Method of making a flexible printed circuit sensor assembly for detecting optical pulses

• US 5,263,244 A
• Filed: 04/17/1992
• Issued: 11/23/1993
• Est. Priority Date: 04/17/1992
• Status: Expired due to Fees

• Current Assignee: Gould Electronics Incorporated (Eternal Materials Co., Ltd.)
• Original Assignee: Gould, Inc. (Transdigm Group Incorporated)
• Inventors: Centa, John A., Halasz, Laszlo
• Primary Examiner(s): ECHOLS, PERCY W
• Application Number:
  US07/870,247
• Time in Patent Office: 585 Days
• Field of Search: 29/832, 29/846, 29/847, 128/637
• US Class Current: 29/832
• CPC Class Codes: A61B 5/02427 Details of sensor
• CPC Class Codes: A61B 5/02433 for infrared radiation
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/053 Tails
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A flexible sensor assembly for detecting optical pulses in which said sensor assembly comprises a flexible printed circuit having mounted thereon at least one light emitting diode and at least one photoelectric detector connected to different circuit patterns with an insulative tape secured over the circuit and components and wherein the flexible sensor is adapted to be folded so that the photoelectric detector can be spaced from and disposed over the light emitting diode.

Claims

1. A method for producing flexible sensor assemblies for use in detecting optical pulses comprising the steps:

(a) forming onto a copper coated flexible sheet a layer design comprising a plurality of circuits in which each circuit comprises a first pair of spaced apart strips extending at one end to provide a first set of terminals and at the other end to provide a second set of terminals, and a second pair of spaced apart strips extending at one to provide a first set of terminals and at the other end to provide a second set of terminals;

(b) etching and removing the exposed copper on the copper coated flexible substrate that is not covered by said layer design and then removing said layer design leaving a plurality of copper circuits;

(c) securing at least one photodetector component across the first set of terminals of the first pair of spaced apart copper strips of each circuit in which one terminal of the photodetector is secured directly to one strip of the first set of terminals and a conductive clip is secured at one end to the other strip and the opposite end of the strip being secured to the other terminal of the photodetector to provide both physical and electrical securement to the terminals; and

securing at least one light emitting diode component across the first set of terminals of the second paid of spaced apart copper strips of each circuit;

(d) securing a layer of non-conductive adhesive tape across the plurality of circuits and components at least up to the second set of terminals of each circuit; and

(e) cutting each circuit with its mounted components from the sheet to provide a single flexible sensor that can be folded so that the photodetector component can be spaced from and disposed over the light emitting diode component.

2. The method of claim 1 wherein in step (c) only one photodetector component is secured across the first set of terminals of the first pair of spaced apart copper strips.

3. The method of claim 1 wherein in step (c) two light emitting diodes are secured across the first set of terminals of the second pair of spaced apart copper strips and said light emitting diodes are mounted in parallel.

4. The method of claim 1 wherein in step (a) said flexible sheet is a polyester or polyamide sheet.

5. The method of claim 1 wherein in step (d) said non-conductive tape is polytetrafluoroethylene tape.

6. The method of claim 1 wherein in step (c) the photodetector and diode are secured to the terminals using conductive epoxy which is then heat cured.

7. The method of claim 1 wherein after step (e) the following step is added:

(f) securing a single flexible sensor within a finger pouch having a first wall spaced apart from a second wall to define an opening to accommodate a finger and arranging said single flexible sensor so that the photodetector is spaced apart from and disposed over the light emitting diode.

8. The method of claim 7 wherein in step (c) two light emitting diodes are secured across the first set of terminals of the second pair of spaced apart copper strips and said light emitting diodes are mounted in parallel.

9. The method of claim 8 wherein in step (a) the flexible sheet is a polyester or polyamide sheet.

10. The method of claim 9 wherein in step (c) the non-conductive tape is polytetrafluoroethylene.