Semiconductor package

• US 5,252,783 A
• Filed: 02/10/1992
• Issued: 10/12/1993
• Est. Priority Date: 02/10/1992
• Status: Expired due to Fees

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Baird, John
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Ledynh, Bot
• Application Number:
  US07/833,223
• Time in Patent Office: 610 Days
• Field of Search: 29/841, 29/854, 29/855, 29/856, 437/211-220, 174/52.2, 174/52.4, 257/678, 257/687, 257/690, 257/692, 257/693, 257/694, 257/695, 257/701, 257/702, 257/667, 257/670, 257/671, 257/676, 257/787
• US Class Current: 174/528
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A semiconductor package is provided having a die attach flag (12) with integral flanges (13) which prevent high pressure plastic encapsulant (18) from escaping or entering between the die attach flag (12) and a mold cavity plate (15) during encapsulation. The die attach flag (12) is held flush against the cavity plate (15) by the packing pressure of the encapsulant (18) during low pressure stages of the encapsulation process. Plastic flowing along the flange (13) solidifies more rapidly than plastic in the body of the semiconductor package, thereby damming plastic flow at the edges of the die attach flag (12) during high pressure stages of the encapsulation process.

Claims

1. A semiconductor package comprising:

a die attach flag, wherein the die attach flag has an upper surface and a lower surface;

a plurality of leads which are electrically isolated from the die attach flag;

a number of tie bars which are coupled to the die attach flag;

upward angled flanges formed at edges of the die attach flag between each of the tie bars;

a semiconductor chip mounted on the upper surface of the die attach flag;

means for electrically coupling the plurality of leads to selected locations of the semiconductor chip; and

a plastic encapsulation covering the semiconductor chip, the means for electrical coupling, the upper surface of the die attach flag, the flange, and portions of the leads, wherein the lower surface of the die attach flag is exposed and forms a lower surface of the semiconductor package.

2. The semiconductor package of claim 1 wherein the flange meets the edge of the die attach flag at approximately a thirty degree angle.

3. The semiconductor package of claim 1 wherein the flange is approximately 0.6 millimeters long.

4. The semiconductor package of claim 1 wherein the die attach flag is less than 0.2 millimeters thick.

5. The semiconductor package of claim 1 wherein the package is approximately one millimeter thick.

6. The semiconductor package of claim 1 wherein the means for electrically coupling comprises wires bonded between the leads and the selected portions of the semiconductor chip.

7. The semiconductor package of claim 1 further comprising relief notches formed between the flange and one of the tie bars.

8. The semiconductor package of claim 1 wherein the tie bars lie in the same plane as the die attach flag.

9. The semiconductor package of claim 1 wherein the die attach flag, the flanges, the leads, and the tie bars are formed from a single sheet of metal.

10. A semiconductor package comprising:

a die attach flag having a first surface and a second surface, wherein the second surface is exposed;

a semiconductor chip attached to the first surface of the die attach flag;

upwardly angled flanges formed at all outer edges of the die attach flag; and

a molded plastic encapsulation in which the semiconductor chip, the flanges, and the first surface of the die attach flag are embedded.

11. The semiconductor package of claim 10 wherein the semiconductor package has a bottom surface comprising an annular portion formed by the plastic encapsulation and a central portion formed by the second surface of the die attach flag.

12. The semiconductor package of claim 11 wherein the flanges meet the bottom surface of the semiconductor package at an angle in the range of fifteen to thirty degrees.