Low temperature flexible die attach adhesive and articles using same

• US 5,250,600 A
• Filed: 05/28/1992
• Issued: 10/05/1993
• Est. Priority Date: 05/28/1992
• Status: Expired due to Term

• Current Assignee: Henkel Corporation (Henkel AG & Co KGaA)
• Original Assignee: Johnson Matthey Incorporated (Johnson Matthey PLC)
• Inventors: Nguyen, My N., Chien, Yuan Y.
• Primary Examiner(s): Michl, Paul R.
• Assistant Examiner(s): Cain, Edward J.
• Application Number:
  US07/890,618
• Time in Patent Office: 495 Days
• Field of Search: 524/377, 524/381, 524/382, 524/440, 528/422, 528/361, 528/362, 528/363
• US Class Current: 524/377
• CPC Class Codes: C07C 261/02 Cyanates
• CPC Class Codes: C08G 59/4007 Curing agents not provided for by the groups C08G59/42 - C08G59/66
• CPC Class Codes: C08K 5/0016 Plasticisers
• CPC Class Codes: C08L 79/04 Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C09J 179/04 Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4828 Conductive organic material or pastes, e.g. conductive adhesives, inks
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01067 : Holmium [Ho]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

Claims

1. A flexible adhesive formulation comprising the reaction product of a cyanate ester-containing material and at least one flexibilizer from the group of polyhydroxyl polymer compounds within at least one of the following formula:

space="preserve" listing-type="equation">HO--(CH.sub.2).sub.m --CO--O--(CH.sub.2).sub.n --OH

space="preserve" listing-type="equation">and/or

space="preserve" listing-type="equation">HO--(CH.sub.2).sub.m --O--C--O--R--C--O--(CH.sub.2).sub.n --OH.

2. A flexible adhesive formulation according to claim 1 wherein said polyhydroxyl polymer has a molecular weight in the range of about 200 to about 5000 and contains at least two hydroxy groups.

3. A flexible adhesive formulation according to claim 2 wherein said polyhydroxyl polymer compound is one from the group consisting of polyhydroxyl polyesters and polyhydroxyl polyethers.

4. A flexible adhesive formulation according to claim 1 having a viscosity of about 5 to about 50 poise.

5. A flexible adhesive formulation according to claim 1 further comprising silver flake and/or powder in an amount sufficient to function as a curing catalyst and to enable said adhesive to be cured in not greater than 5 minutes at 200°

C.

6. A flexible adhesive formulation according to claim 1 further comprising an alkylphenol, a metal-containing curing catalyst and an electrically and/or thermally conductive filler.

7. A flexible adhesive formulation according to claim 5 comprising up to 90 wt. % silver.

8. A flexible adhesive formulation according to claim 6 wherein said filler comprises 60 to 90 wt. % silver.

9. A flexible adhesive formulation comprising the reaction produce of 6 to 24 wt. % modifier and 4 to 16 wt. % cyanate ester, 0.01 to 0.06 wt. %, metal-containing curing catalyst, 0.5 to 2 wt. % alkylphenol and up to 90 wt. % silver flake and/or powder, said modifier comprising a polyhydroxyl polymer compound within at least one of the following formula:

space="preserve" listing-type="equation">HO--(CH.sub.2).sub.m --CO--O--(CH.sub.2).sub.m --OH

space="preserve" listing-type="equation">and/or

space="preserve" listing-type="equation">HO--(CH.sub.2).sub.m --O--C--O--R--C--O--(CH.sub.2).sub.m --OH.

11. A flexible adhesive formulation according to claim 9 wherein said modifier comprises a polyhydroxyl polymer within at least one of the following formulae:

space="preserve" listing-type="equation">HO--(CH.sub.2).sub.m --CO--O--(CH.sub.2).sub.m --OH

space="preserve" listing-type="equation">and/or

space="preserve" listing-type="equation">HO--(CH.sub.2).sub.m --O--C--O--R--C--O--(CH.sub.2).sub.m --OH.

12. A flexible adhesive formulation according to claim 11 wherein said polyhydroxyl polymer compound is one from the group consisting of polyhydroxyl polyesters and polyhydroxyl polyethers.

10. A low viscosity flexible adhesive formulation comprising, in wt. %, 2-22% cyanate ester, 8-32% polyhydroxyl polymer compound, 0.01-0.06% metal-curing catalyst, up to 4% of an additive for thixotropic behavior control, 0.5 to 2% alkylphenol and up to 90% silver flake and/or powder.

13. A flexible adhesive formulation according to claim 10 wherein said polyhydroxyl polymer compound is within at least one of the following formulae:

space="preserve" listing-type="equation">HO--(CH.sub.2).sub.m --CO--O--(CH.sub.2).sub.m --OH

space="preserve" listing-type="equation">and/or

space="preserve" listing-type="equation">HO--(CH.sub.2).sub.m --O--C--O--R--C--O--(CH.sub.2).sub.m --OH.

14. A flexible adhesive formulation according to claim 13 wherein said polyhydroxyl polymer compound is one from the group consisting of polyhydroxyl polyesters and polyhydroxyl polyethers.

15. A flexible adhesive formulation according to claim 10 wherein said additive comprises amorphous fume silica or clay.