Three dimensional, multi-chip module

• US 5,241,450 A
• Filed: 03/13/1992
• Issued: 08/31/1993
• Est. Priority Date: 03/13/1992
• Status: Expired due to Fees

• Current Assignee: United States Department of Energy
• Original Assignee: United States Department of Energy
• Inventors: Petersen, Robert W., Bernhardt, Anthony F.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US07/850,642
• Time in Patent Office: 536 Days
• Field of Search: 357/74, 357/75, 357/81, 361/393, 361/396, 361/406, 361/412, 361/413, 361/414, 361/382, 361/385, 361/386-389
• US Class Current: 361/689
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/1627 stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: H05K 7/023 Stackable modules

Abstract

A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow "dummy chips" are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned o the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

Claims

1. A three-dimensional, hybrid, multi-chip module, comprising:

(a) a plurality of circuit boards 11, arranged in a stack, each board having a top surface 20 and a bottom surface 21, wherein each circuit board comprises;

a chip interconnect 22, formed at the top surface 20 of each circuit board, comprising a plurality of conductors 28,29 within each chip interconnect 22;

(b) a plurality of integrated circuit chips 23, mounted on the top surface 20 of each circuit board, in electrical communication with the respective chip interconnect 22;

(c) a plurality of means for electrically connecting chips to their respective chip interconnect 22;

(d) a spacer member 30, mounted on the top surface 20 of at least one circuit board and connected to the bottom surface of a second, overlaying circuit board whereby adjacent boards in the stack are spaced apart;

(e) a board interconnect 32-35, formed on at least a top surface 403 of the spacer member 30 on each board, in electrical communication with the chip interconnect 22 on the respective circuit board; and

(f) a plurality of means on the bottom surface 21 of each circuit board, in electrical communication with the chip interconnect 22 on the respective circuit board ;

wherein the circuit boards in the stack are electrically interconnected.

2. A module as recited in claim 1, wherein the electrical connection means in (c) comprise:

a plurality of interconnect conductors 26,27 on a top surface and at least one side of each integrated circuit chip 23, in electrical communication with the conductors 28,29 within each chip interconnect 22 on the respective circuit board.

3. A module as recited in claim 1, wherein the interconnect means in (f) comprise:

a plurality of side conductors 41-44, extending along a side 45 and bottom surface 21 of each circuit board, in electrical communication with the chip interconnect 22 on the respective circuit board.

4. A module as recited in claim 3, wherein the interconnect means in (f) further comprise:

a plurality of conductive bonding elements 46, connecting the board interconnect 32-35 on top of the spacer member 30 to at least one of the side conductors 41-44 on the bottom surface 21 of an overlaying circuit board in the stack.

5. A module as recited in claim 1, further comprising a plurality of spacer members that form a wall around the periphery of at least one circuit board.

6. A module as recited in claim 1, wherein at least one circuit board comprises a silicon substrate.

7. A module as recited in claim 1, wherein at least one circuit board comprises an aluminum nitride substrate.

8. A module as recited in claim 1, wherein at least one circuit board comprises a co-fired ceramic substrate.

9. A module as recited in claim 1, wherein each chip interconnect comprises a planarized thin film.

10. A module as recited in claim 1, further comprising a plurality of board interconnects, wherein at least one board interconnect is selected from the group consisting of power conductors and ground conductors.

11. A module as recited in claim 1, further comprising a plurality of board interconnects, wherein at least one board interconnect comprises a transmission line.

12. A module as recited in claim 1, wherein at least one board interconnect comprises a thin film conductor that is laser-patterned on the respective spacer member and circuit board using laser pantography.

13. A module as recited in claim 3, wherein at least one side conductor is selected from the group consisting of power conductors, ground conductors, and transmission lines.

14. A module as recited in claim 4, wherein the conductive bonding elements comprise solder bump bonds.

15. A module as recited in claim 1, further comprising:

a microchannel cooling member coupled with at least one circuit board.

16. A module as recited in claim 1, further comprising:

a microchannel cooling system mounted on at least one integrated circuit chip.

17. A module as recited in claim 16, wherein the cooling system comprises:

a channeled substrate having a plurality of coolant channels, wherein the substrate is bonded to a surface of at least one chip;

a channel cover, having a first and second opening, and bonded to the channeled substrate over the coolant channels to provide a coolant path from the first opening to the second opening through the plurality of coolant channels;

a coolant supply manifold bonded to at least one channel cover, providing a coolant path to the first opening of the channel cover and from the second opening of the channel cover; and

a compressible seal between the coolant supply manifold and the channel cover.

18. A module as recited in claim 1, further comprising:

a plurality of test probe pads on the bottom surface of at least one circuit board, in electrical communication with the chip interconnect on the top surface of the respective circuit board.

19. A module as recited in claim 18, wherein the test probe pads comprise side conductors that are expanded in two dimensions on the bottom surface of the circuit board for inspecting the operability of at least one circuit board.

20. A module as recited in claim 1, further comprising:

at least one pedestal, bonded to the top surface of at least one lower board and the bottom surface of an overlaying upper board, having a height equal to the spacer member, and providing a heat flow path between the lower and upper boards.

