IC card

• US 5,250,341 A
• Filed: 01/30/1991
• Issued: 10/05/1993
• Est. Priority Date: 03/26/1990
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Kobayashi, Makoto, Ochi, Katsunori, Kodai, Syojiro
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US07/648,511
• Time in Patent Office: 979 Days
• Field of Search: 428/137, 428/209, 428/915, 428/916, 428/198, 283/77, 283/83, 283/107, 283/109
• US Class Current: 428/137
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 428/915 Fraud or tamper detecting
• CPC Class Codes: Y10S 428/916 Fraud or tamper detecting
• CPC Class Codes: Y10T 428/24322 Composite web or sheet
• CPC Class Codes: Y10T 428/24826 Spot bonds connect components
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.

Claims

1. An IC card comprising:

an IC module having opposing first and second surfaces, a relatively large cross sectional area in a first portion and a relatively small cross sectional area in a second portion and including an external connection terminal on the first surface;

a card substrate including a stack of a plurality of core sheets, a portion of said plurality of core sheets including through holes forming an opening receiving said IC module with the first surface exposed; and

a plurality of adhesive layers disposed between respective core sheets adjacent said IC module, wherein at least two of said adhesive layers are disposed directly opposite each other adjacent said IC module within said stack of core sheets.

2. An IC card according to claim 1 wherein said IC module is substantially cubic, said first portion has a rectangular shape, said second portion includes rounded corners, and said at least two adhesive layers are placed between respective pairs of core sheets to respectively hold core sheets having through holes corresponding to said second portion of said IC module.

3. An IC card according to claim 2 wherein one of said adhesive layers is positioned in the opening in contact with the second surface of said IC module.

4. An IC card according to claim 1 wherein said IC module is in the form of a two stepped dice-like shape composed of an upper portion consisting of a terminal mount portion having an external connection terminal on the upper surface thereof and a large horizontal cross sectional area and a lower portion consisting of a body portion having a horizontal cross sectional area which is smaller than that of said upper portion.

5. An IC card according to claim 4 wherein said two or more adhesive layers are placed between said core sheets so as to respectively hold one or more core sheets positioned to correspond to said body portion of said IC module.

6. An IC card according to claim 1 wherein the through hole formed in a core sheet corresponding to said first portion of said IC module has a size and shape which does not form a gap with said IC module and the through hole formed in a core sheet corresponding to said second portion of said IC module has a size and shape to form a gap with said IC module.

7. An IC card according to claim 6 wherein one of said adhesive layers is positioned in the opening in contact with the second surface of said IC module.

8. An IC card according to claim 2 wherein each of the through holes formed in said core sheets has a shape forming a gap with said IC module which at least narrows at corner portions of said IC module.

9. An IC card according to claim 8 wherein each of said through holes formed in said core sheets positioned to correspond to said second portion of said IC module has, in the portion corresponding to said corners of said IC module, a shape rounded with a radius of curvature larger than the radius of curvature of said corners of said IC module.

10. An IC card according to claim 7 wherein each of the through holes formed in said core sheets has an octagonal shape including sides tangent to each of the corners of said IC module.

11. An IC card according to claim 1 wherein said card substrate includes an outer protection sheet layer formed by integral molding.

12. An IC card according to claim 1 wherein said adhesive layer is made of a heat sensitive type adhesive having a melting point lower than the melting point of said core sheets.

13. An IC card according to claim 1 wherein said adhesive layer is a pressure sensitive type adhesive.

14. An IC card according to claim 1 wherein said adhesive layer is a B-stage heat hardening type adhesive.

15. An IC card comprising:

an IC module having opposed first and second surfaces and including an external connection terminal on the first surface;

a card substrate including a stack of a plurality of core sheets, a portion of said plurality of core sheets including through holes forming an opening receiving said IC module with the first surface exposed; and

a plurality of adhesive layers disposed between respective core sheets adjacent said IC module, wherein at least two of said adhesive layers are disposed directly opposite each other adjacent said IC module within said stack of core sheets.

16. An IC card according to claim 15 wherein one of said adhesive layers is positioned in the opening in contact with the second surface of said IC module.