Adhesion of metal coatings of polypyromellitimides

• US 5,264,248 A
• Filed: 08/03/1992
• Issued: 11/23/1993
• Est. Priority Date: 08/03/1992
• Status: Expired due to Fees

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Karas, Bradley R., Chao, Herbert S.
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): DANG, VI
• Application Number:
  US07/923,669
• Time in Patent Office: 477 Days
• Field of Search: 427/304, 427/306, 427/124, 427/250, 427/248.1
• US Class Current: 427/250
• CPC Class Codes: C23C 14/02 Pretreatment of the material to be coated C23C14/04 takes precedence
• CPC Class Codes: C23C 14/20 on organic substrates
• CPC Class Codes: C23C 18/22 Roughening, e.g. by etching
• CPC Class Codes: H05K 3/381 by special treatment of the substrate

Abstract

The adhesion of metal coatings, such as those produced by electroless or physical vapor deposition, on polypyromellitimide surfaces is improved by prior treatment of the surface with concentrated sulfuric acid, followed by aqueous alkali metal hydroxide of at least about 2M concentration. Further metal may be deposited on the surface, for example by electrolytic or physical vapor deposition, following the original metal deposition.

Claims

1. A method for improving adhesion of a metal layer to the surface of a non-fluorinated polypyromellitimide which consists essentially of contacting said surface first with a material consisting essentially of aqueous sulfuric acid of at least about 90% concentration by weight for at least about 20 seconds, and then with a material consisting essentially of an aqueous alkali metal hydroxide solution of at least about 2 M concentration for at least about 20 seconds with optional rinsing with water after each contact and subsequently depositing said metal layer on said surface.

2. A method according to claim 1 wherein said metal layer is deposited by electroless deposition or physical vapor deposition.

3. A method according to claim 2 wherein said surface is cleaned prior to said contact with sulfuric acid.

4. A method according to claim 3 wherein the sulfuric acid has a concentration of at least about 95%.

5. A method according to claim 3 wherein the temperature of sulfuric acid contact is in the range of about 20°

-40°

C.

6. A method according to claim 4 wherein the sulfuric acid contact time is in the range of about 30-60 seconds.

7. A method according to claim 6 wherein the alkali metal hydroxide solution has a concentration of about 5-6M.

8. A method according to claim 7 wherein the alkali metal in the alkali metal hydroxide solution is sodium or potassium.

9. A method according to claim 7 wherein the temperature of alkali metal hydroxide contact is in the range of about 20°

-40°

C.

10. A method according to claim 7 wherein the alkali metal hydroxide contact time is from about 30 seconds to about 5 minutes.

11. A method according to claim 3 wherein the polypyromellitimide is the polymerization product of pyromellitic dianhydride and at least one non-fluorinated aromatic diamine.

12. A method according to claim 11 wherein the aromatic diamine is 4-aminophenyl ether.

13. A method according to claim 3 wherein the metal is copper and is deposited by physical vapor deposition.

14. A method according to claim 3 wherein the metal is copper or nickel and is deposited by electroless deposition.

15. A method according to claim 3 wherein a further metal coating is deposited on the substrate after the initial metal deposition.