Method of manufacturing a thin-film pattern on a substrate

• US 5,259,926 A
• Filed: 09/24/1992
• Issued: 11/09/1993
• Est. Priority Date: 09/24/1991
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Mikami, Yoshiro, Mori, Yuji, Kuwabara, Kazuhiro
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): Picardat, Kevin M.
• Application Number:
  US07/950,286
• Time in Patent Office: 411 Days
• Field of Search: 156/659.1, 156/658, 156/660, 156/654, 427/264
• US Class Current: 216/54
• CPC Class Codes: B29C 2043/025 forming a microstructure, i.e. fine patterning
• CPC Class Codes: B29C 43/003 characterised by the choice of material
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: H01L 21/0274 Photolithographic processes
• CPC Class Codes: H01L 21/0337 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/0508 Flood exposure
• CPC Class Codes: H05K 2203/1189 Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/061 Etching masks
• CPC Class Codes: Y10S 438/942 Masking

Abstract

Disclosed is an improvement in a thin-film pattern manufacturing method which includes the steps of providing a thin film on a substrate, forming a mask having a desired pattern on the thin film, and patterning the thin film by removing an exposed portion of the thin film by etching. According to the improvement, the mask is manufactured by forming a layer of an organic resin on the thin film on the substrate and by forming the organic resin layer in the desired pattern by a mechanical forming member. In another embodiment, the organic resin is directly formed or moulded on the thin film by a forming or moulding member.

Claims

1. A method of manufacturing a thin-film pattern, said method including the steps of providing a thin film on a substrate, forming a mask having a desired pattern on the thin film, and patterning the thin film by removing an exposed portion of the thin film by etching,

wherein said step of forming the mask pattern includes the steps of:

forming a layer of an organic resin on the thin film on the substrate; and

forming the organic resin layer in the desired pattern by pressing against the organic resin layer a forming surface of a forming member, the forming surface having projections and recesses arranged in substantially the same pattern as the mask pattern.

2. A method of manufacturing a thin-film pattern according to claim 1, wherein the forming member is made of a material which passes light therethrough.

3. A method of manufacturing a thin-film pattern according to claim 1, wherein the forming member is made of a material which passes light therethrough, wherein the organic resin is a resin which sets when exposed to light, and wherein after the organic resin layer is formed by the pressing of the forming member, light is illuminated onto the organic resin formed in the desired pattern through the forming member to set the organic resin and thereby make the mask pattern.

4. A method of manufacturing a thin-film pattern according to claim 1, wherein the forming member is made of a material which passes light therethrough, wherein the organic resin is a resin which sets when exposed to light, wherein light-blocking layers are provided on the projections of the forming member, and wherein after the organic resin layer is formed by the pressing of the forming member, light is illuminated onto the organic resin formed in the desired pattern through the forming member to set portions of the organic resin which face the recesses of the forming member and thereby make the mask pattern.

5. A method of manufacturing a thin-film pattern according to claim 1, wherein the forming member has a flat plate-like form, and wherein the forming surface of the forming member has substantially the same dimension and shape as those of the thin film on the substrate.

6. A method of manufacturing a thin-film pattern according to claim 1, wherein the forming member comprises a rotatable cylindrical member having substantially the same axial length as a width of the thin film on the substrate, and wherein a relative movement is caused between the cylindrical forming member and the substrate while the forming member is rotating so as to form the organic resin layer in the desired pattern.

7. A method of manufacturing a thin-film pattern according to claim 6, wherein the organic resin formed in the desired pattern is heated and thereby set to form the mask pattern of the organic resin on the thin film on the substrate.

8. A method of manufacturing a thin-film pattern according to claim 1, wherein said thin film is made of a conductive material.

9. A method of manufacturing a thin-film pattern according to claim 1, wherein said thin film is made of an insulating material.

10. A method of manufacturing a thin-film pattern according to claim 1, wherein said thin film is made of a semiconductor material.

11. A method of manufacturing a thin-film pattern according to claim 1, wherein said organic resin is a resin that sets upon heating, and wherein the method includes the further step of heating the organic resin layer after forming the organic resin layer in the desired pattern, so as to set the organic resin layer formed in the desired pattern.

