Microwave heating structure

• US 5,260,537 A
• Filed: 06/17/1991
• Issued: 11/09/1993
• Est. Priority Date: 06/17/1991
• Status: Expired due to Fees

• Current Assignee: Beckett Technologies Corp.
• Original Assignee: Beckett Industries, Inc.
• Inventors: Beckett, D. Gregory
• Primary Examiner(s): Reynolds, Bruce A.
• Assistant Examiner(s): HOANG, TU BA
• Application Number:
  US07/717,884
• Time in Patent Office: 876 Days
• Field of Search: 219/10.55 E, 219/10.55 F, 219/10.55 M, 219/10.55 R, 426/107, 426/113, 426/234, 426/243, 99/DIG. 14
• US Class Current: 219/727
• CPC Class Codes: B65D 2581/344 Geometry or shape factors influencing the microwave heating properties
• CPC Class Codes: B65D 2581/3467 Microwave reactive layer shaped by delamination, demetallizing or embossing
• CPC Class Codes: B65D 2581/3472 Aluminium or compounds thereof
• CPC Class Codes: B65D 2581/3478 Stainless steel
• CPC Class Codes: B65D 2581/3479 Other metallic compounds, e.g. silver, gold, copper, nickel
• CPC Class Codes: B65D 2581/3483 Carbon, carbon black, or graphite
• CPC Class Codes: B65D 2581/3489 Microwave reflector, i.e. microwave shield B65D2581/3487 takes precedence
• CPC Class Codes: B65D 81/3446 specially adapted to be heated by microwaves
• CPC Class Codes: Y10S 99/14 Induction heating

Abstract

The structure includes a layer of flexible electroconductive material normally opaque to microwave radiation and having a plurality of apertures therethrough dimensioned to permit microwave energy to pass through to the interior of the foodstuff and to produce thermal energy at the surface of the foodstuff. Both a microwave shielding effect and a combined microwave energy heating and thermal energy heating effect are obtained, enabling close control of the manner and extent of microwave cooking of the foodstuff to be obtained. The plurality of apertures comprises a first plurality of elongate discrete closed-end apertures and a second plurality of continuous apertures, each of which encloses a discrete rectangular island of the electroconductive material. The layer of flexible electroconductive material is supported by and adhered to a substrate layer of microwave energy transparent material in a multiple layer article of manufacture adapted to be formed into a packaging structure in which a foodstuff may be heated by microwave energy to an edible condition.

Claims

1. A multiple layer article of manufacture, for formation into a packaging structure for heating a foodstuff by microwave energy to an edible condition comprising:

a layer of flexible electroconductive material supported on a substrate layer,

said layer of flexible electroconductive material having a thickness which is normally substantially opaque to microwave radiation and having a plurality of apertures extending wholly through the thickness of said electroconductive material layer and effective to generate thermal energy in said plurality of apertures when said article is exposed to microwave energy and the foodstuff is in contact with or proximate to said plurality of apertures, said plurality of apertures comprising;

a first plurality of elongate discrete closed-end

apertures, and

a second plurality of continuous apertures, each of

which encloses a discrete rectangular island of

said electroconductive material,

said plurality of apertures being sized and arranged in said layer of flexible electroconductive material to generate sufficient thermal energy to effect a desired surface browning of the foodstuff while permitting sufficient microwave energy to penetrate said layer of flexible electroconductive material into the foodstuff to effect a desired degree of heating of the foodstuff, whereby the foodstuff may be provided in an edible condition,

said substrate layer being formed of microwave energy transparent material and being in adhered structural supporting relationship with said flexible layer of electroconductive material to permit a package structure be formed from said article in which the foodstuff is positioned.

3. The article of claim 1 wherein said layer of electroconductive material is aluminum foil having a thickness of from about 1 to about 15 microns.

4. The article of claim 3 wherein said aluminum foil has a thickness of about 3 to about 10 microns.

5. The article of claim 3 wherein each said elongate closed-end aperture has a width of at least about 1 mm and a length of at least about 1.75 cm.

6. The article of claim 5 wherein each said rectangular islands is sized from about 1/4 to about 10 square inches.

7. The article of claim 6 wherein each of said rectangular islands is sized from about 1 to about 8 inches.

8. The article of claim 6 wherein at least some of said plurality of elongate closed-end apertures is formed in said plurality of rectangular islands.

9. The article of claim 8 wherein at least some of said plurality of rectangular islands have more than one of said plurality of closed-end apertures therein.

10. The article of claim 8 wherein said substrate layer is formed of microwave transparent structural stock material.

11. The article of claim 8 wherein said substrate layer is formed of paper or paperboard.

12. The article of claim 11 wherein said substrate layer is provided on one side of the layer of electroconductive material and a polymeric film is provided on the other.

13. The article of claim 11 wherein said substrate layer is provided on both sides of the layer of electroconductive material.

14. The article of claim 9 wherein said layer of electroconductive material is laminated between outer layers of polymeric material.

15. The article of claim 14 wherein at least one of said polymeric material layers is formed of rigid moldable material.

16. The article of claim 1 wherein said substrate layer is a polymeric film layer to which said layer of electroconductive material is adhered by laminating adhesive.

17. The article of claim 16 wherein said plurality of apertures in said layer of electroconductive material is formed therein by selective demetallization.

18. The article of claim 17 wherein said layer of electroconductive material is coated with a layer of detackifying material for said laminating adhesive following said selective demetallization.

19. The article of claim 17 wherein a layer of food release material is provided on food-contacting areas of said polymeric film layer on an opposite side thereof from that to which said electroconductive material is adhered.

20. The article of claim 1 in combination with said foodstuff packaged therein with said plurality of apertures located in thermal energy-generating relationship with said foodstuff.

2. The article of claim wherein said layer of flexible electroconductive material has a thickness of at least about 1 micron.