Semiconductor acceleration sensor with reduced cross axial sensitivity

• US 5,239,870 A
• Filed: 09/20/1991
• Issued: 08/31/1993
• Est. Priority Date: 09/21/1990
• Status: Expired due to Fees

• Current Assignee: Nissan Motor Co., Ltd.
• Original Assignee: Nissan Motor Co., Ltd.
• Inventors: Kaneko, Hiroyuki
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US07/763,159
• Time in Patent Office: 711 Days
• Field of Search: 73/517 R, 73/510, 338/2, 338/5, 338/46
• US Class Current: 73/514.33
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges

Abstract

A semiconductor acceleration sensor with a reduced cross axial sensitivity, which is easily manufacturable. In this semiconductor acceleration sensor, two sensor units are provided on two cantilever beams which have the identical shape and are arranged on the same plane in mutually opposite orientations, and a bridge circuit is formed by the piezoresistors of these two sensor units, such that the cross axial sensitivity of the semiconductor acceleration sensor can be reduced significantly. The bridge circuit to be formed can be a half bridge circuit, or a full bridge circuit in which case the piezoresistors of the second sensor unit are arranged to be oriented along a direction perpendicular to that along which the piezoresistors of the first sensor unit are arranged to be oriented. This semiconductor acceleration sensor can be manufactured monolithically on a single semiconductor substrate, or from separately manufactured acceleration sensors.

Claims

1. A semiconductor accelerator sensor, comprising:

a frame;

a first cantilever beam with its fixed end attached to the frame, having a first weight portion on its free end;

first sensor means for detecting an acceleration, formed by piezoresistors provided in a vicinity of the fixed end of the first cantilever beam;

a second cantilever beam with its fixed end attached to the frame, having a second weight portion on its free end, the second cantilever beam having an overall shape identical to that of the first cantilever beam, and oriented along a direction opposite to that along which the first cantilever beam is oriented; and

second sensor means for detecting an acceleration, formed by piezoresistors provided in a vicinity of the fixed end of the second cantilever beam, the piezoresistors of the second sensor means being connected with the piezoresistors of the first sensor means to form a bridge circuit, wherein the piezoresistors of the second sensor means are arranged to be oriented along a direction perpendicular to the direction along which the piezoresistors of the first sensor means are arranged to be oriented.

2. The semiconductor acceleration sensor of claim 1, wherein the bridge circuit formed by the piezoresistors of the second sensor means and the piezoresistors of the first sensor means is a full bridge circuit.

3. The semiconductor acceleration sensor of claim 1, wherein each of the first cantilever beam and the second cantilever beam has a thickness significantly smaller than a width.

4. The semiconductor acceleration sensor of claim 1, wherein the frame, first cantilever beam, first sensor means, second cantilever beam, and second sensor means are formed monolithically on a single semiconductor substrate.

5. A semiconductor acceleration sensor, comprising:

a package substrate having a first base and a second base;

a first cantilever beam with its fixed end attached to the first base, having a first weight portion on its free end;

first sensor means for detecting an acceleration, formed by piezoresistors provided in a vicinity of the fixed end of the first cantilever beam;

a second cantilever beam with its fixed end attached to the second base, having a second weight portion on its free end, the second cantilever beam having an overall shape identical to that of the first cantilever beam, and oriented along a direction opposite to that along which the first cantilever beam is oriented; and

second sensor means for detecting an acceleration, formed by piezoresistors provided in a vicinity of the fixed end of the second cantilever beam, the piezoresistors of the second sensor means being connected with the piezoresistors of the first sensor means to form a bridge circuit, wherein the piezoresistors of the second sensor means are arranged to be oriented along a direction perpendicular to the direction along which the piezoresistors of the first sensor means are arranged to be oriented.

6. The semiconductor acceleration sensor of claim 5, wherein the bridge circuit formed by the piezoresistors of the second sensor means and the piezoresistors of the first sensor means is a full bridge circuit.

7. The semiconductor acceleration sensor of claim 5, wherein each of the first cantilever beam and the second cantilever beam has a thickness significantly smaller than a width.

8. The semiconductor acceleration sensor of claim 5, wherein the first cantilever beam and the second cantilever beam are manufactured separately.