Semiconductor sensor for gamma-ray tomographic imaging system

• US 5,245,191 A
• Filed: 04/14/1992
• Issued: 09/14/1993
• Est. Priority Date: 04/14/1992
• Status: Expired due to Term

• Current Assignee: Arizona Board of Regents (University of Arizona)
• Original Assignee: Arizona Board of Regents (University of Arizona)
• Inventors: Dereniak, Eustace L., Barber, Herbert B., Rogulski, Michel M., Barrett, Harrison H.
• Primary Examiner(s): Hannaher, Constantine
• Assistant Examiner(s): Glick, Edward J.
• Application Number:
  US07/868,181
• Time in Patent Office: 518 Days
• Field of Search: 250/363.04, 250/363.06, 250/363.07, 250/370.08, 250/370.09, 250/370.10, 250/370.12, 250/370.13, 250/363.10
• US Class Current: 250/363.04
• CPC Class Codes: A61B 6/037 Emission tomography
• CPC Class Codes: G01T 1/2928 using solid state detectors
• CPC Class Codes: G01T 1/295 using coded aperture devices, e.g. Fresnel zone plates handling of radiation of particles, e.g. using diaphragms, collimators, diffraction G21K1/00
• CPC Class Codes: G01T 1/2985 In depth localisation, e.g. using positron emitters; Tomographic imaging (longitudinal and transverse section imaging; apparatus for radiation diagnosis sequentially in different planes, steroscopic radiation diagnosis); using external radiation sources A61B6/02
• CPC Class Codes: H01L 27/14661 of the hybrid type

Abstract

A hybrid gamma-ray semiconductor detector is used in combination with attenuating apertures of the kind used in emission computed tomography. The detector comprises a slab of semiconductor material partitioned into multiple cells individually connected to a multiplexer through indium-bump pressure welds for the sequential read-out of integrated pulses generated in each cell as a result of gamma-ray absorption events. The single output channel provided by the multiplexer permits the construction of semiconductor sensor cells approximately one millimeter in size for improved spatial resolution of the detector. The greater resolution of the detector makes it possible to narrow the distance between the image forming apertures and the detector'"'"'s surface, thus minimizing overlapping of the gamma-ray radiation and the size of the overall apparatus. As a result of the smaller acceptable distance between the aperture surface and the detector, it is also possible to have a greater number of apertures without overlap with a resulting substantial improvement in system sensitivity.

Claims

1. A gamma-ray imaging apparatus for single-photon emission computed tomographic applications comprising, in combination:

(a) an aperture imaging system, consisting of a multiple-pinhole aperture in a layer of radiation attenuating material, for providing a field of view through said multiple pinhole aperture;

(b) a slab of semiconductor material positioned to receive gamma rays from a gamma-ray emitting source in said field of view and capable of absorbing incident gamma rays, wherein said slab of semiconductor material is subjected to an electric field between an electrode attached to the side of the slab exposed to radiation and a plurality of electrodes attached to the other side of the slab, whereby the slab is partitioned into a corresponding plurality of sensor cells individually capable of producing an electric current pulse when a gamma ray is absorbed within the cell;

(c) a monolithic multiplexer coupled to said plurality of electrodes for the sequential rad-out of electric pulses generated in each of said sensor cells as a result of gamma-ray absorption events, wherein during each cycle of operation of the multiplexer the current-pulse output of each cell is integrated by accumulation in a corresponding capacitor means that is sequentially discharged producing a voltage signal through a single-output channel of the multiplexer and that is then reset for charging during the next cycle of operation; and

(d) data processing means, coupled to said single-output channel of the multiplexer, for analyzing the voltage signals produced at said single-output channel and for constructing an image corresponding to the gamma-ray emitting source;

wherein said slab of semiconductor material and said monolithic multiplexer constitute a single gamma-ray detector module.

2. The apparatus described in claim 1, wherein said monolithic multiplexer is coupled to said plurality of electrodes by means of indium-bump cold welds.

3. The apparatus described in claim 1, wherein said data processing means consists of an analog-to-digital converter for converting the analog voltage signal produced at said single-output channel of the multiplexer to a corresponding digital signal, and of a computer connected to the output of said converter.

4. The apparatus described in claim 1, wherein said semiconductor material is zinc-cadmium-telluride.

5. The apparatus described in claim 4, wherein said slab consists of a square approximately 2 to 6 cm wide and between 0.5 and 5 mm thick, said square containing a plurality of cells each approximately 0.25 mm² ;

wherein said cycle of operation is repeated every 10 milliseconds; and

wherein said gamma rays from a gamma-ray emitting source are emitted with a radiation flux of less than 1 photon per 10 milliseconds per square millimeter.

6. The apparatus described in claim 1, further comprising an expansion coupler between said plurality of electrodes and said monolithic multiplexer.

