Thermally stabilized light emitting diode structure

• US 5,262,658 A
• Filed: 12/24/1991
• Issued: 11/16/1993
• Est. Priority Date: 12/24/1991
• Status: Expired due to Term

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Jankowski, Henry P.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): Tran, Minh Loan
• Application Number:
  US07/813,174
• Time in Patent Office: 693 Days
• Field of Search: 257/88, 257/94, 257/717, 257/467, 372/34, 372/36, 372/45, 372/46, 372/50
• US Class Current: 257/88
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

A light emitting diode structure is thermally stabilized by passing current through heater elements along the sides of the light emitting diode. A heater element is adjacent to and corresponding to each light emitting diode. The heater elements may be a resistive region or a p-n junction. The heater elements may be adjacent along one side of the light emitting diodes or on alternating sides of the individual light emitting diodes. The heater elements may be a single heater strip adjacent and along the length of the array of the light emitting diodes.

Claims

1. A thermally stabilized light emitting diode array structure comprising:

an array of a plurality of light emitting diodes, on a single substrate,

plurality of heater elements, corresponding and adjacent to each of said light emitting diodes when said light emitting diodes are not emitting light such that heat generated from said adjacent heater elements is used to maintain a constant temperature within said light emitting diodes.

2. The thermally stabilized light emitting diode array structure of claim 1 wherein said heater elements are resistive regions.

3. The thermally stabilized light emitting diode array structure of claim 1 wherein said heater elements are p-n junctions.

4. The thermally stabilized light emitting diode array structure of claim 1 wherein adjacent heater elements alternate on opposite sides of said array of a plurality of light emitting diodes.

5. The thermally stabilized light emitting diode array structure of claim 1 wherein said heater elements are on a separate substrate in thermal contact with said array of a plurality of light emitting diodes on a single substrate.

6. A thermally stabilized light emitting diode array structure comprising:

an array of a plurality of light emitting diodes on a single substrate,

a heater strip adjacent to each of said light emitting diodes when said light emitting diodes are not emitting light such that heat generated from said adjacent heater strip is used to maintain a constant temperature within said light emitting diodes.

7. The thermally stabilized light emitting diode array structure of claim 6 wherein said heater strip is a resistive region.

8. The thermally stabilized light emitting diode array structure of claim 6 wherein said heater strip is a p-n junction.

9. The thermally stabilized light emitting diode array structure of claim 6 wherein said heater strip is on a separate substrate in thermal contact with said array of a plurality of light emitting diodes on a single substrate.