Scanning microscope comprising force-sensing means and position-sensitive photodetector
First Claim
Patent Images
1. A system for scanning at least a portion of the surface of a sample, the system comprising:
- a probe having a longitudinal axis and a tip;
means for positioning the probe tip adjacent the surface;
means for displacing the probe tip relative to the surface such that a scan pattern is described in a plane, to be referred to as the "scanning plane," which lies substantially parallel to the surface portion; and
means for oscillating the probe tip relative to the surface at least at one oscillation frequency, characterized in thatthe oscillating means are adapted to oscillate the probe tip substantially within the scanning plane; and
the system further comprises;
a position-sensitive photodetector; and
means for optically imaging the probe tip onto the position-sensitive photodetector such that changes in the oscillation of the probe tip can be detected.
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Abstract
A scanning, imaging system is described. A probe having a fine tip is disposed adjacent the surface of a sample and scanned in a pattern lying in a plane substantially parallel to the surface. Means are provided for oscillating the probe tip, substantially within the scanning plane. Shear forces, acting upon the probe tip in a substantially lateral direction, cause changes in the oscillation of the probe tip. Such changes are detected by a position-sensitive photodetector.
120 Citations
15 Claims
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1. A system for scanning at least a portion of the surface of a sample, the system comprising:
- a probe having a longitudinal axis and a tip;
means for positioning the probe tip adjacent the surface;
means for displacing the probe tip relative to the surface such that a scan pattern is described in a plane, to be referred to as the "scanning plane," which lies substantially parallel to the surface portion; and
means for oscillating the probe tip relative to the surface at least at one oscillation frequency, characterized in thatthe oscillating means are adapted to oscillate the probe tip substantially within the scanning plane; and
the system further comprises;a position-sensitive photodetector; and means for optically imaging the probe tip onto the position-sensitive photodetector such that changes in the oscillation of the probe tip can be detected. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
- a probe having a longitudinal axis and a tip;
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14. A near-field scanning optical microscope which comprises an optical fiber having first and second ends and a tapered terminal portion including the first end, means for positioning the first end adjacent a surface of a sample, and means for displacing the first end relative to the sample in a raster pattern lying in a plane, to be referred to as the "scanning plane," substantially parallel to a portion of the surface such that the surface portion is scanned, the microscope further comprising:
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a) means for oscillating the probe tip relative to the surface, the direction of the oscillations lying substantially within the scanning plane; b) a position-sensitive photodetector capable of producing an output signal; c) means for optically imaging the probe tip onto the position-sensitive photodetector such that at least some changes in the oscillation of the probe will cause changes in the output signal; d) means for deriving a feedback signal from the output signal; and e) means for controlling the distance between the first end and the sample surface such that the feedback signal is maintained substantially constant while the first end is being displaced in a raster pattern.
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15. A method for manufacturing an article, comprising the steps of:
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a) providing a multiplicity of semiconductor bodies, each semiconductor body having a surface to be patterned; b) setting at least one process parameter; c) processing at least a first semiconductor body according to the process parameter such that a pattern is formed on the surface of the semiconductor body, the pattern having a characteristic dimension; d) measuring the characteristic dimension in the first semiconductor body; e) comparing the characteristic dimension to a predetermined range of values; f) if the characteristic dimension lies outside the predetermined range of values, changing the process parameter to bring the characteristic dimension within the predetermined range of values; g) after (f), processing at least a second semiconductor body according to the process parameter; and h) performing, on at least the second semiconductor body, at least one additional step toward completion of the article, characterized in that the measuring step comprises situating, adjacent a portion of the surface, a probe having a tip;
displacing the probe tip relative to the surface such that a scan pattern is described in a plane, to be referred to as the "scanning plane", which lies substantially parallel to the surface portion;
oscillating the probe tip, relative to the surface, such that the oscillations lie substantially within the scanning plane;
optically imaging the probe tip onto a position-sensitive photodetector which produces an output signal; and
processing the output signal such that changes in the oscillation of the probe tip are detected.
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Specification