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Package for microwave IC

  • US 5,258,646 A
  • Filed: 10/22/1991
  • Issued: 11/02/1993
  • Est. Priority Date: 11/16/1990
  • Status: Expired due to Fees
First Claim
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1. A microwave IC package, comprising:

  • a base;

    a plurality of cavities provided on said base for mounting a plurality of IC chips in said cavities, wherein said plurality of IC chips are electrically connected to each other so as to form a circuit comprising input and output feedthrough microstriplines connected in series with said electrically connected IC chips;

    at least one ground conductor provided on said base for partitioning off said cavities, wherein said ground conductor has a thickness sufficient to electrically and physically shield said IC chips from one another when said IC chips are mounted in said cavities; and

    at least one terminal provided in said base and connected to said IC chips.

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