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Multichip packaged semiconductor device and method for manufacturing the same

  • US 5,245,215 A
  • Filed: 02/03/1992
  • Issued: 09/14/1993
  • Est. Priority Date: 02/08/1991
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a lead frame having an inner lead section, and outer lead section and at least one island;

    a plurality of semiconductor chips formed on said island of said lead frame and each having electrode pads and each having at least one semiconductor element formed therein;

    a flexible resin tape having device holes formed in positions corresponding to mounting sections of said semiconductor chips and having a wiring pattern for electrically connecting said electrode pads of said semiconductor chips to said inner lead section of said lead frame; and

    a plurality of bump electrodes between said electrode pads and said wiring pattern, said bump electrodes being formed on at least one of said electrode pads and said wiring pattern, and electrically connecting said electrode pads and said wiring pattern.

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