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Lead-free alloy containing tin, silver and indium

  • US 5,256,370 A
  • Filed: 05/04/1992
  • Issued: 10/26/1993
  • Est. Priority Date: 05/04/1992
  • Status: Expired due to Term
First Claim
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1. A lead-free solder alloy comprising effective amounts of tin, silver and indium, said composition having a solidus temperature between about 167°

  • C. and about 212°

    C. and a liquidus temperature between about 179°

    C. and about 213°

    C.

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