7. A gamma-ray imaging apparatus for single-photon emission computed tomographic applications comprising, in combination:

(a) an aperture imaging system, consisting of a multiple-pinhole aperture in a layer of radiation attenuating material, for providing a field of view through said multiple pinhole aperture;

(b) a slab of semiconductor material positioned to receive gamma rays from a gamma-ray emitting source in said field of view and capable of absorbing incident gamma rays, wherein said slab of semiconductor material is subjected to an electric field between an electrode attached to the side of the slab exposed to radiation and a plurality of electrodes attached to the other side of the slab, whereby the slab is partitioned into a corresponding plurality of sensor cells individually capable of producing an electric current pulse when a gamma ray is absorbed within the cell;

(c) a monolithic multiplexer coupled to said plurality of electrodes for the sequential read-out of electric pulses generated in each of said sensor cells as a result of gamma-ray absorption events, wherein during each cycle of operation of the multiplexer the current-pulse output of each cell is integrated by accumulation in a corresponding capacitor means that is sequentially discharged producing a voltage signal through a single-output channel of the multiplexer and that is then reset for charging during the next cycle of operation; and

(d) data processing means, coupled to said single-output channel of the multiplexer, for analyzing the voltage signals produced at said single-output channel and for constructing an image corresponding to the gamma-ray emitting source;

wherein said slab of semiconductor material and said monolithic multiplexer constitute a single gamma-ray detector module; and

wherein the distance between said multiple-pinhole aperture and said slab of semiconductor material is no more than twice the minimum distance at which the fields of view of adjacent pinholes overlap.

8. The apparatus described in claim 7, wherein said multiple-pinhole aperture imaging system consists of a hemispherical surface and wherein a multiplicity of said gamma-ray detector modules are positioned in hemispherical configuration around said hemispherical surface.

9. The apparatus described in claim 8, wherein said hemispherical surface is stationary.

10. A method for detecting gamma rays emitted from a source containing radionuclides and for reconstructing a corresponding image through computer analysis and data processing for single-photon emission computed tomographic applications, comprising the following steps:

(a) exposing a gamma-ray emitting source to an aperture imaging system consisting of a multiple-pinhole aperture in a layer of radiation attenuating material;

(b) positioning a slab of semiconductor material in the field of view of said multiple-pinhole aperture imaging system to receive gamma rays from the gamma-ray emitting source in said field of view, said semiconductor material being capable of absorbing incident gamma rays;

(c) subjecting said slab of semiconductor material to an electric field between an electrode attached to the side of the slab exposed to radiation and a plurality of electrodes attached to the other side of the slab, whereby the slab is partitioned into a corresponding plurality of sensor cells individually capable of producing an electric current pulse when a gamma ray is absorbed within the cell;

(d) coupling a monolithic multiplexer to said plurality of electrodes for the sequential read-out of electric pulses generated in each of said sensor cells as a result of gamma-ray absorption events;

(e) integrating the current-pulse output of each cell during each cycle of operation of said monolithic multiplexer by accumulation in a corresponding capacitor means that is sequentially discharged producing a voltage signal through a single-output channel of the multiplexer and that is then reset for charging during the next cycle of operation; and

(f) coupling said single-output channel of the multiplexer to data processing means for analyzing the voltage signals produced at said single-output channel and for constructing an image corresponding to the gamma-ray emitting source;

wherein said slab of semiconductor material and said monolithic multiplexer constitute a single gamma-ray detector module; and

wherein the distance between said multiple-pinhole aperture and said slab of semiconductor material is no more than twice the minimum distance at which the fields of view of adjacent pinholes overlap.

11. The method described in claim 10, wherein said monolithic multiplexer is coupled to said plurality of electrodes by means of indium-bump cold welds.

12. The method described in claim 10, wherein said data processing means consists of an analog-to-digital converter for converting the analog voltage signal produced at said single-output channel of the multiplexer to a corresponding digital signal, and of a computer connected to the output of said converter.

13. The method described in claim 10, wherein said semiconductor material is zinc-cadmium-telluride.

14. The method described in claim 13, wherein said slab consists of a square approximately 2 to 6 cm wide and between 0.5 and 5 mm thick, said square containing a plurality of cells each approximately 0.25 mm² ;

wherein said cycle of operation is repeated every 10 milliseconds; and

wherein said gamma rays from a gamma-ray emitting source are emitted with a radiation flux of less than 1 photon per 10 milliseconds per square millimeter.

15. The method described in claim 10, wherein said multiple-pinhole aperture imaging system consists of a hemispherical surface and wherein a multiplicity of said gamma-ray detector modules are positioned in hemispherical configuration around said hemispherical surface.

16. The method described in claim 15, wherein said hemispherical surface is stationary.

17. The method described in claim 10, further comprising the step of using an expansion coupler between said plurality of electrodes and said monolithic multiplexer.