Demetallizing procedure

• US 5,266,386 A
• Filed: 01/07/1992
• Issued: 11/30/1993
• Est. Priority Date: 02/14/1991
• Status: Expired due to Fees

• Current Assignee: Beckett Technologies Corp.
• Original Assignee: Beckett Industries, Inc.
• Inventors: Beckett, D. Gregory
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): Jewik, Patrick
• Application Number:
  US07/817,648
• Time in Patent Office: 693 Days
• Field of Search: 428/901, 428/457, 428/458, 428/195, 428/209, 428/332, 428/201, 428/202, 430/417
• US Class Current: 428/209
• CPC Class Codes: B65D 2581/3467 Microwave reactive layer shaped by delamination, demetallizing or embossing
• CPC Class Codes: B65D 2581/3472 Aluminium or compounds thereof
• CPC Class Codes: B65D 81/3446 specially adapted to be heated by microwaves
• CPC Class Codes: C23F 1/02 Local etching
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 3/061 Etching masks
• CPC Class Codes: H05K 3/068 Apparatus for etching printed circuits
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24851 Intermediate layer is discontinuous or differential
• CPC Class Codes: Y10T 428/2486 with outer strippable or release layer
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

Selective demetallization of an etchable metal film supported on a polymeric material or other microwave transparent material, particularly an etchable metal film, particularly aluminum, of thickness at least about 1 micron adhesively joined to a flexible polymeric material substrate, is described. A web of metallized polymeric material has a pattern of etchant-resistant material first applied and then the web is immersed in and passed through a bath of aqueous etchant, particularly hot aqueous sodium hydroxide solution, for a time at least sufficient to completely remove the etchable metal from non-protected areas of the web. The demetallized web is washed and dried.

Claims

1. A novel laminate structure, comprising:

a flexible polymeric substrate layer resistant to aqueous sodium hydroxide solution etchant,

a layer of adhesive coextensive with said substrate resistant to aqueous sodium hydroxide solution etchant,

a layer of an etchable metal comprising aluminum having a thickness of about 1 to about 15 microns overlying said adhesive layer in a pattern,

a layer of aqueous sodium hydroxide solution etchant-resistant material overlying said etchable metal layer in the same pattern as said etchable metal layer, and

a layer of detackifying material overlying said adhesive layer in regions thereof not overlied by said etchable metal layer.

2. The laminate of claim 1 which is formed by:

effecting selective demetallization using an aqueous etchant of a laminate of a continuous layer of said etchable metal of thickness of about 1 to about 15 microns adhesively joined to and coextensive with said flexible polymeric material layer by said adhesive layer to which said pattern of etchant-resistant material has been applied so that said aqueous etchant completely removes metal in said etchable metal layer not protected by said etchant-resistant material, and

subsequently applying said layer of detackifying material to the portion of said adhesive layer exposed by said selective demetallization.

3. The laminate of claim 1 wherein said etchable metal has a thickness of about 3 to about 10 microns.

4. The laminate of claim 3 wherein said etchable metal is aluminum.