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Multichip integrated circuit modules

  • US 5,250,843 A
  • Filed: 09/08/1992
  • Issued: 10/05/1993
  • Est. Priority Date: 03/27/1991
  • Status: Expired due to Fees
First Claim
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1. A multichip integrated circuit package comprising:

  • a substrate having a flat upper surface;

    a plurality of unpackaged integrated circuit chips disposed above said substrate'"'"'s flat upper surface, said integrated circuit chips each being spaced apart from the other of said integrated circuit chips and each having at least one interconnection pad on a top surface thereof, the top surfaces of said integrated circuit chips being in a plane substantially parallel to said substrate'"'"'s flat upper surface, said integrated circuit chips also each having at least one side surface;

    an encapsulant surrounding said integrated circuit chips including said top surfaces and said at least one side surfaces thereof and completely filling all space between adjacent integrated circuit chips disposed above said substrate'"'"'s flat upper surface, said encapsulant having an upper surface above the tops of the integrated circuit chips and having a plurality of via openings therein, said openings being aligned with at least some of said interconnection pads; and

    a pattern of interconnection conductors disposed within at least some of said plurality of via openings and above the upper surface of said encapsulant so as to extend between said at least some of said plurality of via openings, and so as to provide direct electrical connection to at least some of said interconnection pads through said openings, wherein a unitary package of multiple directly interconnected integrated circuit chips is produced.

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