IC card
First Claim
Patent Images
1. An IC card comprising:
- an IC module having opposing first and second surfaces, a relatively large cross sectional area in a first portion and a relatively small cross sectional area in a second portion and including an external connection terminal on the first surface;
a card substrate including a stack of a plurality of core sheets, a portion of said plurality of core sheets including through holes forming an opening receiving said IC module with the first surface exposed; and
a plurality of adhesive layers disposed between respective core sheets adjacent said IC module, wherein at least two of said adhesive layers are disposed directly opposite each other adjacent said IC module within said stack of core sheets.
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Accused Products
Abstract
In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.
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Citations
16 Claims
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1. An IC card comprising:
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an IC module having opposing first and second surfaces, a relatively large cross sectional area in a first portion and a relatively small cross sectional area in a second portion and including an external connection terminal on the first surface; a card substrate including a stack of a plurality of core sheets, a portion of said plurality of core sheets including through holes forming an opening receiving said IC module with the first surface exposed; and a plurality of adhesive layers disposed between respective core sheets adjacent said IC module, wherein at least two of said adhesive layers are disposed directly opposite each other adjacent said IC module within said stack of core sheets. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An IC card comprising:
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an IC module having opposed first and second surfaces and including an external connection terminal on the first surface; a card substrate including a stack of a plurality of core sheets, a portion of said plurality of core sheets including through holes forming an opening receiving said IC module with the first surface exposed; and a plurality of adhesive layers disposed between respective core sheets adjacent said IC module, wherein at least two of said adhesive layers are disposed directly opposite each other adjacent said IC module within said stack of core sheets. - View Dependent Claims (16)
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Specification