21. A module as recited in claim 20, further comprising:

an intermodule interconnect, supported by the pedestal and connecting the chip interconnects on the upper and lower circuit boards.

22. A module as recited in claim 21, wherein the intermodule interconnect is selected from the group consisting of ground conductors, power conductors, and transmission lines.

23. An integrated circuit package, comprising:

(a) a first circuit board, having a top and a bottom surface, comprising;

a first chip interconnect, formed at the top surface of the first board, comprising a plurality of conductors within the first chip interconnect;

(b) a second circuit board, having a top and a bottom surface, the second board overlaying the first board and comprising;

a second chip interconnect, formed at the top surface of the second board, comprising a plurality of conductors within the second chip interconnect;

(c) a plurality of integrated circuit chips, mounted on the top surface of each circuit board, in electrical communication with the respective chip interconnect;

(d) a plurality of means for electrically connecting chips to their respective chip interconnect;

(e) a spacer member, mounted on the top surface of the first board and connected to the bottom surface of the second board whereby the first and second boards are spaced apart;

(f) a plurality of board interconnects, each formed on at least a top surface of the spacer member on the first board, in electrical communication with the first chip interconnect; and

(g) a plurality of means on the bottom surface of each circuit board, in electrical communication with the chip interconnect on the respective circuit board;

wherein the first and second circuit boards are electrically interconnected.

24. An integrated circuit package as recited in claim 23, wherein the electrical connection means in (d) comprise:

a plurality of interconnect conductors on a top surface and at least one side of each integrated circuit chip, in electrical communication with the chip interconnect on the respective board.

25. An integrated circuit package as recited in claim 23, wherein the interconnect means in (g) comprise:

a plurality of side conductors, extending along a side and bottom surface of the second board, in electrical communication with the second board interconnect.

26. An integrated circuit package as recited in claim 25, wherein the interconnect means in (g) further comprise:

a plurality of conductive bonding elements, connecting the side conductors on the bottom surface of the second board to the board interconnects on top of the spacer member on the first board, providing electrical communication between the first and second boards.

27. An integrated circuit package as recited in claim 23, wherein at least one circuit board comprises a silicon substrate.

28. An integrated circuit package as recited in claim 23, wherein at least one circuit board comprises an aluminum nitride substrate.

29. An integrated circuit package as recited in claim 23, wherein at least one circuit board comprises a co-fired ceramic substrate.

30. An integrated circuit package as recited in claim 23, wherein each chip interconnect comprises a planarized thin film.

31. An integrated circuit package as recited in claim 23, wherein the chips are mounted on the respective circuit boards by conductive bonds selected from the group consisting of thin film eutectic bonds, solder bump bonds, and flip-chip bonds.

32. An integrated circuit package as recited in claim 23, further comprising a plurality of spacer members that form a wall around the periphery of at least one circuit board.

33. An integrated circuit package as recited in claim 23, wherein at least one spacer member is mounted on the top surface of the first circuit board by a conductive bond selected from the group consisting of thin film eutectic bonds and solder bump bonds.

34. An integrated circuit package as recited in claim 23, wherein at least one of the board interconnects is selected from the group consisting of power conductors and ground conductors.

35. An integrated circuit package as recited in claim 23, wherein at least one of the board interconnects comprises a transmission line.

36. An integrated circuit package as recited in claim 23, wherein the board interconnects on at least one circuit board comprise thin film conductors that are laser-patterned on the respective spacer members and circuit boards using laser pantography.

37. An integrated circuit package as recited in claim 25, wherein at least one side conductor is selected from the group consisting of power conductors, ground conductors, and transmission lines.

38. An integrated circuit package as recited in claim 23, wherein the conductive bonding elements comprise solder bump bonds.

39. An integrated circuit package as recited in claim 23, further comprising:

a microchannel cooling member in heat flow communication with at least one circuit board.

40. An integrated circuit package as recited in claim 23, further comprising:

a microchannel cooling system mounted in heat flow communication with at least one integrated circuit chip.

41. An integrated circuit package as recited in claim 40, wherein the cooling system comprises:

a channeled substrate having a plurality of coolant channels, wherein the substrate is bonded to a surface of at least one chip;

a channel cover, having a first and second opening, and bonded to the channeled substrate over the coolant channels to provide a coolant path from the first opening to the second opening through the plurality of coolant channels;

a coolant supply manifold bonded to at least one channel cover, providing a coolant path to the first opening of the channel cover and from the second opening of the channel cover; and

a compressible seal between the coolant supply manifold and the channel cover.

42. An integrated circuit package as recited in claim 23, further comprising:

a plurality of test probe pads on the bottom surface of at least one circuit board, in electrical communication with the chip interconnect on the top surface of the respective circuit board.

43. An integrated circuit package as recited in claim 23, further comprising:

a pedestal, bonded to the top surface of the first board and the bottom surface of the second board, having a height equal to the spacer members, and providing a heat flow path between the first and second boards.

