Lead-free alloy containing tin, silver and indium
First Claim
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1. A lead-free solder alloy comprising effective amounts of tin, silver and indium, said composition having a solidus temperature between about 167°
- C. and about 212°
C. and a liquidus temperature between about 179°
C. and about 213°
C.
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Abstract
A low melting point solder alloy comprising effective amounts of tin, silver and indium.
95 Citations
13 Claims
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1. A lead-free solder alloy comprising effective amounts of tin, silver and indium, said composition having a solidus temperature between about 167°
- C. and about 212°
C. and a liquidus temperature between about 179°
C. and about 213°
C. - View Dependent Claims (6, 7)
- C. and about 212°
- 2. An alloy comprising about 70% to about 92% by weight tin, about 1% to about 6% by weight silver and from about 4% to about 35% by weight indium.
Specification