Array connector

• US 5,245,751 A
• Filed: 10/25/1991
• Issued: 09/21/1993
• Est. Priority Date: 04/27/1990
• Status: Expired due to Fees

• Current Assignee: Circuit Components Incorporated
• Original Assignee: Circuit Components Incorporated
• Inventors: Owens, Mark J., Locke, Barbara E., Simpson, Scott S., St. Lawrence, Michael, Burdick, Lynn E.
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US07/782,608
• Time in Patent Office: 697 Days
• Field of Search: 29/830, 29/852, 427/97, 174/262-266, 439/66, 439/91
• US Class Current: 29/852
• CPC Class Codes: B23K 2101/35 Surface treated articles
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 2103/12 Copper or alloys thereof
• CPC Class Codes: B23K 2103/172 wherein at least one of the layers is non-metallic
• CPC Class Codes: B23K 2103/42 Plastics B23K2103/16 takes precedence
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 2103/56 semiconducting
• CPC Class Codes: B23K 26/382 by boring
• CPC Class Codes: B23K 26/389 of fluid openings, e.g. nozzles, jets laser machining of inkjet nozzles B41J2/1634
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 13/22 Contacts for co-operating by abutting
• CPC Class Codes: H05K 2201/09563 Metal filled via
• CPC Class Codes: H05K 2201/09736 Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 3/42 Plated through-holes or plated via connections
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

Processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.

Claims

1. A process for fabricating a demateable electrical connector member suitable for being interposed between contact arrays of opposed members to effect electrical connection therebetween, the member being of the type comprising a polymeric sheet-form member having a plurality of apertures through which conductors of plated metal deposit extend, the process characterized by the steps of:

providing a preformed polymeric sheet-form member having oppositely directed first and second sides;

providing a metal layer on the surface of the first side of the sheet-form member;

forming apertures through the sheet-form member from the second side of the sheet-form member, with the apertures extending through the polymeric member to the metal layer to expose the metal layer to the interior of the aperture;

connecting the metal layer to a suitable voltage source,

depositing metal in the apertures by electroplating upon the exposed portion of the metal layer within the aperture to form a deposit that protrudes outwardly beyond the second side of the sheet-form member to form a raised electrical contact on the second side;

removing the metal layer sufficiently to expose the first side of the sheet-form member,

temporarily electrically connecting the plated metal contacts at the second side to a suitable voltage source,

depositing metal by electroplating such that plated metal protrudes outwardly beyond the first side to form a raised electrical contact on the first side of the sheet form member; and

,

removing the temporary electrical connection.

2. The process of claim 1 wherein the depositing step fills the apertures with deposited metal.

3. The process of claim 2 further comprising:

forming the apertures to partially extend into the metal layer forming a well;

depositing into the well in order, one or more etch resistant metals, and a metal deposited to extend through the aperture above the second side of the sheet-form member, and

removing the metal layer to expose the first etch resistant metal to form a raised contact region on the first side.

4. The process of claim 3 wherein the etch resistant metal is solder.

9. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the depositing step forms a deposit that overlies a margin of the sheet-form member surrounding the aperture.

10. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the pitch of said apertures is sufficient to interconnect arrays of contact pads that have a pitch less than 25 mils.

11. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the diameters of the apertures are 6 mils or less.

12. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the apertures are formed at a pitch of about 12 mils or less.

13. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the thickness of the sheet-form member is 20 mils or less.

14. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the apertures are at an acute angle to the direction of thickness of the sheet-form member.

15. The process of any one of claims 1, 2, 3, 5, 6 wherein the angle is less than 15 degrees.

16. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the ratio of the pitch to polymer thickness is in the range from about 0.38 to about 1.7.

17. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the sheet-form member is a yieldable elastomeric member.

18. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the sheet-form member is selected from silicone, fluoropolymer and polyimide.

19. The process of any one of claims 1, 2, 3, 5, 6 or 7 wherein the sheet-form member has a Durometer value of about 30 to about 60.

20. The process of any one of claims 1, 2, 3, 5, 6 or 7 comprising forming the apertures by laser drilling.

21. The process of any one of claims 1, 2, 3, 5, 6 or 7 comprising forming fine closely spaced apertures extending in X and Y directions over an area of the sheet-form member.

5. A process for fabricating a demateable electrical connector member suitable for being interposed between contact arrays of opposed members to effect electrical connection therebetween, the member being of the type comprising a polymeric sheet-form member having a plurality of apertures through which conductors of plated metal deposit extend, the process characterized by the steps of:

providing a preformed polymeric sheet-form member having oppositely directed first and second sides;

providing a layer of metal on each of the opposed first and second sides of the elastomeric sheet-form member to form a composite;

forming the apertures through the thickness of the composite;

depositing metal on the walls of the apertures and in electrical contact with one of the metal layers;

connecting the metal layer to a suitable voltage source;

electroplating metal onto the metal-coated walls to form a rim around the end of each aperture that protrudes outwardly beyond the opposed sides of the composite and

removing the metal layers from the opposed sides of the sheet-form member.

6. The process of claim 5 wherein the depositing step forms annular electrical contact regions extending outwardly from the side of said sheet-from member.

7. The process of claim 6 further comprising:

applying to the metal layers an etch resist prior to forming the apertures, and

the removing step removes all of the metal layers and resist layers from the opposed sides.

8. The process of claim 7 wherein the depositing step deposits metal on the walls of the apertures without filling the apertures.