Fiber-optics connected optoelectronic device mounted on a substrate and method of manufacturing it

• US 5,247,596 A
• Filed: 02/06/1992
• Issued: 09/21/1993
• Est. Priority Date: 02/08/1991
• Status: Expired due to Fees

• Current Assignee: Alcatel NV (Nokia Corporation)
• Original Assignee: Alcatel NV (Nokia Corporation)
• Inventors: Maignan, Michel, Ducate, Jean
• Primary Examiner(s): Lee, John D.
• Assistant Examiner(s): BARNS, STEPHEN
• Application Number:
  US07/831,850
• Time in Patent Office: 593 Days
• Field of Search: 385/88, 385/89, 385/90, 385/91, 385/38
• US Class Current: 385/88
• CPC Class Codes: G02B 6/4202 for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H04B 10/25 Arrangements specific to fibre transmission

Abstract

The optical connection to a fiber-optics connected optoelectronic device mounted on a substrate is made by an optical fiber inserted in a hole through the substrate facing the component. The walls of the hole align and locate the fiber. The invention finds an application in the manufacture of a balanced optoelectronic receiver for a coherent detection fiber-optics transmission system.

Claims

1. Fiber-optics connected optoelectronic device mounted on a substrate in which the electrical connection of an optoelectronic component fixed to a ceramic substrate is provided by contact of said component with at least one conductive track and the optical connection of aid component is provided by an optical fiber held in an optical connection hole through said substrate which is defined by a substantially continuous cylindrical wall of said matched to that of said optical fiber so as to provide a slip fit between said optical fiber and said wall that aligns and locates said optical fiber.

2. Device according to claim 1 wherein said optical connection hole has a diameter less than 0.2 mm.

3. Device according to claim 2 wherein the difference between the diameter of said optical connection hole and the diameter of said optical fiber is not substantially greater than 15 microns.

4. Device according to claim 1 in the form of a hybrid circuit wherein said substrate carries a set of electronic components including at least one electronic component other than said optoelectronic component and a plurality of conductive tracks electrically interconnecting said components.

5. Method of manufacturing a fiber-optics connected optoelectronic device mounted on a substrate comprising the following operations:

placing on a top surface of a ceramic substrate a set of electronic components comprising at least one optoelectronic component having an optical connection region,

fixing said set of components to said surface,

making electrical connections for said set of components,

drilling an optical connection hole along a drilling axis through said substrate facing said optical connection region of aid optoelectronic component using a focussed laser beam,

rotating said substrate about said drilling axis during said drilling operation so as to confer upon the wall of said optical connection hole the shape of a cylinder of revolution about said axis and so that the diameter of said hole is matched to an outside diameter of an optical fiber,

inserting an end section of said optical fiber in said optical connection hole, and

connection to said optoelectronic component.

6. Method according to claim 5 wherein said optical connection hole provides a slip fit for said optical fiber.

7. Method according to claim 6 wherein the difference between the diameter of said optical connection hole and the diameter of said optical fiber is not substantially greater than 15 microns.

8. A balanced optoelectronic receiver adapted to be used in a coherent detection fiber-optics transmission network in the form of a hybrid circuit mounted on a ceramic substrate carrying a plurality of electronic components including at least one semiconductor microwave amplifier and at least two semiconductor photodiodes electrically interconnected to form the balanced optoelectronic receiver, wherein

electrical connection to each of said electronic components is provided by contact of said each component with one or more conductive tracks carried by a surface of said substrate, and

optical connection to each of said semiconductor diodes is provided by a respective optical fiber held in a respective optical connection hole through said substrate which has a substantially continuous cylindrical wall whose diameter is matched to that of said optical fiber so that said wall aligns and locates said optical fiber, each said optical connection hole having a diameter less than 0.2 mm.