Cooling multi-chip modules using embedded heat pipes

• US 5,268,812 A
• Filed: 10/15/1992
• Issued: 12/07/1993
• Est. Priority Date: 08/26/1991
• Status: Expired due to Term

• Current Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Conte, Alfred S.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/961,153
• Time in Patent Office: 418 Days
• Field of Search: 174/15.2, 174/252, 357/82, 165/80.4, 165/80.5, 165/104.26, 165/104.33, 165/905, 361/382, 361/385, 361/386-389, 361/400, 361/401, 361/403, 257/706, 257/707, 257/714, 257/715
• US Class Current: 361/698
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/56 using liquid coolants F21V29/51 takes precedence
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: H01L 23/3731 Ceramic materials or glass H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings

Abstract

An apparatus is disclosed for cooling a multi-chip module using embedded heat pipes. Semiconductor chips are disposed into the multi-chip module through cavities in the module substrate. The semiconductor chips engage heat pipes embedded within the substrate. The heat pipes conduct heat away from the semiconductor chips through a heat conductive bonding layer.

Claims

1. An apparatus which cools semiconductor chips, comprising:

a substrate having a top face and a bottom face, the substrate having a plurality of cavities receiving the semiconductor chips through the top face of the substrate;

a plurality of heat pipes enclosed within the substrate between the top face and the bottom face of the substrate, the heat pipes each having a top surface directly engaging with the semiconductor chips through the cavities such that heat generated by the semiconductor chips is dissipated in the heat pipes.

2. The apparatus of claim 1, wherein the heat pipes each comprise a hollow casing containing a coolant, an evaporator portion, a condenser portion, and a wick, such that the evaporator portion defines a proximal region of the hollow casing substantially adjacent to the cavities, the condenser portion defines a distal region of the hollow casing away from the evaporator portion, the wick extends a length inside the hollow casing between the evaporator portion and the condenser portion.

3. The apparatus of claim 2, wherein the heat generated by the semiconductor chips evaporates the coolant in the evaporator portion and causes the coolant to flow to the condenser portion, and wherein the coolant in the condenser portion is drawn back into the evaporator portion through the wick according to capillary action.

4. The apparatus of claim 1, wherein the semiconductor chips are bonded to the heat pipes by a compliant, heat-conducting thermoplastic material.

5. The apparatus of claim 1, wherein each of the heat pipes has a pair of sealed ends, and at least one of the sealed ends of each heat pipe is exposed through the substrate.