Light source and technique for mounting light emitting diodes
First Claim
1. A method for mounting light emitting diode dice on a substrate comprising the steps of:
- temporarily attaching the dice to adhesive on a flexible tape in a column extending along the tape;
bending the tape for successively tilting each die relative to a successive die in the column;
removing a tilted die from the adhesive; and
advancing the removed die toward the substrate.
8 Assignments
0 Petitions
Accused Products
Abstract
A light emitting diode has both end faces metallized and is mounted on a substrate with the light emitting junction perpendicular to the substrate. The electrically conductive ends are electrically bonded to conductive areas on the substrate by solder or conductive adhesive LED dice can be placed on the substrate by temporarily attaching the dice to a tape which has been wrapped around a knife edge. The dice tilt as the tape wraps around the edge and are picked off one at a time by a vacuum collet while temporarily supported by a movable finger, and then transferred by the vacuum collet to a substrate. A similar method may be used for placing semiconductor dice on a substrate without the tilting of dice around the edge. In another embodiment, an array of LEDs can be assembled in windows through a metallized plastic tape which is bonded to a foundation with additional metallized leads.
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Citations
20 Claims
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1. A method for mounting light emitting diode dice on a substrate comprising the steps of:
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temporarily attaching the dice to adhesive on a flexible tape in a column extending along the tape; bending the tape for successively tilting each die relative to a successive die in the column; removing a tilted die from the adhesive; and advancing the removed die toward the substrate. - View Dependent Claims (2, 3, 4)
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5. A method for mounting light emitting diode dice on a substrate comprising the steps of:
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temporarily attaching the dice to adhesive on a flexible tape in a column extending along the tape; passing the tape around an edge which bends the tape and successively tilts each die relative to a successive die in the column; engaging a side face of a tilted die with a vacuum collet for supporting the die and removing it from the adhesive; and advancing the die toward the substrate by means of the vacuum collet. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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12. A method for mounting semiconductor dice on a substrate comprising the steps of:
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temporarily attaching the dice to adhesive on a flexible tape in a column extending along the tape; bending the tape around an edge adjacent to a location on a substrate where a die is to be placed, for successively bringing each die to the bent edge of the tape; removing a die from the adhesive adjacent to the bent edge of the tape; and advancing the removed die beyond the bent edge of the tape and toward the substrate. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification