequently deformed into a curved surface for purposes of achieving a degree of mechanical focussing of either transmitted or received ultrasonic waves.

12. The method of claim 5 wherein the step of cutting is accomplished utilizing any combination of mechanical abrasive sawing, laser cutting, ultrasonic cutting, electrodischarge machining and wet or dry etching.

13. The method of claim 5 wherein said composite structure is formed with multiple and different thicknesses of piezoelectric starting materials to achieve broadband functionality.

14. The method of claim 5 wherein said two pieces of material are cut to form a plurality of complementary and matching arrays of slots, strips or posts.

15. A method for making a composite piezoelectric device from two or more slabs or piezoelectric material, each slab at least initially having a substantially planar surface, and comprising the steps of:

forming a plurality of parallel slots, trenches, or through-cuts in the surface of each slab, said slots, trenches or through-cuts being formed on a pitch spacing P and defining therebetween material portions or elements of width W, each slot, trench or through-cut separating adjacent element portions by a gap distance K such that the material portions of the two slabs may be interdigitated;

interdigitating the two slabs, the portions of one slab being received int he slots, trenches or through-cuts of the second slab and vice versa;

joining the two slabs to form a composite device;

removing those portions of piezoelectric material of each structure that interconnect the ends of elements;

then coating the opposite surfaces of the composite to interconnect the elements with an electrically conductive layer.

16. The method of claim 15 wherein said slabs are cut or diced such that P>

K>

W.

17. A method for making a composite piezoelectric device of two or three dimensions comprising the steps of claim 15 to form a first acoustic transducer having one-dimension, then forming a plurality of second slots perpendicular to the slots already formed in each slab, said second slots separating two or more portions by a gap distance K₁, said slots being formed on a pitch spacing P₁ and forming material portions of width W₁ ;

forming a plurality of parallel slots in the surface of a third slab of piezoelectric material, said slots being formed on a pitch spacing P₁ and defining therebetween material portions of width W₁, each slot separating adjacent portions by a gap distance K₁ ;

interdigitating the third slab with the first acoustic transducer, the portions of the third slab being received in the second slots of the first acoustic transducer and vice versa; and

then joining the two structures to form a composite acoustic transducer structure of two-dimension or greater.

18. The method of claim 17 wherein said first acoustic transducer and third slab are cut or diced such that P₁ >

K₁ >

W₁.