Chip electronic device with a resin housing and manufacturing process thereof

• US 5,266,739 A
• Filed: 02/25/1992
• Issued: 11/30/1993
• Est. Priority Date: 02/28/1991
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Yamauchi, Keishiro
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): LEDYNH, BOT L
• Application Number:
  US07/840,926
• Time in Patent Office: 644 Days
• Field of Search: 336/96, 361/303, 361/304, 361/305, 361/306, 361/308, 361/309, 174/52.2, 174/52.3, 174/52.4, 357/72, 357/73, 264/271.1, 264/272.11, 264/272.18, 264/272.19, 264/272.2, 257/787
• US Class Current: 174/540
• CPC Class Codes: H01C 1/14 Terminals or tapping points or electrodes specially adapted for resistors in general H01R; Arrangements of terminals or tapping points or electrodes on resistors
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01G 4/228 Terminals

Abstract

A chip electronic device wherein an electronic element such as an inductor and capacitor, and terminals are covered with a resin housing. Plated lower surfaces and edges of the terminals show on a bottom and sides of a housing respectively. The lower surfaces of the terminals are soldered onto conductive patterns of a printed wiring board, and fillets of solder are formed at the edges of the terminals.

Claims

1. A chip electronic device with a resin housing comprising:

an electronic element;

a terminal which is formed by punching a strip into a specified shape having at least one protruded edge and plated, the terminal being electrically connected with an electrode of the electronic element; and

a resin housing which houses the electronic element and the terminal such that a plated lower surface and a plated edge of the terminal show on a bottom and a side of the housing.

2. A chip electronic device according to claim 1, wherein said at least one protruded edge extends outward from the terminal and is flush with an exterior surface of said resin housing.

3. A manufacturing process of a chip electronic device with a resin housing comprising:

forming a terminal by punching a strip into a specified shape which has a protruded edge;

plating the formed terminal;

mounting an electronic element onto the terminal;

molding a resin into a housing which houses the electronic element and the terminal such that a plated lower surface and a plated edge of the terminal show on a bottom and a side of the housing; and

separating the terminal from the strip.

4. A process according to claim 3, wherein said step of molding further includes a step of:

forming said side of the resin housing flush with said plated edge of the terminal.