Pre-stressed laminated lid for electronic circuit package
First Claim
1. A lid for an electronic circuit housing, comprising:
- inner and outer laminated layers shaped as a lid for an electronic circuit housing, said layers being formed from two different materials, joined to each other to inhibit relative sideways slippage between the layers, and bowed outward with respect to said housing so that at their juncture the inner layer is under tensile bending stress and the outer layer is under compressive bending stress, the stresses on said layers resisting loads applied to said outer layer.
1 Assignment
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Accused Products
Abstract
A lid (2) for an electronic circuit housing (4) has inner (24) and outer (22) laminated layers that are formed from two different materials, joined to each other and bowed outward from the housing (4) so that the inner layer (24) is under tensile bending stress at the interface between the layers, and the outer layer (22) is under compressive bending stress at the interface. This forms a pre-stress on the lid that resists external loads, and causes the lid to deflect under loading in a linear, predictable and recoverable fashion. The lid is preferably formed by thermal bonding of two materials having different coefficients of thermal expansion, with the bow forming as the materials cool. In one example two different metals are used, and in another a metal is bonded to a glass-ceramic tape.
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Citations
24 Claims
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1. A lid for an electronic circuit housing, comprising:
inner and outer laminated layers shaped as a lid for an electronic circuit housing, said layers being formed from two different materials, joined to each other to inhibit relative sideways slippage between the layers, and bowed outward with respect to said housing so that at their juncture the inner layer is under tensile bending stress and the outer layer is under compressive bending stress, the stresses on said layers resisting loads applied to said outer layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A package for an electronic circuit, comprising:
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a housing for an electronic circuit, a domed lid covering said housing, said lid comprising a first layer of a first material having an outwardly bowed shape relative to the interior of said housing, and a second layer of a second material that is joined to said first layer and resists inward bending of said first layer. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification