Semiconductor pick-and-place machine calibration apparatus

• US 5,247,844 A
• Filed: 10/25/1991
• Issued: 09/28/1993
• Est. Priority Date: 10/25/1991
• Status: Expired due to Term

• Current Assignee: Plexus Services Corporation (Plexus Corporation)
• Original Assignee: Micron Technology, Inc.
• Inventors: Howell, David A.
• Primary Examiner(s): NOLAND, THOMAS
• Application Number:
  US07/783,111
• Time in Patent Office: 704 Days
• Field of Search: 73/865.8, 437/8
• US Class Current: 73/865.8
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H05K 13/089 Calibration, teaching or correction of mechanical systems, e.g. of the mounting head

Abstract

An apparatus and method of performing a calibration of the accuracy of placement of semiconductor chips or devices by a pick-and-place machine. The chips are placed on an adhesive-backed glass plate that has calibrated etch marks whose dimensions are chosen to aid the inspector in estimating, or carefully measuring in an optic comparator, the amount of placement error that the machine is causing. The calibration would be performed on a periodic basis as a preventive maintenance program.

Claims

1. In a semiconductor chip manufacturing process, an apparatus that measures chip placement accuracy comprising:

a. an etched glass plate having a top and bottom surface, the top surface having etched calibration marks;

b. a plate carrier supporting the glass plate bottom surface and having plate alignment means further comprising a pair of pins on a top surface of the plate carrier that engages a pair of apertures in the glass plate; and

c. an adhesive means on the glass plate top surface, wherein placement accuracy of a plurality of integrated circuit chips and passive components on the adhesive means can be determined by inverting the glass plate and performing an inspection of the location of a chip lead relative to the calibration marks.

2. In a semiconductor chip manufacturing process, an apparatus that measures chip placement accuracy comprising:

a. an etched glass plate having a top and bottom surface, the top surface having etched calibration marks;

b. a plate carrier supporting the glass plate bottom surface and having plate alignment pins; and

c. a double-backed adhesive tape on the glass plate top surface, wherein placement accuracy of a plurality of integrated circuit chips and passive components on the adhesive tape can be determined by inverting the glass plate and performing an inspection of the location of a chip lead relative to the calibration marks.

3. The apparatus of claim 2 and wherein:

the etched calibration marks comprise a plurality of rectangles.

4. The apparatus of claim 3 and wherein:

a plurality of calibrated line marks adjacent the rectangles, indicate a measure of misalignment of the chip.

5. The apparatus of claim 4 and wherein:

a first section of the glass plate is marked to indicate lead location for a plurality of capacitors and an adjacent section is etched to indicate a lead location for a plurality of SOIC'"'"'s.

6. The apparatus of claim 3 and wherein:

the etched glass late is marked to indicate a lead location for a chip selected from the group consisting of;

SOJ, SOIC, PLCC, VSOP, and QFP.

7. The apparatus of claim 3 and wherein:

the etched glass plate is marked to indicate a lead location for a discrete device selected from the group consisting of capacitors, resistors, coils, transistors, diodes, LED'"'"'s, filers, and switches.