Plurality of arrangements each including an IC magnetic field sensor and two ferromagnetic field concentrators, and a procedure for incorporating each arrangement into a package

• US 5,247,202 A
• Filed: 10/02/1992
• Issued: 09/21/1993
• Est. Priority Date: 10/09/1991
• Status: Expired due to Fees

• Current Assignee: Landis & GYR Betriebs AG (Landis+Gyr Group AG)
• Original Assignee: Landis & GYR Betriebs AG (Landis+Gyr Group AG)
• Inventors: Hrejsa, Jan, Popovic, Radivoje
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US07/955,926
• Time in Patent Office: 354 Days
• Field of Search: 257/666, 257/677, 437/217, 437/220, 437/206, 361/421
• US Class Current: 257/677
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H10N 52/80 Constructional details

Abstract

In an embodiment of the invention, a magnetic sensor comprises an IC magnetic flux sensor and two magnetic flux concentrators (18,19) which are each a section of a ferromagnetic lead frame. A section (18b) of a first magnetic flux concentrator (18), a semiconductor chip (4) and a section (19b) of a second magnetic flux concentrator create a sub-unit (18b;4;19b) having three sandwich like layers (I,II,III). A further section (18a) of first magnetic flux concentrator (18) is a sheet metal object having the shape of a single staircase-like step. The step exhibits a first surface section (22) and a second surface section (23) parallel thereto. One side of first surface section (22) is disposed on top of semiconductor chip (4) in the first layer (I). Second surface section (23) and semiconductor chip (4) are disposed in the second layer (II). A section (17) of a non-ferromagnetic lead frame mounting semiconductor chip (4) and the second magnetic flux concentrator (19) are disposed in the third layer (III). The configuration can without difficulty be assembled and packaged in a conventional assembly line, whereby expensive alignment operations during assembly and the occurrence of relatively large and inaccurate air-gaps can be avoided.

Claims

1. A Device comprising

a magnetic field sensor incorporated in an integrated circuit semiconductor chip (4),

a first lead frame (8) made out of metal sheet said first lead frame including a section (11) for mounting said semiconductor chip (4),

a second lead frame (20) made out of ferromagnetic metal sheet including as a section a first ferromagnetic magnetic flux concentrator (18) said magnetic flux concentrator including a first section (18b),

a second ferromagnetic magnetic flux concentrator (19) formed from a section of a lead frame made of ferromagnetic metal sheet, said second magnetic flux concentrator including a first section (19b),

said device being configured so that said first section of said first magnetic flux concentrator lies on top of said semiconductor chip, the latter lying on top of said first section of said second magnetic flux concentrator to form a sandwich-like sub-unit (18b;

4;

19b) with first, second and third layers (I, II, III),

wherein said section of said first lead frame for mounting said semiconductor chip (4) is disposed such as lie in one of said layers or in two of said layers (III, II, or II and III), said device further comprising

a third lead frame (21) made out of ferromagnetic material including as a section said second ferromagnetic magnetic flux concentrator (19) whereby said first lead frame (8) is made out of non-ferromagnetic material.

2. The device according to claim 1 comprising

a second section (18a) of said second lead frame wherein

said second section is folded along two parallel lines so as to create a sheet metal object having the shape of a single staircase-like step, said step exhibiting a first surface section (22) and a second surface section (23) parallel thereto and wherein said device is configured so that said first section (22) is disposed on top of said semiconductor chip (4) and thereby lying in said first layer (I) of said sandwiched sub-unit (18b;

4;

19b), said device being further configured so that said second surface section 23 and said semiconductor chip (4) are located in said second layer (II) of said sandwiched sub-unit (18b;

4;

19b), said device being further configured so that said section (17) of said first lead frame (8) and said section (19) of said third ferromagnetic lead frame (21) are located in said third layer (III) of said sandwiched sub-unit (18b;

4;

19b).

3. The device of claim 1 wherein said device is configured so that said section (18) of said second ferromagnetic lead frame (20) is located in said first layer (I) of said sandwiched sub-unit (18b;

4;

19b) and wherein said section (17) of said first lead frame (8) is folded along two parallel lines such as to create a sheet metal object having the shape of a single staircase-like step, said step exhibiting a first surface section (24) and a second surface section (25) parallel thereto and wherein said device is configured so that said first surface section (24) and said semiconductor chip (4) are disposed in said second layer (II) of said sandwiched sub-unit (18b;

4;

19b) said device being further configured so that said second surface section (25) mounts said semiconductor chip (4) whereas said second surface section (25) and said section (19) of said third ferromagnetic lead frame (21) are disposed in said third layer (III) of said sandwiched sub-unit (18b;

4;

19b).

4. The device of claim 1 where said device is configured so that said section (18) of said second lead frame (20) is located in said first layer (I) of said sandwiched sub-unit (18b;

4;

19b) and wherein said first section (19b) of said third ferromagnetic lead frame (21) is folded along two parallel lines such as to create a sheet metal object having the structure of a single staircase-like step, said step exhibiting a first surface section (26) and a second surface section (27) parallel thereto and wherein said device is configured so that said first surface section (26) and said semiconductor chip (4) are disposed in said second layer (II) of said sandwiched sub-unit (18b;

4;

19b), said device being further configured so that said second surface section (27) of said first section of said third ferromagnetic lead frame (21) and said section (17) of said first lead frame (8) are disposed in said third layer III of said sandwiched sub-unit (18b;

4;

19b).

5. A device comprising

a magnetic field sensor incorporated in an integrated circuit semiconductor chip (4),

a first lead frame (8) made out of metal sheet said first lead frame including a section (17) for mounting said semiconductor chip (4),

a second lead frame (20) made out of ferromagnetic metal sheet including as a section a first ferromagnetic magnetic flux concentrator (18) said magnetic flux concentrator including a first section (18b),

a second ferromagnetic magnetic flux concentrator (19) formed from a section of a lead frame made of ferromagnetic metal sheet, said second magnetic flux concentrator including a first section (19b),

said device being configured so that said first section of said first magnetic flux concentrator lies on top of said semiconductor chip, the latter lying on top of said first section of said second magnetic flux concentrator to form a sandwich-like sub-unit (18b;

4;

19b) with first, second and third layers (I, II, III),

wherein said section of said first lead frame for mounting said semiconductor chip (4) is disposed such as lie in one of said layers or in two of said layers (III, II, or II and III), and

wherein said first section (18b) of said first magnetic flux concentrator (18), said semiconductor chip (4) and said first section (19b) of said second magnetic flux concentrator (19) are at least partially arrayed to be adjacent to each other in said first layer (I), said first and second magnetic flux concentrators (18,19) being sections of said second lead frame (20;

21) made out of ferromagnetic sheet metal, whereby said first lead frame (8) is non-ferromagnetic.

6. A device comprising

a magnetic field sensor incorporated in an integrated circuit semiconductor chip (4),

a first lead frame (8) made out of metal sheet, said first lead frame including a section (17) for mounting said semiconductor chip (4),

a second lead frame (20) made out of ferromagnetic metal sheet including as a section a first ferromagnetic magnetic flux concentrator (18) said magnetic flux concentrator including a first section (18b),

a second ferromagnetic magnetic flux concentrator (19) formed from a section of a lead frame made of ferromagnetic metal sheet, said second magnetic flux concentrator including a first section (19b),

said device being configured so that said first section (18b) of said first magnetic flux concentrator, said semiconductor chip, and said first section (19b) of aid second magnetic flux concentrator all are in a single layer (I).