Process for manufacturing a multilayer integrated circuit interconnection
First Claim
1. A method for producing a multilayer polymer-metal system for interconnection of integrated circuits, compatible with two-dimensional electrical or optical connections, comprising the sequential steps of:
- (a) forming a multilayer interconnection system on a rigid substrate;
(b) forming at least one integrated circuit on said multilayer interconnection system; and
(c) removing said rigid substrate from said multilayer interconnections system, thereby leaving a self-supporting multilayer connection system.
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Abstract
The invention is a method of producing a multilayer polymer-metal system to interconnect integrated circuits which allows two-dimensional electrical and/or optical connections between components, in which a first layer of polymer is deposited on a rigid substrate such that the layer can be separated from the substrate, in which a multilayer interconnection system is then produced on this first layer using industrial methods and in which the rigid substrate is removed after installation and connection of the integrated circuit.
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Citations
11 Claims
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1. A method for producing a multilayer polymer-metal system for interconnection of integrated circuits, compatible with two-dimensional electrical or optical connections, comprising the sequential steps of:
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(a) forming a multilayer interconnection system on a rigid substrate; (b) forming at least one integrated circuit on said multilayer interconnection system; and (c) removing said rigid substrate from said multilayer interconnections system, thereby leaving a self-supporting multilayer connection system. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification