Enclosure for electronic devices

• US 5,244,707 A
• Filed: 01/10/1992
• Issued: 09/14/1993
• Est. Priority Date: 01/10/1992
• Status: Expired due to Fees

• Current Assignee: Alpha Fry Limited (Element Solutions Inc)
• Original Assignee: Staystik Incorporated
• Inventors: Shores, A. Andrew
• Primary Examiner(s): Thomas, Alexander S.
• Application Number:
  US07/818,880
• Time in Patent Office: 613 Days
• Field of Search: 428/76, 428/331, 357/72, 357/74, 206/328, 524/444, 523/466
• US Class Current: 428/76
• CPC Class Codes: C08K 3/34 Silicon-containing compounds
• CPC Class Codes: C08L 2666/54 Inorganic substances
• CPC Class Codes: C09D 201/00 Coating compositions based on unspecified macromolecular compounds
• CPC Class Codes: C09J 201/00 Adhesives based on unspecified macromolecular compounds
• CPC Class Codes: H01L 23/26 including materials for absorbing or reacting with moisture or other undesired substances , e.g. getters
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/239 Complete cover or casing
• CPC Class Codes: Y10T 428/259 Silicic material

Abstract

A sealed enclosure of an electronic device incorporates a coating or adhesive with desiccant properties. The coating or adhesive comprises a protonated alumino silicate powder dispersed in a polymer.

Claims

1. A sealed enclosure surrounding an electronic device and a coating or adhesive with desiccant properties, said coating or adhesive comprising a powder dispersed in a polymer containing the elements carbon and hydrogen and one or more of the elements oxygen, nitrogen, sulfur, halogen, and silicon in its repeating unit, said powder being a protonated alumino silicate of:

the formula H.AlO₂.(SiO₂)_x, x=1-20

void fraction 10-50 volume percent

average pore diameter 2.5-15 Angstrom

average particle size 0.2-100 micrometer, and

said powder to said polymer weight ratio being 0.001-2.

2. An enclosure as in claim 1, wherein said polymer is a thermoplastic selected from the group consisting of polysulfone, polyetherimide, polyester, phenoxy resin, polyacrylate, and polyurethane.

3. An enclosure as in claim 1, wherein said polymer is a thermosetting resin selected from the group consisting of polyester, polyacrylate, polyurethane, phenolic resin, and polyimide.

4. An enclosure as in claim 1, wherein said polymer is an epoxy.

5. An enclosure as in claim 1, wherein said polymer is a polysiloxane.

6. An enclosure as in claim 1, wherein said polymer is a gel.

7. An enclosure as in claim 6, wherein said polymer is a polysiloxane, polyurethane or polyacrylate.

8. An enclosure as in claim 1, wherein x is 1-10, said average pore diameter is 3-10 Angstrom, said average particle size is 1-10 micrometer and said powder to polymer weight ratio is 0.01-1.

9. An enclosure as in claim 1, wherein said polymer is an elastomer.

10. An enclosure as in claim 1, wherein said polymer is a plastic.