Method of constructing and testing a circuit board designed for early diagnostics

• US 5,252,914 A
• Filed: 05/07/1992
• Issued: 10/12/1993
• Est. Priority Date: 08/06/1990
• Status: Expired due to Fees

• Current Assignee: Ericsson GE Mobile Communications Inc (Telefonaktiebolaget LM Ericsson)
• Original Assignee: Ericsson GE Mobile Communications Inc (Telefonaktiebolaget LM Ericsson)
• Inventors: Bing, David C., Bobbitt, Donald W.
• Primary Examiner(s): NGUYEN, VINH P
• Application Number:
  US07/879,799
• Time in Patent Office: 523 Days
• Field of Search: 324/72.5, 324/158 P, 324/158 F, 324/93.1, 324/158 R, 324/522, 370/13.1, 375/10, 361/413, 455/67.1, 455/115, 371/22.1, 371/22.5, 371/22.6, 371/25.1, 371/15.1, 364/481, 364/483
• US Class Current: 324/759.03
• CPC Class Codes: G01R 31/2818 using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors G01R31/2805 takes precedence; printed circuits having, e.g. symbols, test patterns or visualisation means H05K1/0266
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence

Abstract

An apparatus and method of modular electronic printed circuit board design for a radio communication transceiver in which the electronic circuitry forming a transmit/receive circuit board of the device is modularized in such a manner as to facilitate independent stand-alone functional testing of modules both on and off the board.

Claims

1. A method of constructing and testing a printed circuit board for a radio communication transceiver having electronic components secured to the board, comprising the steps of:

separating substantially all of the circuitry of said transceiver used to perform the major functions of said transceiver into a plurality of electrically and mechanically separate modules, each said module including circuitry for performing one of said major functions;

performing a first series of diagnostic tests upon each said module to detect non-faulty modules as tested;

mounting non-faulty as tested modules on said printed circuit board at predetermined physical locations to form an assembled transceiver circuit board;

forming interconnections among the mounted modules on said printed circuit board such that the electrical testing of the function of each mounted module can be performed independently of the remaining modules;

performing a second series of diagnostic tests on said assembled transceiver circuit board to determine whether said circuit board meets acceptable specifications;

performing a third series of diagnostic tests on each mounted module to uniquely detect individual failed modules if said second series of diagnostic tests determine that said board fails to meet acceptable specifications; and

reassembling said transceiver circuit by replacing each failed module on said printed circuit board with a replacement module.

2. A method as in claim 1, comprising the additional steps of:

re-performing said second series of diagnostic tests upon said re-assembled transceiver circuit.

3. A method as in claim 1 wherein said second series of diagnostic tests determines that said board meets acceptable specifications, comprising the additional steps of:

connecting said printed circuit board to a controller assembly; and

programming said controller assembly to provide functional parameters for said transceiver.

4. A method as in claim 1 wherein said electrical and mechanically separate modules include:

a voltage controlled oscillator module;

a power amplifier module; and

a power control module.

5. A method as in claim 4 wherein said electrical and mechanically separate modules further include:

a notch filter module;

a receive filter module;

an intermediate frequency amplifier module; and

a crystal filter module.

6. A method as in claim 4 wherein said electrical and mechanically separate modules further include:

a phase-locked loop and voltage regulator.