44. An integrated circuit package as recited in claim 43, further comprising:

an intermodule interconnect, supported by the pedestal and connecting the chip interconnects on the first and second circuit boards.

45. An integrated circuit package as recited in claim 44, wherein the intermodule interconnect is selected from the group consisting of ground conductors, power conductors, and transmission lines.

46. A three-dimensional, hybrid, wafer-scale package including multi-chip modules, comprising:

(a) a stack of circuit boards, each board having a top surface, a bottom surface, and side surfaces, wherein each circuit board comprises;

a chip interconnect, formed at the top surface of each circuit board, comprising a plurality of conductors within each chip interconnect;

(b) a plurality of integrated circuit chips, mounted on the top surface of each circuit board, in electrical communication with the respective chip interconnect;

(c) a plurality of means for electrically connecting chips to their respective chip interconnect;

(d) a plurality of spacer members, mounted on the top surface of at least one circuit board and connected to the bottom surface of a second, overlaying circuit board, whereby adjacent circuit boards in the stack are spaced apart in the stack, and chips do not touch the bottom surface of an overlaying circuit board;

(e) a plurality of thin film board interconnects, formed on the spacer members on each board, in electrical communication with the chip interconnect on the respective board;

(f) a plurality of means on the bottom surface of each circuit board, in electrical communication with the chip interconnect on the respective circuit board wherein the circuit boards in the stack are electrically interconnected.

47. A three-dimensional module as recited in claim 46, wherein the electrical connection means in (c) comprise:

a plurality of interconnect conductors on a top surface and at least one side of each integrated circuit chip, in electrical communication with the conductors within each chip interconnect on the respective circuit board.

48. A three-dimensional module as recited in claim 46, wherein the interconnect means in (f) comprise:

a plurality of side conductors, extending along a side and bottom surface of each circuit board, in electrical communication with the chip interconnect on the respective circuit board.

49. A three-dimensional module as recited in claim 48, wherein the interconnect means in (f) further comprise:

a plurality of conductive bonding elements, connecting the board interconnect on top of the spacer member to at least one of the side conductors on the bottom surface of an overlaying circuit board in the stack.

50. A three-dimensional module as recited in claim 46, wherein at least one circuit board comprises a silicon substrate.

51. A three-dimensional module as recited in claim 46, wherein at least one circuit board comprises an aluminum nitride substrate.

52. A three-dimensional module as recited in claim 46, wherein at least one circuit board comprises a co-fired ceramic substrate.

53. A three-dimensional module as recited in claim 46, wherein the stack of circuit boards including spacer members is substantially cube-shaped to minimize propagation distances for signals communicated among the integrated circuit chips in the stack.

54. A three-dimensional module as recited in claim 46, wherein each chip interconnect comprises a planarized thin film.

55. A three-dimensional module as recited in claim 46, wherein the integrated circuit chips are connected to the respective chip interconnect by conductive bonds selected from the group consisting of solder bump bonds, thin film eutectic bonds, and flip-chip bonds.

56. A three-dimensional module as recited in claim 46, wherein at least one board interconnect is selected from the group consisting of power and ground conductors.

57. A three-dimensional module as recited in claim 46, wherein at least one board interconnect comprises a transmission line.

58. A three-dimensional module as recited in claim 46, wherein at least one board interconnect comprises a laser-patterned thin film conductor extending along an inside surface and over the top of at least one spacer member.

59. A three-dimensional module as recited in claim 46, wherein the spacer members form a wall around a perimeter of at least one circuit board.

60. A three-dimensional module as recited in claim 46, further comprising:

a spacer conductor, situated between at least one spacer member and the respective chip interconnect; and

a solder bump bond between the conductors in the chip interconnect and the spacer conductor, providing electrical communication.

61. A three-dimensional module as recited in claim 60, wherein the spacer conductor comprises a thin film conductor laser-patterned on the spacer member using laser pantography.

62. A three-dimensional module as recited in claim 46, further comprising:

a microchannel cooling member in heat flow communication with at least one circuit board in the stack.

63. A three-dimensional module as recited in claim 46, further comprising:

a microchannel cooling system mounted in heat flow communication with at least one integrated circuit chip.

64. A three-dimensional module as recited in claim 63, wherein each microchannel cooling system comprises:

a channeled substrate having a plurality of coolant channels, wherein the substrate is mounted on at least one chip;

a channel cover, having a first and second opening, and bonded to the channeled substrate over the coolant channels to provide a coolant path from the first opening to the second opening through the plurality of coolant channels;

a coolant supply manifold bonded to at least one channel cover, providing a coolant path to the first opening of the channel cover and from the second opening of the channel cover; and

a compressible seal between the coolant supply manifold and the channel cover.

65. A three-dimensional module as recited in claim 46, further comprising:

a plurality of test probe pads on the bottom surface of at least one circuit board, in electrical communication with the chip interconnect on the top surface of the respective board.

66. A three-dimensional module as recited in claim 61, wherein the test probe pads comprise side conductors that are expanded in two dimensions on the bottom surface of the circuit board for inspecting the operability of at least one circuit board.