Multi-layer thin film structure and parallel processing method for fabricating same

• US 5,258,236 A
• Filed: 05/03/1991
• Issued: 11/02/1993
• Est. Priority Date: 05/03/1991
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Purushothaman, Sampath, Furman, Bruce K., Narayan, Chandrasekhar, Deutsch, Alina, Doany, Fuad E., Oprysko, Modest M., Shaw, Jane M., Wilczynski, Janusz S., Arjavalingam, Gnanalingam, Hunt, Donald J., Witman, David F., Renick, Stephen, Ranieri, Vincent
• Primary Examiner(s): Straub, Gary P.
• Assistant Examiner(s): LUND, VALERIE A
• Application Number:
  US07/695,368
• Time in Patent Office: 914 Days
• Field of Search: 428/620, 428/623, 428/632, 428/626, 219/121.65, 219/121.68, 156/344, 156/643
• US Class Current: 428/626
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H05K 3/0011 Working of insulating substrates or insulating layers
• CPC Class Codes: H05K 3/46 Manufacturing multilayer circuits
• CPC Class Codes: Y10T 156/1158 Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
• CPC Class Codes: Y10T 428/12528 Semiconductor component
• CPC Class Codes: Y10T 428/12549 Adjacent to each other
• CPC Class Codes: Y10T 428/12569 Synthetic resin
• CPC Class Codes: Y10T 428/12611 Oxide-containing component

Abstract

A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.

Claims

1. A structure for receiving electromagnetic radiation having a wavelength and an energy, the structure comprising:

a substrate which is transparent to the wavelength of the electromagnetic radiation;

a separation layer disposed on said substrate, said separation layer degrading in response to the energy of the electromagnetic radiation; and

a multi-layer interconnect thin film stack disposed on said separation layer.

2. The structure as defined in claim 1, wherein said separation layer is a polymer.

3. The structure as defined in claim 2, wherein said polymer is polyimide.

4. The structure as defined in claim 1, further comprising a reflecting layer disposed between said separation layer and said stack, said reflecting layer reflecting said radiation.

5. The structure as defined in claim 4, wherein said reflecting layer is a metal layer.

6. A structure for receiving electromagnetic radiation having a wavelength and an energy, the structure comprising:

a substrate which is transparent to the wavelength of the electromagnetic radiation;

a separation layer disposed on said substrate, said separation layer degrading in response to the energy of the electromagnetic radiation;

a multi-layer interconnect thin film stack disposed on said separation layer;

a metal reflecting layer disposed between said separation layer and said stack, said reflecting layer reflecting said radiation; and

a ring attached to a top surface of said stack.

7. The structure as defined in claim 6, wherein said ring is metal.