Package for microwave IC

• US 5,258,646 A
• Filed: 10/22/1991
• Issued: 11/02/1993
• Est. Priority Date: 11/16/1990
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Katoh, Takayuki
• Primary Examiner(s): LaRoche, Eugene R.
• Assistant Examiner(s): Nguyen, Viet Q.
• Application Number:
  US07/780,309
• Time in Patent Office: 742 Days
• Field of Search: 357/74, 357/80, 357/81, 257/678, 257/684, 257/698, 257/728, 257/706, 257/711
• US Class Current: 257/678
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A microwave IC package comprises a base (1) and a plurality of cavities (2a) and (2b) for mounting IC chips (5a) and (5b), the cavities (2a) and (2b) being formed on the base (1). Also provided on the base (1) are terminals (4a), (4b), (8a), (8b) and (8c) which are connected to said IC chips by wire bonding. The cavities (2a) and (2b) are separated from each other by a grounded conductor (3A). Due to the separation, isolation between the input and the output of the IC package is improved.

Claims

1. A microwave IC package, comprising:

a base;

a plurality of cavities provided on said base for mounting a plurality of IC chips in said cavities, wherein said plurality of IC chips are electrically connected to each other so as to form a circuit comprising input and output feedthrough microstriplines connected in series with said electrically connected IC chips;

at least one ground conductor provided on said base for partitioning off said cavities, wherein said ground conductor has a thickness sufficient to electrically and physically shield said IC chips from one another when said IC chips are mounted in said cavities; and

at least one terminal provided in said base and connected to said IC chips.

2. A microwave IC package in accordance with claim 1, wherein said base is made of metal.

3. A microwave IC package in accordance with claim 1, further comprising

a metal ring provided through an insulator on said base and surrounding all the cavities, wherein

said ground conductor and said metal ring are formed together as a single one-piece body.

4. A microwave IC package in accordance with claim 1, wherein

said at least one terminal includes a terminal for input and a terminal for output, and

said cavities are aligned in series between said terminals for input and output.

5. A microwave IC package, comprising:

a base;

a plurality of cavities provided on said base for mounting a plurality of IC chips in said cavities, wherein said plurality of IC chips are electrically connected to each other so as to form a circuit comprising input and output feedthrough microstrip lines connected in series with said electrically connected IC chips;

at least one dielectric layer provided on said base for partitioning off said cavities and having a thickness sufficient to electrically and physically shield said IC chips from one another when said IC chips are mounted in said cavities and having a plurality of throughholes; and

at least one terminal provided on said base and connected to said IC chips.

6. A microwave IC package in accordance with claim 5, further comprising

at least three dielectric layers provided on said base so as to form an uppermost layer, a second uppermost layer and a third uppermost layer, wherein

the uppermost and second uppermost layers of said dielectric layers each have a plurality of openings formed therein, wherein said openings of the uppermost layer and second uppermost layer are aligned with each other;

and

said cavities are formed in said openings.

7. A microwave IC package in accordance with claim 5, wherein

said at least one terminal includes a terminal for input and a terminal for output, and

said cavities are aligned in series between said terminals for input and output.

8. A microwave IC package in accordance with claim 6, wherein said at least one terminal is formed on an exposed portion of the second uppermost dielectric layer of said dielectric layers.