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Plasma surface treating method and apparatus

  • US 5,268,056 A
  • Filed: 12/16/1992
  • Issued: 12/07/1993
  • Est. Priority Date: 05/31/1990
  • Status: Expired due to Fees
First Claim
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1. A plasma surface treating apparatus comprising:

  • a rotary electrode capable of supporting a sample to be treated for rotation together therewith;

    a counterelectrode confronting said rotary electrode and having an opening defined therein;

    a direct current source disposed between said rotary electrode and said counterelectrode for applying a voltage; and

    an ion source disposed in face-to-face relationship with said opening in said counterelectrode for forming a pattern on said sample.

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