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Wafer binding method and apparatus

  • US 5,254,205 A
  • Filed: 11/29/1991
  • Issued: 10/19/1993
  • Est. Priority Date: 11/30/1990
  • Status: Expired due to Term
First Claim
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1. A wafer binding apparatus comprising:

  • a binding unit which binds said wafer to said carrier plate;

    a first carrier means which supplies a carrier plate to said binding unit,a second carrier means which supplies said wafer to said binding unit, anda third carrier means which carries said carrier plate bonded to said wafer from said binding unit,wherein said binding unit comprises;

    a carrier plate support means which supports said carrier plate,a wafer support means, located on the under side of said carrier plate support means, which supports said wafer, anda wafer transportation means which raises said wafer, supported by said support means, up until contacting the under surface of said carrier plate,wherein in the interval between said first carrier means and said binding unit, a rolling means is provided for flipping the sides of said carrier plate.

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