Thin-film ROM devices and their manufacture

• US 5,272,370 A
• Filed: 06/23/1992
• Issued: 12/21/1993
• Est. Priority Date: 06/26/1991
• Status: Expired due to Fees

• Current Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: French, Ian D.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): SAADAT, MAHSHID D
• Application Number:
  US07/902,636
• Time in Patent Office: 546 Days
• Field of Search: 365/103, 365/105, 365/45, 257/314, 257/353, 257/478, 257/486
• US Class Current: 257/353
• CPC Class Codes: H10B 20/00 Read-only memory [ROM] devices

Abstract

A thin-film ROM device includes an array of open circuit and closed-circuit cells (5 to 8) formed from a stack of thin films (12,21,22,23,11) on a glass or other substrate (10). The semiconductor films (21,22,23) may be of hydrogenated amorphous silicon. At least one of the semiconductor films (21,22,23) is removed from some of the closed-circuit cell areas (5,7,8) before depositing the next film. In this way, at least a second type of thin-film diode (MIM, MIN, MIP) is formed having a different conduction characteristic to that of a first type (NIP), so increasing the information content of the ROM array. A lower semiconductor film (23) can be readily etched away from the lower electrode film (11) by a selective etching treatment in which the electrode film (11) acts as an etch stop. By monitoring emissions during plasma etching, an upper semiconductor film (21 or 22) can be removed from a lower semiconductor film (22 or 23). PN diodes and back-to-back PNP or NPN or PINIP or NIPIN diodes may be formed for some of the closed-circuit cells.

Claims

1. A thin-film ROM device comprising an array of laterally separated open-circuit and closed-circuit cells formed on a substrate, each closed-circuit cell comprising a thin-film diode, the array being formed from a stack of thin films carried on the substrate and including at least lower and upper semiconductor films of different conductivity type and/or conductivity between lower and upper electrode films, characterised in that only some of the closed-circuit cells comprise both the upper and lower semiconductor films to form a first type of thin-film diode, and in that in others of the closed-circuit cells at least one, but not both, of the semiconductor films is absent to form at least a second type thin-film diode having a different conduction characteristic than that of the first type of diode.

2. A device as claimed in claim 1, further characterized in that the lower semiconductor film is absent in one second type of diode, the lower electrode film of which forms a Schottky barrier with the upper semiconductor film in this diode.

3. A device as claimed in claim 2, further characterized in that a further semiconductor film is present between the upper semiconductor film and the upper electrode in at least some of the closed-circuit cells, of the first type of thin film diode and in that both the further semiconductor film and the lower semiconductor film have a high conductivity-determining doping concentration as compared with the upper semiconductor film.

4. A device as claimed in claim 3, further characterized in that the lower and further semiconductor films are of opposite conductivity type and the upper semiconductor film is substantially intrinsic so that some closed-circuit cells comprise PIN diodes and other closed-circuit cells comprise PIM or NIM diodes where M represents a metal-based electrode film forming a Schottky barrier with the substantially intrinsic semiconductor film.

5. A device as claimed in claim 1, further characterized in that the upper semiconductor film is an alloy of a semiconductor element with another element which provides the film with semi-insulating conductive properties, and in that the lower semiconductor film is absent in one second type of diode which has a MIM structure comprising the semi-insulating upper semiconductor film (represented by I) between metal-based upper and lower electrode films.

6. A device as claimed in claim 1, further characterized in that the open-circuit cells comprise an insulating layer between the upper electrode film and the semiconductor films.

7. A device as claimed in claim 1 wherein the electrode films are metal based.