Capacitive type semiconductor accelerometer

• US 5,243,861 A
• Filed: 09/06/1991
• Issued: 09/14/1993
• Est. Priority Date: 09/07/1990
• Status: Expired due to Fees

• Current Assignee: Hitachi Automotive Engineering Company Limited (Hitachi, Ltd.), Hitachi, Ltd.
• Original Assignee: Hitachi Automotive Engineering Company Limited (Hitachi, Ltd.), Hitachi, Ltd.
• Inventors: Koide, Akira, Kawai, Yukiko, Kloeck, Benjamin, Sato, Kazuo, Matsumoto, Masahiro, Miki, Masayuki, Ichikawa, Norio, Ebine, Hiromichi, Suzuki, Seiko, Tsuchitani, Shigeki
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US07/755,838
• Time in Patent Office: 739 Days
• Field of Search: 73/517 R, 73/517 B, 361/280, 361/283, 257/418, 257/417
• US Class Current: 73/514.32
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Abstract

A capacitive type semiconductor accelerometer has an intermediate silicon plate of n type conductivity including a movable electrode constituting a pendulum mass formed within the intermediate silicon plate and supported thereby via a beam so as to permit movement in a direction perpendicular to its plane. A first conductive island is formed within the intermediate plate and is immovably supported thereby via a first insulating leg so as to be isolated therefrom, and an upper glass plate is anodic bonded to the intermediate silicon plate. A first stationary electrode is formed on the upper glass plate at the position facing one face of the movable electrode with a predetermined gap. A lower glass plate is anodic bonded to the intermediate silicon plate and a second stationary electrode is formed on the lower glass plate at the position facing the other face of the movable electrode with a predetermined gap. First, second and third pads are disposed in common on the lower glass plate at the outside of the intermediate silicon plate, the first pad being electrically connected to the first stationary electrode via a first thin film lead formed on the lower glass plate and the first conductive island, the second pad being electrically connected to the movable electrode via a second thin film lead formed on the lower glass plate and the intermediate silicon plate and the third pad being electrically connected to the second stationary electrode via a third thin film lead formed on the lower glass plate.

Claims

1. A capacitive type semiconductor accelerometer comprising:

an intermediate silicon plate;

a movable electrode constituting a pendulum mass formed within said intermediate silicon plate and supported thereby via a beam so as to permit movement into direction substantially perpendicular to its plane;

a first conductive island formed within said intermediate silicon plate and immovably supported thereby via a first leg;

an upper glass plate bonded to said intermediate silicon plate;

a first stationary electrode formed on said upper glass plate at the position facing to one face of said movable electrode with a predetermined gap;

a lower glass plate bonded to said intermediate silicon plate;

a second stationary electrode formed on said lower glass plate at the position facing to the other face of said movable electrode with a predetermined gap; and

a first, second and third pad being disposed on said lower glass plate at the outside of said intermediate silicon plate, said first pad being electrically connected to said first stationary electrode via a first thin film lead formed on said lower glass plate and said first conductive island, said second pad being electrically connected to said movable electrode via a second thin film lead formed on said lower glass plate and said intermediate silicon plate and said third pad being electrically connected to said second stationary electrode via a third thin film lead formed on said lower glass plate.

2. A capacitive type semiconductor accelerometer according to claim 1, wherein said first leg is constituted by an insulating material selected from the group consisting of thermal oxides and silicon nitride.

3. A capacitive type semiconductor accelerometer according to claim 1 further comprising;

a second conductive island formed within said intermediate silicon plate and immovably supported by said intermediate silicon plate via a second leg.

4. A capacitive type semiconductor accelerometer according to claim 3, wherein said intermediate silicon plate is an n type semiconductor.

5. A capacitive type semiconductor accelerometer according to claim 4, wherein said first and second legs are constituted by a P⁺⁺ element obtained by diffusing an impurity material into the corresponding portions of said intermediate silicon plate.

6. A capacitive type semiconductor accelerometer according to claim 1, wherein said movable electrode is provided with insulating films at the corners on the both faces facing respectively to said first and second stationary electrodes.

7. A capacitive type semiconductor accelerometer according to claim 1, wherein said intermediate silicon plate is provided with first and second series of triangular shaped projections coated with an insulating film on the surfaces facing respectively to said first and third thin film leads, said series of triangular shaped projections being forced into said first and third thin film leads during bonding operation of said intermediate silicon plate and said lower glass plate thereby to hermetically seal between said intermediate silicon plate and said lower glass plate as well as to electrically isolate therebetween.

8. A capacitive type semiconductor accelerometer according to claim 7, wherein said intermediate silicon plate is n type conductivity and is provided with a n⁺ type region on the surface facing to said second thin film lead.

9. A capacitive type semiconductor accelerometer according to claim 1, wherein said intermediate silicon plate is provided with first and second apertures at the positions facing to said first and third thin film leads, and said first and second apertures are closed with an insulating material to thereby hermetically seal between said intermediate silicon plate and said lower glass plate and as well as to electrically isolated therebetween.

10. A capacitive type semiconductor accelerometer according to claim 9, wherein said first and second apertures are closed by a sputtering or a chemical vapor deposition operation.

11. A capacitive type semiconductor accelerometer according to claim 9, wherein said insulated material is selected from the group consisting of low melting point glasses and silicone rubber.