Wafer binding method and apparatus

• US 5,254,205 A
• Filed: 11/29/1991
• Issued: 10/19/1993
• Est. Priority Date: 11/30/1990
• Status: Expired due to Term

• Current Assignee: Mitsubishi Materials Corporation, Mitsubishi Materials Silicon Corporation (Mitsubishi Materials Corporation)
• Original Assignee: Mitsubishi Materials Corporation, Mitsubishi Materials Silicon Corporation (Mitsubishi Materials Corporation)
• Inventors: Takahashi, Keisuke, Matsumoto, Tatsumi, Tsutsumi, Yukio, Koyama, Mitsuzi
• Primary Examiner(s): Simmons, David A.
• Assistant Examiner(s): ENGEL, JAMES J
• Application Number:
  US07/800,833
• Time in Patent Office: 690 Days
• Field of Search: 156/153, 156/154, 156/155, 156/285, 156/286, 156/382, 156/493, 156/556, 156/538, 29/25.01, 29/559, 51/131.1, 51/131.4, 51/131.5, 51/277, 51/281 R, 134/66, 134/76, 134/134
• US Class Current: 156/538
• CPC Class Codes: B24B 37/345 Feeding, loading or unloading work specially adapted to lapping
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67313 Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
• CPC Class Codes: H01L 21/67326 Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
• CPC Class Codes: H01L 21/68771 characterised by supporting more than one semiconductor substrate
• CPC Class Codes: Y10T 156/17 Surface bonding means and/or assemblymeans with work feeding or handling means
• CPC Class Codes: Y10T 156/1744 Means bringing discrete articles into assembled relationship

Abstract

The present invention relates to a method and an apparatus for automatically binding a silicon wafer to a carrier plate. In the binding method of the present invention, the wafer is positioned underneath the carrier plate and then lifted and bonded to the carrier plate, at or below atmospheric pressure: once this is accomplished the process returns to the previous pressure. In addition, in the apparatus which performs this process, by means of a carrier means which supplies the carrier plate and wafer to the location where binding is to be carried out, the binding surface of the carrier plate and wafer are turned upward, transported and the carrier plate is flipped around in the interval between the carrier plate transportation apparatus and the binding unit.

Claims

1. A wafer binding apparatus comprising:

a binding unit which binds said wafer to said carrier plate;

a first carrier means which supplies a carrier plate to said binding unit,

a second carrier means which supplies said wafer to said binding unit, and

a third carrier means which carries said carrier plate bonded to said wafer from said binding unit,

wherein said binding unit comprises;

a carrier plate support means which supports said carrier plate,

a wafer support means, located on the under side of said carrier plate support means, which supports said wafer, and

a wafer transportation means which raises said wafer, supported by said support means, up until contacting the under surface of said carrier plate,

wherein in the interval between said first carrier means and said binding unit, a rolling means is provided for flipping the sides of said carrier plate.

2. A wafer binding apparatus according to claim 1 wherein the upper surface of said wafer and said carrier plate to be bonded to the upper surface of said wafer are placed under reduced pressure and after said wafer is raised and bonded to the under surface of said carrier plate, pressure is raised by said binding unit.

3. A wafer binding apparatus according to claim 1 wherein:

said first carrier means transports said carrier plate with the surface to be bonded to said wafer facing upwards, and

said second carrier means transports said wafer with the surface to be bonded to said carrier plate facing upwards.

4. A wafer binding apparatus according to claim 2 wherein:

said first carrier means transports said carrier plate with the surface to be bonded to said wafer facing upwards, and

said second carrier means transports said wafer with the surface to be bonded to said carrier plate facing upwards.

5. A wafer binding apparatus according to claim 1 wherein on the transportation path of said second carrier means a washing means is provided comprising:

a first washing unit which shoots out onto the surface of said wafer, at a high pressure, a washing liquid, and

a second washing unit which adds high frequency wave oscillations to a washing liquid and then shoots said washing liquid with added high frequency wave oscillations out onto the surface of said wafer.

6. A wafer binding apparatus according to claim 2 wherein on the transportation path of said second carrier means a washing means is provided comprising:

a first washing unit which shoots out onto the surface of said wafer, at a high pressure, a washing liquid, and

a second washing unit which adds high frequency wave oscillations to a washing liquid and then shoots said washing liquid with added high frequency wave oscillations out onto the surface of said wafer.