12. A method of manufacturing a thin-film pattern, said method including the steps of providing a thin film on a substrate, forming a mask having a desired pattern on the thin film, and patterning the thin film by removing an exposed portion of the thin film by etching,

wherein said step of forming the mask pattern includes the steps of:

disposing a cylindrical forming member adjacent the thin film on the substrate, said cylindrical forming member having a peripheral surface which forms a forming surface having projections and recesses arranged in substantially the same pattern as the mask pattern, said cylindrical forming member having substantially the same axial length as a width of the thin film on the substrate;

rotating the thus disposed forming member;

causing a relative movement between the forming member and the substrate on which the thin film is formed; and

supplying an organic resin which is not yet set onto a portion of the thin film on the substrate which is located upstream of the forming member and forming the supplied organic resin by the forming surface of said forming member.

13. A method of manufacturing a thin-film pattern according to claim 12, wherein the formed organic resin is heated and thereby set to form the mask pattern of the organic resin on the thin film on the substrate.

14. A method of manufacturing a thin-film pattern according to claim 13, wherein said forming member is rotated at a fixed position, wherein the substrate with the thin film formed thereon is moved relative to the rotating forming member, and wherein the heating is performed by a heating device disposed downstream of the forming member as viewed in the direction of movement of the substrate.

15. A method of manufacturing a thin-film pattern according to claim 12, wherein the cylindrical forming member rotates but does not slide relative to the substrate on which the thin film is formed.

16. A method of manufacturing a thin-film pattern according to claim 12, wherein the cylindrical forming member is rolled on the substrate.

17. A method of manufacturing a thin-film pattern according to claim 12, wherein the cylindrical forming member rotates at a fixed position, and the substrate is moved.

18. A method of manufacturing a thin-film pattern, said method including the steps of providing a thin film on a substrate, forming a mask having a desired pattern on the thin film, and patterning the thin film by removing an exposed portion of the thin film by etching,

wherein said step of forming the mask pattern includes the steps of:

disposing a cylindrical forming member adjacent the thin film on the substrate, said cylindrical forming member having a peripheral surface which forms a forming surface having projections and recesses arranged in substantially the same pattern as the mask pattern, said cylindrical forming member having substantially the same axial length as a width of the thin film on the substrate;

rotating the thus disposed forming member;

causing a relative movement between the forming member and the substrate on which the thin film is formed;

supplying an organic resin which is not yet set onto the forming surface of said forming member and moulding the supplied organic resin by the forming surface of said forming member; and

transferring the thus moulded organic resin onto the thin film on the substrate.

19. A method of manufacturing a thin-film pattern according to claim 18, wherein the organic resin transferred onto the substrate is heated and thereby set to form the mask pattern of the organic resin on the thin film.

20. A method of manufacturing a thin-film pattern according to claim 19, wherein the forming member is rotated at a fixed position, wherein the substrate with the thin film formed thereon is moved relative to the rotating forming member, and wherein the heating is performed by a heating device disposed downstream of the forming member as viewed in the direction of movement of the substrate.

21. A method of manufacturing a thin-film pattern according to claim 18, wherein the step of moulding the supplied organic resin by the forming surface of the forming member includes wiping the forming surface of the forming member with a wiping member, after supplying the organic resin and prior to transferring the moulded organic resin.

22. A method of forming a mask pattern, comprising the steps of:

forming a layer of an organic resin on a substrate; and

forming the organic resin layer into the mask pattern on the substrate by pressing against the organic resin layer a forming surface of a forming member, the forming surface having projections and recesses arranged in substantially the same pattern as the mask pattern.

23. A method of forming a mask pattern according to claim 22, wherein said forming member is a cylindrical forming member that rotates relative to the substrate so as to form the organic resin layer into the mask pattern.

24. A method of forming a mask pattern according to claim 22, wherein said forming member is made of a material that passes light therethrough, and wherein the organic resin layer is made of a resin that sets upon exposure to the light.

25. A method of forming a mask pattern according to claim 24, wherein a layer of light-blocking material is provided on the projections of the forming member.

26. A method of manufacturing a mask pattern, comprising the steps of:

disposing a forming member adjacent a substate, said forming member having a forming surface with projections and recesses arranged in substantially a same pattern as the mask pattern;

supplying an organic resin which is not yet set onto the forming surface of said forming member and moulding the supplied organic resin by the forming surface of the forming member; and

transferring the thus moulded organic resin onto the substrate.